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公开(公告)号：US10199426B2
公开(公告)日：2019-02-05
申请号：US15828664
申请日：2017-12-01
Applicant: Heptagon Micro Optics Pte. Ltd.
Inventor： Hartmut Rudmann , Simon Gubser , Susanne Westenhöfer , Stephan Heimgartner , Jens Geiger , Sonja Hanselmann , Christoph Friese , Xu Yi , Thng Chong Kim , John A. Vidallon , Ji Wang , Qi Chuan Yu , Kam Wah Leong
IPC: H01L27/146 , H01L31/0203 , H01L31/0232 , H01L33/58
Abstract: Various optoelectronic modules are described that include an optoelectronic device (e.g., a light emitting or light detecting element) and a transparent cover. Non-transparent material is provided on the sidewalls of the transparent cover, which, in some implementations, can help reduce light leakage from the sides of the transparent cover or can help prevent stray light from entering the module. Fabrication techniques for making the modules also are described.
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2.发明申请公开(公告)号：US20180102394A1
公开(公告)日：2018-04-12
申请号：US15828664
申请日：2017-12-01
Applicant: Heptagon Micro Optics Pte. Ltd.
Inventor： Hartmut Rudmann , Simon Gubser , Susanne Westenhöfer , Stephan Heimgartner , Jens Geiger , Sonja Hanselmann , Christoph Friese , Xu Yi , Thng Chong Kim , John A. Vidallon , Ji Wang , Qi Chuan Yu , Kam Wah Leong
IPC: H01L27/146 , H01L33/58 , H01L31/0203 , H01L31/0232
CPC classification number: H01L27/14685 , H01L27/14618 , H01L27/14625 , H01L27/14687 , H01L31/0203 , H01L31/02325 , H01L33/58 , H01L2224/48091 , H01L2924/00014 , H01L2924/12044 , H01L2933/0058 , H01L2924/00
Abstract: Various optoelectronic modules are described that include an optoelectronic device (e.g., a light emitting or light detecting element) and a transparent cover. Non-transparent material is provided on the sidewalls of the transparent cover, which, in some implementations, can help reduce light leakage from the sides of the transparent cover or can help prevent stray light from entering the module. Fabrication techniques for making the modules also are described.
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3.发明授权Optoelectronic modules that have shielding to reduce light leakage or stray light, and fabrication methods for such modules 有权具有屏蔽以减少漏光或杂散光的光电模块，以及这些模块的制造方法公开(公告)号：US09543354B2
公开(公告)日：2017-01-10
申请号：US14339657
申请日：2014-07-24
Applicant: Heptagon Micro Optics Pte. Ltd.
Inventor： Hartmut Rudmann , Simon Gubser , Susanne Westenhöfer , Stephan Heimgartner , Jens Geiger , Sonja Hanselmann , Christoph Friese , Xu Yi , Thng Chong Kim , John A. Vidallon , Ji Wang , Qi Chuan Yu , Kam Wah Leong
IPC: H01L21/00 , H01L27/146 , H01L31/0203 , H01L31/0232
CPC classification number: H01L27/14685 , H01L27/14618 , H01L27/14625 , H01L27/14687 , H01L31/0203 , H01L31/02325 , H01L33/58 , H01L2224/48091 , H01L2924/00014 , H01L2924/12044 , H01L2933/0058 , H01L2924/00
Abstract: Various optoelectronic modules are described that include an optoelectronic device (e.g., a light emitting or light detecting element) and a transparent cover. Non-transparent material is provided on the sidewalls of the transparent cover, which, in some implementations, can help reduce light leakage from the sides of the transparent cover or can help prevent stray light from entering the module. Fabrication techniques for making the modules also are described.
Abstract translation: 描述了包括光电子器件（例如，发光或光检测元件）和透明盖的各种光电模块。 在透明盖的侧壁上设置不透明材料，在一些实施方式中，这可以帮助减少透明盖的侧面的光泄漏，或有助于防止杂散光进入模块。 还描述了制造模块的制造技术。
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公开(公告)号：US09859327B2
公开(公告)日：2018-01-02
申请号：US15367257
申请日：2016-12-02
Applicant: Heptagon Micro Optics Pte. Ltd.
Inventor： Hartmut Rudmann , Simon Gubser , Susanne Westenhöfer , Stephan Heimgartner , Jens Geiger , Sonja Hanselmann , Christoph Friese , Xu Yi , Thng Chong Kim , John A. Vidallon , Ji Wang , Qi Chuan Yu , Kam Wah Leong
IPC: H01L21/00 , H01L27/146 , H01L31/0203 , H01L31/0232 , H01L33/58
CPC classification number: H01L27/14685 , H01L27/14618 , H01L27/14625 , H01L27/14687 , H01L31/0203 , H01L31/02325 , H01L33/58 , H01L2224/48091 , H01L2924/00014 , H01L2924/12044 , H01L2933/0058 , H01L2924/00
Abstract: Various optoelectronic modules are described that include an optoelectronic device (e.g., a light emitting or light detecting element) and a transparent cover. Non-transparent material is provided on the sidewalls of the transparent cover, which, in some implementations, can help reduce light leakage from the sides of the transparent cover or can help prevent stray light from entering the module. Fabrication techniques for making the modules also are described.
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公开(公告)号：US20170084663A1
公开(公告)日：2017-03-23
申请号：US15367257
申请日：2016-12-02
Applicant: Heptagon Micro Optics Pte. Ltd.
Inventor： Hartmut Rudmann , Simon Gubser , Susanne Westenhöfer , Stephan Heimgartner , Jens Geiger , Sonja Hanselmann , Christoph Friese , Xu Yi , Thng Chong Kim , John A. Vidallon , Ji Wang , Qi Chuan Yu , Kam Wah Leong
IPC: H01L27/146 , H01L31/0232 , H01L33/58
CPC classification number: H01L27/14685 , H01L27/14618 , H01L27/14625 , H01L27/14687 , H01L31/0203 , H01L31/02325 , H01L33/58 , H01L2224/48091 , H01L2924/00014 , H01L2924/12044 , H01L2933/0058 , H01L2924/00
Abstract: Various optoelectronic modules are described that include an optoelectronic device (e.g., a light emitting or light detecting element) and a transparent cover. Non-transparent material is provided on the sidewalls of the transparent cover, which, in some implementations, can help reduce light leakage from the sides of the transparent cover or can help prevent stray light from entering the module. Fabrication techniques for making the modules also are described.
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Patent Agency Ranking
6.发明申请OPTOELECTRONIC MODULES THAT HAVE SHIELDING TO REDUCE LIGHT LEAKAGE OR STRAY LIGHT, AND FABRICATION METHODS FOR SUCH MODULES 审中-公开具有遮光以减少光泄漏或光照的光电模块，以及用于这些模块的制造方法公开(公告)号：US20150325613A1
公开(公告)日：2015-11-12
申请号：US14743073
申请日：2015-06-18
Applicant: Heptagon Micro Optics Pte. Ltd.
Inventor： Hartmut Rudmann , Simon Gubser , Susanne Westenhöfer , Stephan Heimgartner , Jens Geiger , Xu Yi , Thng Chong Kim , John A. Vidallon , Ji Wang , Qi Chuan Yu , Kam Wah Leong
IPC: H01L27/146 , G02B7/02 , F21V5/04 , G02B13/00 , G02B5/22
CPC classification number: H01L27/14623 , F21V5/048 , F21Y2115/10 , G02B5/22 , G02B7/02 , G02B13/0085 , H01L24/94 , H01L25/50 , H01L31/0203 , H01L31/0543 , H01L33/486 , H01L33/58 , H01L2924/0002 , H01L2924/12041 , H01L2924/12042 , H01L2924/12043 , H01L2924/12044 , H01L2933/0033 , H04N5/2252 , H04N5/2257 , Y02E10/52 , Y10T29/41 , H01L2924/00
Abstract: Optoelectronic modules include an optoelectronic device and a transparent cover. A non-transparent material is provided on the sidewalls of the transparent cover, which can help reduce light leakage from the sides of the transparent cover or can help reduce stray light from entering the module. The modules can be fabricated, for example, in wafer-level processes. In some implementations, openings such as trenches are formed in a transparent wafer. The trenches then can be filled with a non-transparent material using, for example, a vacuum injection tool. When a wafer-stack including the trench-filled transparent wafer subsequently is separated into individual modules, the result is that each module can include a transparent cover having sidewalls that are covered by the non-transparent material.
Abstract translation: 光电模块包括光电器件和透明盖。 在透明盖的侧壁上设置不透明的材料，这有助于减少透明盖的侧面的光泄漏，或者有助于减少杂散光进入模块。 模块可以例如在晶片级工艺中制造。 在一些实施方案中，诸如沟槽的开口形成在透明晶片中。 然后可以使用例如真空注射工具用不透明材料填充沟槽。 当随后将包括沟槽填充的透明晶片的晶片堆叠分离成单个模块时，结果是每个模块可以包括具有被不透明材料覆盖的侧壁的透明盖。
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公开(公告)号：US20150036046A1
公开(公告)日：2015-02-05
申请号：US14339623
申请日：2014-07-24
Applicant: Heptagon Micro Optics Pte. Ltd.
Inventor： Hartmut Rudmann , Simon Gubser , Susanne Westenhöfer , Stephan Heimgartner , Jens Geiger , Xu Yi , Thng Chong Kim , John A. Vidallon , Ji Wang , Qi Chuan Yu , Kam Wah Leong
CPC classification number: H01L27/14623 , F21V5/048 , F21Y2115/10 , G02B5/22 , G02B7/02 , G02B13/0085 , H01L24/94 , H01L25/50 , H01L31/0203 , H01L31/0543 , H01L33/486 , H01L33/58 , H01L2924/0002 , H01L2924/12041 , H01L2924/12042 , H01L2924/12043 , H01L2924/12044 , H01L2933/0033 , H04N5/2252 , H04N5/2257 , Y02E10/52 , Y10T29/41 , H01L2924/00
Abstract: Optoelectronic modules include an optoelectronic device and a transparent cover. A non-transparent material is provided on the sidewalls of the transparent cover, which can help reduce light leakage from the sides of the transparent cover or can help reduce stray light from entering the module. The modules can be fabricated, for example, in wafer-level processes. In some implementations, openings such as trenches are formed in a transparent wafer. The trenches then can be filled with a non-transparent material using, for example, a vacuum injection tool. When a wafer-stack including the trench-filled transparent wafer subsequently is separated into individual modules, the result is that each module can include a transparent cover having sidewalls that are covered by the non-transparent material.
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公开(公告)号：US10243111B2
公开(公告)日：2019-03-26
申请号：US15631361
申请日：2017-06-23
Applicant: Heptagon Micro Optics Pte. Ltd.
Inventor： Hartmut Rudmann , Qichuan Yu , Simon Gubser , Bojan Tesanovic , Xu Yi , Eunice Ho Hui Ong , Hongyuan Liu , Ji Wang , Edmund Koon Tian Lua , Myo Paing , Jian Tang , Ming Jie Lee
IPC: H01L33/48 , H01L25/16 , H01L31/02 , H01L31/0203 , H01L31/0232 , H01L33/54 , H01L33/58 , H01L33/62
Abstract: The present disclosure describes wafer-level processes for fabricating optoelectronic device subassemblies that can be mounted, for example, to a circuit substrate, such as a flexible cable or printed circuit board, and integrated into optoelectronic modules that include one or more optical subassemblies stacked over the optoelectronic device subassembly. The optoelectronic device subassembly can be mounted onto the circuit substrate using solder reflow technology even if the optical subassemblies are composed of materials that are not reflow compatible.
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9.发明授权Optoelectronic modules that have shielding to reduce light leakage or stray light, and fabrication methods for such modules 有权具有屏蔽以减少漏光或杂散光的光电模块，以及这些模块的制造方法公开(公告)号：US09094593B2
公开(公告)日：2015-07-28
申请号：US14339623
申请日：2014-07-24
Applicant: Heptagon Micro Optics Pte. Ltd.
Inventor： Hartmut Rudmann , Simon Gubser , Susanne Westenhöfer , Stephan Heimgartner , Jens Geiger , Xu Yi , Thng Chong Kim , John A. Vidallon , Ji Wang , Qi Chuan Yu , Kam Wah Leong
CPC classification number: H01L27/14623 , F21V5/048 , F21Y2115/10 , G02B5/22 , G02B7/02 , G02B13/0085 , H01L24/94 , H01L25/50 , H01L31/0203 , H01L31/0543 , H01L33/486 , H01L33/58 , H01L2924/0002 , H01L2924/12041 , H01L2924/12042 , H01L2924/12043 , H01L2924/12044 , H01L2933/0033 , H04N5/2252 , H04N5/2257 , Y02E10/52 , Y10T29/41 , H01L2924/00
Abstract: Optoelectronic modules include an optoelectronic device and a transparent cover. A non-transparent material is provided on the sidewalls of the transparent cover, which can help reduce light leakage from the sides of the transparent cover or can help reduce stray light from entering the module. The modules can be fabricated, for example, in wafer-level processes. In some implementations, openings such as trenches are formed in a transparent wafer. The trenches then can be filled with a non-transparent material using, for example, a vacuum injection tool. When a wafer-stack including the trench-filled transparent wafer subsequently is separated into individual modules, the result is that each module can include a transparent cover having sidewalls that are covered by the non-transparent material.
Abstract translation: 光电模块包括光电器件和透明盖。 在透明盖的侧壁上设置不透明的材料，这有助于减少透明盖的侧面的光泄漏，或者有助于减少杂散光进入模块。 模块可以例如在晶片级工艺中制造。 在一些实施方案中，诸如沟槽的开口形成在透明晶片中。 然后可以使用例如真空注射工具用不透明材料填充沟槽。 当随后将包括沟槽填充的透明晶片的晶片堆叠分离成单个模块时，结果是每个模块可以包括具有被不透明材料覆盖的侧壁的透明盖。
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10.发明申请OPTOELECTRONIC MODULES THAT HAVE SHIELDING TO REDUCE LIGHT LEAKAGE OR STRAY LIGHT, AND FABRICATION METHODS FOR SUCH MODULES 有权具有遮光以减少光泄漏或光照的光电模块，以及用于这些模块的制造方法公开(公告)号：US20150034975A1
公开(公告)日：2015-02-05
申请号：US14339657
申请日：2014-07-24
Applicant: Heptagon Micro Optics Pte. Ltd.
Inventor： Hartmut Rudmann , Simon Gubser , Susanne Westenhöfer , Stephan Heimgartner , Jens Geiger , Sonja Hanselmann , Christoph Friese , Xu Yi , Thng Chong Kim , John A. Vidallon , Ji Wang , Qi Chuan Yu , Kam Wah Leong
IPC: H01L31/16 , H01L27/146
CPC classification number: H01L27/14685 , H01L27/14618 , H01L27/14625 , H01L27/14687 , H01L31/0203 , H01L31/02325 , H01L33/58 , H01L2224/48091 , H01L2924/00014 , H01L2924/12044 , H01L2933/0058 , H01L2924/00
Abstract: Various optoelectronic modules are described that include an optoelectronic device (e.g., a light emitting or light detecting element) and a transparent cover. Non-transparent material is provided on the sidewalls of the transparent cover, which, in some implementations, can help reduce light leakage from the sides of the transparent cover or can help prevent stray light from entering the module. Fabrication techniques for making the modules also are described.
Abstract translation: 描述了包括光电子器件（例如，发光或光检测元件）和透明盖的各种光电模块。 在透明盖的侧壁上设置不透明材料，在一些实施方式中，这可以帮助减少透明盖的侧面的光泄漏，或有助于防止杂散光进入模块。 还描述了制造模块的制造技术。
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