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1.发明授权Optoelectronic modules that have shielding to reduce light leakage or stray light, and fabrication methods for such modules 有权具有屏蔽以减少漏光或杂散光的光电模块，以及这些模块的制造方法公开(公告)号：US09094593B2
公开(公告)日：2015-07-28
申请号：US14339623
申请日：2014-07-24
Applicant: Heptagon Micro Optics Pte. Ltd.
Inventor： Hartmut Rudmann , Simon Gubser , Susanne Westenhöfer , Stephan Heimgartner , Jens Geiger , Xu Yi , Thng Chong Kim , John A. Vidallon , Ji Wang , Qi Chuan Yu , Kam Wah Leong
CPC classification number: H01L27/14623 , F21V5/048 , F21Y2115/10 , G02B5/22 , G02B7/02 , G02B13/0085 , H01L24/94 , H01L25/50 , H01L31/0203 , H01L31/0543 , H01L33/486 , H01L33/58 , H01L2924/0002 , H01L2924/12041 , H01L2924/12042 , H01L2924/12043 , H01L2924/12044 , H01L2933/0033 , H04N5/2252 , H04N5/2257 , Y02E10/52 , Y10T29/41 , H01L2924/00
Abstract: Optoelectronic modules include an optoelectronic device and a transparent cover. A non-transparent material is provided on the sidewalls of the transparent cover, which can help reduce light leakage from the sides of the transparent cover or can help reduce stray light from entering the module. The modules can be fabricated, for example, in wafer-level processes. In some implementations, openings such as trenches are formed in a transparent wafer. The trenches then can be filled with a non-transparent material using, for example, a vacuum injection tool. When a wafer-stack including the trench-filled transparent wafer subsequently is separated into individual modules, the result is that each module can include a transparent cover having sidewalls that are covered by the non-transparent material.
Abstract translation: 光电模块包括光电器件和透明盖。 在透明盖的侧壁上设置不透明的材料，这有助于减少透明盖的侧面的光泄漏，或者有助于减少杂散光进入模块。 模块可以例如在晶片级工艺中制造。 在一些实施方案中，诸如沟槽的开口形成在透明晶片中。 然后可以使用例如真空注射工具用不透明材料填充沟槽。 当随后将包括沟槽填充的透明晶片的晶片堆叠分离成单个模块时，结果是每个模块可以包括具有被不透明材料覆盖的侧壁的透明盖。
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2.发明申请OPTOELECTRONIC MODULES THAT HAVE SHIELDING TO REDUCE LIGHT LEAKAGE OR STRAY LIGHT, AND FABRICATION METHODS FOR SUCH MODULES 有权具有遮光以减少光泄漏或光照的光电模块，以及用于这些模块的制造方法公开(公告)号：US20150034975A1
公开(公告)日：2015-02-05
申请号：US14339657
申请日：2014-07-24
Applicant: Heptagon Micro Optics Pte. Ltd.
Inventor： Hartmut Rudmann , Simon Gubser , Susanne Westenhöfer , Stephan Heimgartner , Jens Geiger , Sonja Hanselmann , Christoph Friese , Xu Yi , Thng Chong Kim , John A. Vidallon , Ji Wang , Qi Chuan Yu , Kam Wah Leong
IPC: H01L31/16 , H01L27/146
CPC classification number: H01L27/14685 , H01L27/14618 , H01L27/14625 , H01L27/14687 , H01L31/0203 , H01L31/02325 , H01L33/58 , H01L2224/48091 , H01L2924/00014 , H01L2924/12044 , H01L2933/0058 , H01L2924/00
Abstract: Various optoelectronic modules are described that include an optoelectronic device (e.g., a light emitting or light detecting element) and a transparent cover. Non-transparent material is provided on the sidewalls of the transparent cover, which, in some implementations, can help reduce light leakage from the sides of the transparent cover or can help prevent stray light from entering the module. Fabrication techniques for making the modules also are described.
Abstract translation: 描述了包括光电子器件（例如，发光或光检测元件）和透明盖的各种光电模块。 在透明盖的侧壁上设置不透明材料，在一些实施方式中，这可以帮助减少透明盖的侧面的光泄漏，或有助于防止杂散光进入模块。 还描述了制造模块的制造技术。
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公开(公告)号：US10199426B2
公开(公告)日：2019-02-05
申请号：US15828664
申请日：2017-12-01
Applicant: Heptagon Micro Optics Pte. Ltd.
Inventor： Hartmut Rudmann , Simon Gubser , Susanne Westenhöfer , Stephan Heimgartner , Jens Geiger , Sonja Hanselmann , Christoph Friese , Xu Yi , Thng Chong Kim , John A. Vidallon , Ji Wang , Qi Chuan Yu , Kam Wah Leong
IPC: H01L27/146 , H01L31/0203 , H01L31/0232 , H01L33/58
Abstract: Various optoelectronic modules are described that include an optoelectronic device (e.g., a light emitting or light detecting element) and a transparent cover. Non-transparent material is provided on the sidewalls of the transparent cover, which, in some implementations, can help reduce light leakage from the sides of the transparent cover or can help prevent stray light from entering the module. Fabrication techniques for making the modules also are described.
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公开(公告)号：US09899251B2
公开(公告)日：2018-02-20
申请号：US15698991
申请日：2017-09-08
Applicant: Heptagon Micro Optics Pte. Ltd.
Inventor： Hartmut Rudmann , Stephan Heimgartner , John A. Vidallon
IPC: H01L21/68 , H01L21/683 , B32B37/18 , B32B38/18 , B32B37/12
CPC classification number: H01L21/6838 , B32B37/12 , B32B37/18 , B32B38/1858 , B32B2457/00 , B32B2551/00
Abstract: Techniques are described for holding a wafer or wafer sub-stack to facilitate further processing of the wafer of sub-stack. In some implementations, a wafer or wafer sub-stack is held by a vacuum chuck in a manner that can help reduce bending of the wafer or wafer sub-stack.
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5.发明申请公开(公告)号：US20180102394A1
公开(公告)日：2018-04-12
申请号：US15828664
申请日：2017-12-01
Applicant: Heptagon Micro Optics Pte. Ltd.
Inventor： Hartmut Rudmann , Simon Gubser , Susanne Westenhöfer , Stephan Heimgartner , Jens Geiger , Sonja Hanselmann , Christoph Friese , Xu Yi , Thng Chong Kim , John A. Vidallon , Ji Wang , Qi Chuan Yu , Kam Wah Leong
IPC: H01L27/146 , H01L33/58 , H01L31/0203 , H01L31/0232
CPC classification number: H01L27/14685 , H01L27/14618 , H01L27/14625 , H01L27/14687 , H01L31/0203 , H01L31/02325 , H01L33/58 , H01L2224/48091 , H01L2924/00014 , H01L2924/12044 , H01L2933/0058 , H01L2924/00
Abstract: Various optoelectronic modules are described that include an optoelectronic device (e.g., a light emitting or light detecting element) and a transparent cover. Non-transparent material is provided on the sidewalls of the transparent cover, which, in some implementations, can help reduce light leakage from the sides of the transparent cover or can help prevent stray light from entering the module. Fabrication techniques for making the modules also are described.
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Patent Agency Ranking
公开(公告)号：US09793152B2
公开(公告)日：2017-10-17
申请号：US14408890
申请日：2013-06-28
Applicant: Heptagon Micro Optics Pte. Ltd.
Inventor： Hartmut Rudmann , Stephan Heimgartner , John A. Vidallon
IPC: H01L21/68 , H01L21/683 , B32B37/18 , B32B37/12 , B32B38/18
CPC classification number: H01L21/6838 , B32B37/12 , B32B37/18 , B32B38/1858 , B32B2457/00 , B32B2551/00
Abstract: Techniques are described for holding a wafer or wafer sub-stack to facilitate further processing of the wafer of sub-stack. In some implementations, a wafer or wafer sub-stack is held by a vacuum chuck in a manner that can help reduce bending of the wafer or wafer sub-stack.
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7.发明授权Optoelectronic modules that have shielding to reduce light leakage or stray light, and fabrication methods for such modules 有权具有屏蔽以减少漏光或杂散光的光电模块，以及这些模块的制造方法公开(公告)号：US09543354B2
公开(公告)日：2017-01-10
申请号：US14339657
申请日：2014-07-24
Applicant: Heptagon Micro Optics Pte. Ltd.
Inventor： Hartmut Rudmann , Simon Gubser , Susanne Westenhöfer , Stephan Heimgartner , Jens Geiger , Sonja Hanselmann , Christoph Friese , Xu Yi , Thng Chong Kim , John A. Vidallon , Ji Wang , Qi Chuan Yu , Kam Wah Leong
IPC: H01L21/00 , H01L27/146 , H01L31/0203 , H01L31/0232
CPC classification number: H01L27/14685 , H01L27/14618 , H01L27/14625 , H01L27/14687 , H01L31/0203 , H01L31/02325 , H01L33/58 , H01L2224/48091 , H01L2924/00014 , H01L2924/12044 , H01L2933/0058 , H01L2924/00
Abstract: Various optoelectronic modules are described that include an optoelectronic device (e.g., a light emitting or light detecting element) and a transparent cover. Non-transparent material is provided on the sidewalls of the transparent cover, which, in some implementations, can help reduce light leakage from the sides of the transparent cover or can help prevent stray light from entering the module. Fabrication techniques for making the modules also are described.
Abstract translation: 描述了包括光电子器件（例如，发光或光检测元件）和透明盖的各种光电模块。 在透明盖的侧壁上设置不透明材料，在一些实施方式中，这可以帮助减少透明盖的侧面的光泄漏，或有助于防止杂散光进入模块。 还描述了制造模块的制造技术。
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8.发明授权公开(公告)号：US11554563B2
公开(公告)日：2023-01-17
申请号：US16640530
申请日：2018-07-17
Applicant: Heptagon Micro Optics Pte. Ltd.
Inventor： QiChuan Yu , Han Nee Ng , Tobias Senn , John A. Vidallon , Ramon Opeda , Attilio Ferrari , Harmut Rudmann , Martin Schubert
Abstract: The method regards manufacturing devices by replication, wherein each of the devices comprises a device surface. The method comprises producing the devices from a replication material by replication using a replication tool (1), wherein the replication tool (1) comprises a tool material comprising replication sites (4) comprising a replication surface (5) each. Each of the replication surfaces (5) corresponds to a negative of the device surface of a respective one of the devices. The tool material comprises, in addition to the replication sites, one or more mitigating features (7) for reducing asymmetric form errors of the device surfaces. Replication tools (1) and methods for manufacturing these are also described.
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公开(公告)号：US10186540B2
公开(公告)日：2019-01-22
申请号：US14743073
申请日：2015-06-18
Applicant: Heptagon Micro Optics Pte. Ltd.
Inventor： Hartmut Rudmann , Simon Gubser , Susanne Westenhöfer , Stephan Heimgartner , Jens Geiger , Xu Yi , Thng Chong Kim , John A. Vidallon , Ji Wang , Qi Chuan Yu , Kam Wah Leong
IPC: H01L27/146 , H04N5/225 , H01L25/00 , G02B13/00 , G02B5/22 , F21V5/04 , G02B7/02 , H01L31/0203 , H01L33/48 , H01L23/00 , H01L31/054 , H01L33/58 , F21Y115/10
Abstract: Optoelectronic modules include an optoelectronic device and a transparent cover. A non-transparent material is provided on the sidewalls of the transparent cover, which can help reduce light leakage from the sides of the transparent cover or can help reduce stray light from entering the module. The modules can be fabricated, for example, in wafer-level processes. In some implementations, openings such as trenches are formed in a transparent wafer. The trenches then can be filled with a non-transparent material using, for example, a vacuum injection tool. When a wafer-stack including the trench-filled transparent wafer subsequently is separated into individual modules, the result is that each module can include a transparent cover having sidewalls that are covered by the non-transparent material.
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公开(公告)号：US20180005864A1
公开(公告)日：2018-01-04
申请号：US15698991
申请日：2017-09-08
Applicant: Heptagon Micro Optics Pte. Ltd.
Inventor： Hartmut Rudmann , Stephan Heimgartner , John A. Vidallon
IPC: H01L21/683 , B32B37/18 , B32B37/12 , B32B38/18
CPC classification number: H01L21/6838 , B32B37/12 , B32B37/18 , B32B38/1858 , B32B2457/00 , B32B2551/00
Abstract: Techniques are described for holding a wafer or wafer sub-stack to facilitate further processing of the wafer of sub-stack. In some implementations, a wafer or wafer sub-stack is held by a vacuum chuck in a manner that can help reduce bending of the wafer or wafer sub-stack.
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