公开(公告)号：US20180204959A1

公开(公告)日：2018-07-19

申请号：US15868081

申请日：2018-01-11

Applicant: Heptagon Micro Optics Pte. Ltd.

Inventor： Ahn Tae Yong ,  Sai Mun Chan ,  Kyu Won Hwang

IPC: H01L31/0203 ,  H01L33/48 ,  H01L33/58 ,  H01L31/0232 ,  H01L31/18 ,  H01L33/00 ,  H01L27/146 ,  H01L27/15

CPC classification number: H01L31/0203 ,  H01L27/14618 ,  H01L27/14625 ,  H01L27/15 ,  H01L31/0232 ,  H01L31/02325 ,  H01L31/18 ,  H01L33/005 ,  H01L33/483 ,  H01L33/58

Abstract: Optoelectronic modules, such as imaging cameras, proximity sensors, range cameras, structured-light/pattern generators, and image projectors, and methods for their manufacture, are disclosed. The optoelectronic modules exhibit particularly small dimensions. The optoelectronic modules include an optical assembly, an intermediate substrate, and a base substrate. The optical assembly includes a flange portion. An adhesive layer between the flange portion and the intermediate substrate, and an additional adhesive layer between the intermediate substrate and the base can be substantially non-transmissive to light and can resist dimensional changes dues to moisture absorption, for example.

公开(公告)号：US20180226443A1

公开(公告)日：2018-08-09

申请号：US15750235

申请日：2016-08-04

Applicant: Heptagon Micro Optics Pte. Ltd.

Inventor： Qi Chuan Yu ,  Ji Wang ,  Kyu Won Hwang ,  Jukka Alasirniö

IPC: H01L27/146 ,  G02B13/00 ,  G02B7/02 ,  H05K1/18 ,  H05K3/30 ,  H04N5/225

CPC classification number: H01L27/14618 ,  G02B7/025 ,  G03B3/02 ,  G03B5/06 ,  G03B2205/0092 ,  G03B2217/002 ,  H01L27/14625 ,  H01L27/14634 ,  H01L27/14685 ,  H01L2224/48091 ,  H04N5/2253 ,  H04N5/2254 ,  H04N5/2257 ,  H04N5/2258 ,  H04N9/09 ,  H05K1/181 ,  H05K3/305 ,  H05K2201/10121 ,  H05K2201/10151 ,  H01L2924/00014

Abstract: An optical module comprising: a plurality of active optoelectronic components each one mounted on a respective printed circuit board (PCB), wherein each active optoelectronic component is associated with a respective different optical channel; a plurality of optical assemblies, each one is substantially aligned over a different respective optical channel; and a spacer separating the active optoelectronic components and PCBs from the optical assemblies, wherein the optical assemblies are attached by adhesive directly to an optical assembly-side surface of the spacer. A first active optoelectronic component is separated, by the spacer, from a first optical assembly by a first distance and a second active optoelectronic component is separated, by the spacer, from a second optical assembly by a different second distance. Also contemplated is a method for fabricating an optical module that comprises: modifying a height of one or more extensions on a spacer to adjust for at least one of a focal length or tilt of at least one optical channel.

公开(公告)号：US20180205857A1

公开(公告)日：2018-07-19

申请号：US15742567

申请日：2016-06-29

Applicant: Heptagon Micro Optics Pte. Ltd.

Inventor： Sai Mun Chan ,  Hartmut Rudmann ,  Tae Yong Ahn ,  Kyu Won Hwang

IPC: H04N5/225 ,  H01L27/146 ,  H01L21/56 ,  H01L23/00 ,  G02B13/00 ,  G02B7/02 ,  G02B7/04 ,  H04N5/232

CPC classification number: H04N5/2257 ,  G02B7/021 ,  G02B7/028 ,  G02B7/04 ,  G02B13/0085 ,  H01L21/561 ,  H01L21/566 ,  H01L24/48 ,  H01L24/85 ,  H01L27/14618 ,  H01L27/14625 ,  H01L27/14636 ,  H01L2224/48091 ,  H01L2224/48225 ,  H01L2224/8592 ,  H01L2224/97 ,  H01L2924/00014 ,  H04N5/2253 ,  H04N5/2254 ,  H04N5/23212 ,  H01L2224/45099

Abstract: Optoelectronic modules include overmolds that support an optical assembly and, in some case, protect wiring providing electrical connections between an image sensor and a printed circuit board (PCB) or other substrate. The disclosure also describes wafer-level fabrication methods for making the modules.

公开(公告)号：US20180136434A1

公开(公告)日：2018-05-17

申请号：US15564255

申请日：2016-04-05

Applicant: Heptagon Micro Optics Pte. Ltd.

Inventor： Jukka Alasirniö ,  Kyu Won Hwang ,  Hartmut Rudmann

IPC: G02B7/09 ,  G03B3/10 ,  H04N5/225 ,  G02B7/02

CPC classification number: G02B7/09 ,  G02B7/023 ,  G03B3/10 ,  G03B17/12 ,  H04N5/2253 ,  H04N5/2254

Abstract: The present disclosure describes image sensor modules that can include auto focus control. The modules also include features that can help reduce or eliminate tilt of the module's optical sub-assembly with respect to the plane of the image sensor. In some instances, the modules include features to facilitate highly precise positioning of the optical sub-assembly, and also can result in modules having a very small z height.

公开(公告)号：US20170351049A1

公开(公告)日：2017-12-07

申请号：US15607885

申请日：2017-05-30

Applicant: Heptagon Micro Optics Pte. Ltd.

Inventor： Ahn Tae Yong ,  Sai Mun Chan ,  Kyu Won Hwang

IPC: G02B7/02 ,  G01J1/44 ,  G01J1/42

Abstract: The present disclosure describes subassemblies and optoelectronic modules in which an optics system, or a spacer laterally surrounding a cover glass, includes a flange which facilitates mechanical attachment of the optics system to the spacer.