公开(公告)号：US20170047362A1

公开(公告)日：2017-02-16

申请号：US15232932

申请日：2016-08-10

Applicant: Heptagon Micro Optics Pte. Ltd.

Inventor： Jukka Alasirniö

IPC: H01L27/146

CPC classification number: H01L27/1463 ,  H01L27/14618 ,  H01L27/14621 ,  H01L27/14625 ,  H01L27/14643 ,  H01L27/14806 ,  H01L31/02325 ,  H04N5/2254 ,  H04N5/2257

Abstract: The disclosure describes customizable optoelectronic modules and methods for standardizing a plurality of the customizable optoelectronic modules. The customizable optoelectronic modules can be configured to mitigate dimensional variations and misalignments in a number of their respective constituent components such as optical assemblies and sensor covers. The customizable optoelectronic modules and methods for standardizing a plurality of the customizable optoelectronic modules can obviate the need for binning during manufacturing thereby saving considerable resources such as time and expense.

Abstract translation: 本公开描述了可定制的光电子模块和用于标准化多个可定制的光电子模块的方法。 可定制的光电子模块可以被配置为减轻其各自的组成部件（例如光学组件和传感器盖）中的多个尺寸变化和不对准。 用于标准化多个可定制的光电子模块的可定制的光电子模块和方法可以避免在制造过程中对合并的需要，从而节省诸如时间和费用之类的大量资源。

公开(公告)号：US20180240824A1

公开(公告)日：2018-08-23

申请号：US15958494

申请日：2018-04-20

Applicant: Heptagon Micro Optics Pte. Ltd.

Inventor： Jukka Alasirniö

IPC: H01L27/146 ,  H01L31/0232 ,  H04N5/225 ,  H01L27/148

CPC classification number: H01L27/1463 ,  H01L27/14618 ,  H01L27/14621 ,  H01L27/14625 ,  H01L27/14643 ,  H01L27/14806 ,  H01L31/02325 ,  H04N5/2254 ,  H04N5/2257

Abstract: The disclosure describes customizable optoelectronic modules and methods for standardizing a plurality of the customizable optoelectronic modules. The customizable optoelectronic modules can be configured to mitigate dimensional variations and misalignments in a number of their respective constituent components such as optical assemblies and sensor covers. The customizable optoelectronic modules and methods for standardizing a plurality of the customizable optoelectronic modules can obviate the need for binning during manufacturing thereby saving considerable resources such as time and expense.

公开(公告)号：US09977153B2

公开(公告)日：2018-05-22

申请号：US15116599

申请日：2015-02-02

Applicant: Heptagon Micro Optics Pte. Ltd.

Inventor： Hartmut Rudmann ,  Markus Rossi ,  Mario Cesana ,  Ohad Meitav ,  Peter Roentgen ,  Jukka Alasirniö ,  Stephan Heimgartner ,  Kai Engelhardt

IPC: G02B27/10 ,  G02B3/00 ,  G02B7/00 ,  G02B7/02 ,  G02B27/09

CPC classification number: G02B3/0062 ,  G02B7/003 ,  G02B7/021 ,  G02B7/022 ,  G02B27/0961

Abstract: Various stacks of arrays of beam shaping elements are described. Each array of beam shaping elements can be formed, for example, as part of a monolithic piece that includes a body portion as well as the beam shaping elements. In some implementations, the monolithic pieces may be formed, for example, as integrally formed molded pieces. The monolithic pieces can include one or more features to facilitate stacking, aligning and/or centering of the arrays with respect to one another.

公开(公告)号：US20180138222A1

公开(公告)日：2018-05-17

申请号：US15850003

申请日：2017-12-21

Applicant: Heptagon Micro Optics Pte. Ltd.

Inventor： Hartmut Rudmann ,  Jukka Alasirniö ,  Bojan Tesanovic ,  Tobias Senn ,  Devanraj Kupusamy ,  Alexander Bietsch

IPC: H01L27/146 ,  H04N5/225 ,  H01L23/00

CPC classification number: H01L27/14618 ,  H01L24/48 ,  H01L27/1462 ,  H01L27/14625 ,  H01L27/14632 ,  H01L27/14685 ,  H01L27/14687 ,  H01L2224/48091 ,  H01L2224/48225 ,  H01L2924/00014 ,  H01L2924/181 ,  H04N5/2253 ,  H04N5/2254 ,  H04N5/2257 ,  H04N5/2258 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/85399

Abstract: Optical modules are made using customizable spacers to reduce variations in the focal lengths of the optical channels, to reduce the occurrence of tilt of the optical channels, and/or prevent adhesive from migrating to active portions of an image sensor.

公开(公告)号：US20170135617A1

公开(公告)日：2017-05-18

申请号：US15325811

申请日：2015-07-13

Applicant: Heptagon Micro Optics Pte. Ltd.

Inventor： Jukka Alasirniö ,  Tobias Senn ,  Mario Cesana ,  Hartmut Rudmann ,  Markus Rossi ,  Peter Roentgen ,  Daniel Pérez Calero ,  Bassam Hallal ,  Jens Geiger

IPC: A61B5/1455 ,  A61B5/024 ,  G01J1/42 ,  G01S17/48 ,  G01S7/497

CPC classification number: A61B5/14551 ,  A61B5/02416 ,  A61B5/02433 ,  A61B5/14552 ,  G01J1/4204 ,  G01S7/497 ,  G01S17/48 ,  G01S2007/4975

Abstract: The present disclosure describes modules operable to perform optical sensing. The module can be operable to distinguish between signals indicative of reflections from an object or interest and signals indicative of a spurious reflection such as from a smudge (i.e., a blurred or smeared mark) on the host device's cover glass. Signals assigned to reflections from the object of interest can be used to for various purposes, depending on the application (e.g., determining an object's proximity, a person's heart rate or a person's blood oxygen level).

公开(公告)号：US10204945B2

公开(公告)日：2019-02-12

申请号：US15850003

申请日：2017-12-21

Applicant: Heptagon Micro Optics Pte. Ltd.

Inventor： Hartmut Rudmann ,  Jukka Alasirniö ,  Bojan Tesanovic ,  Tobias Senn ,  Devanraj Kupusamy ,  Alexander Bietsch

IPC: H01L21/00 ,  H01L27/146 ,  H01L23/00 ,  H04N5/225

Abstract: Optical modules are made using customizable spacers to reduce variations in the focal lengths of the optical channels, to reduce the occurrence of tilt of the optical channels, and/or prevent adhesive from migrating to active portions of an image sensor.

公开(公告)号：US20180226443A1

公开(公告)日：2018-08-09

申请号：US15750235

申请日：2016-08-04

Applicant: Heptagon Micro Optics Pte. Ltd.

Inventor： Qi Chuan Yu ,  Ji Wang ,  Kyu Won Hwang ,  Jukka Alasirniö

IPC: H01L27/146 ,  G02B13/00 ,  G02B7/02 ,  H05K1/18 ,  H05K3/30 ,  H04N5/225

CPC classification number: H01L27/14618 ,  G02B7/025 ,  G03B3/02 ,  G03B5/06 ,  G03B2205/0092 ,  G03B2217/002 ,  H01L27/14625 ,  H01L27/14634 ,  H01L27/14685 ,  H01L2224/48091 ,  H04N5/2253 ,  H04N5/2254 ,  H04N5/2257 ,  H04N5/2258 ,  H04N9/09 ,  H05K1/181 ,  H05K3/305 ,  H05K2201/10121 ,  H05K2201/10151 ,  H01L2924/00014

Abstract: An optical module comprising: a plurality of active optoelectronic components each one mounted on a respective printed circuit board (PCB), wherein each active optoelectronic component is associated with a respective different optical channel; a plurality of optical assemblies, each one is substantially aligned over a different respective optical channel; and a spacer separating the active optoelectronic components and PCBs from the optical assemblies, wherein the optical assemblies are attached by adhesive directly to an optical assembly-side surface of the spacer. A first active optoelectronic component is separated, by the spacer, from a first optical assembly by a first distance and a second active optoelectronic component is separated, by the spacer, from a second optical assembly by a different second distance. Also contemplated is a method for fabricating an optical module that comprises: modifying a height of one or more extensions on a spacer to adjust for at least one of a focal length or tilt of at least one optical channel.

公开(公告)号：US09887221B2

公开(公告)日：2018-02-06

申请号：US15119182

申请日：2015-02-18

Applicant: Heptagon Micro Optics Pte. Ltd.

Inventor： Hartmut Rudmann ,  Jukka Alasirniö ,  Bojan Tesanovic ,  Tobias Senn ,  Devanraj Kupusamy ,  Alexander Bietsch

IPC: H01L31/0232 ,  H01L27/146 ,  H01L23/00 ,  H04N5/225

CPC classification number: H01L27/14618 ,  H01L24/48 ,  H01L27/1462 ,  H01L27/14625 ,  H01L27/14632 ,  H01L27/14685 ,  H01L27/14687 ,  H01L2224/48091 ,  H01L2224/48225 ,  H01L2924/00014 ,  H01L2924/181 ,  H04N5/2253 ,  H04N5/2254 ,  H04N5/2257 ,  H04N5/2258 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/85399

Abstract: Optical modules are made using customizable spacers to reduce variations in the focal lengths of the optical channels, to reduce the occurrence of tilt of the optical channels, and/or prevent adhesive from migrating to active portions of an image sensor.

公开(公告)号：US20160170166A1

公开(公告)日：2016-06-16

申请号：US14970795

申请日：2015-12-16

Applicant: Heptagon Micro Optics Pte. Ltd.

Inventor： Jukka Alasirniö ,  Tobias Senn ,  Markus Rossi ,  Hartmut Rudmann ,  Ohad Meitav ,  Moshe Doron ,  Kai Engelhardt

IPC: G02B7/00 ,  G02B7/02

CPC classification number: G02B7/003 ,  G02B7/021 ,  G02B7/022

Abstract: Optical assemblies include a stack of optical elements each of which has one or more alignment features. Each alignment feature traces a respective curve along a surface of one of the optical elements. The alignment feature(s) of one optical element fit within the alignment feature(s) of the other. In some cases, the alignment features can help establish more precise lateral alignment of the optical elements.

Abstract translation: 光学组件包括一组光学元件，每个光学元件具有一个或多个对准特征。 每个对准特征沿着一个光学元件的表面跟踪相应的曲线。 一个光学元件的对准特征适合于另一个的对准特征。 在一些情况下，对准特征可以帮助建立光学元件的更精确的侧向对准。

公开(公告)号：US20190088801A1

公开(公告)日：2019-03-21

申请号：US16086868

申请日：2017-03-23

Applicant: Heptagon Micro Optics Pte. Ltd.

Inventor： Martin Lukas Balimann ,  Matthias Gloor ,  Philippe Bouchilloux ,  Jukka Alasirniö ,  Hartmut Rudmann ,  Nicola Spring

IPC: H01L31/0203 ,  H01L31/02 ,  H01L31/024 ,  H01L31/0232 ,  H01L33/48 ,  H01L33/62 ,  H01L33/64 ,  H01L33/58 ,  H01L27/146 ,  H01L51/52 ,  H01S5/022 ,  H01S5/024

CPC classification number: H01L31/0203 ,  H01L27/14618 ,  H01L27/14625 ,  H01L27/14636 ,  H01L27/14685 ,  H01L31/02005 ,  H01L31/02019 ,  H01L31/02325 ,  H01L31/02327 ,  H01L31/024 ,  H01L31/18 ,  H01L33/48 ,  H01L33/483 ,  H01L33/58 ,  H01L33/62 ,  H01L33/647 ,  H01L51/5237 ,  H01L51/5275 ,  H01L51/529 ,  H01L2933/0033 ,  H01L2933/0058 ,  H01L2933/0066 ,  H01L2933/0075 ,  H01S5/02208 ,  H01S5/02236 ,  H01S5/02288 ,  H01S5/02469 ,  H05K1/021 ,  H05K2201/10106 ,  H05K2201/10121 ,  H05K2203/049

Abstract: An optoelectronic module assembly includes an optoelectronic module. The module includes: an active optoelectronic component in or on a mounting substrate, an optical sub-assembly, and a spacer disposed between the mounting substrate and the optical sub-assembly so as to establish a particular distance between the active optoelectronic component and the optical sub-assembly. The optoelectronic module assembly also includes a recessed substrate including first and second surfaces, wherein the second surface is in a plane closer to the optical sub-assembly than is the first surface. The optoelectronic module is mounted on the first surface. The second surface is for mounting other components.