公开(公告)号：US20180302990A1

公开(公告)日：2018-10-18

申请号：US15766943

申请日：2016-10-07

Applicant: Heptagon Micro Optics Pte. Ltd.

Inventor： Bojan Tesanovic ,  Simon Gubser ,  Robert Lenart ,  Mario Cesana

IPC: H05K3/00 ,  H05K1/02 ,  H01L27/146 ,  H01L33/48 ,  H01L33/58

Abstract: Molded circuit substrates include a conductive layer surrounded by an insulating sidewall. The insulating sidewall further provides a structural component for an electronic module into which the molded circuit substrate is incorporated. Accordingly, the molded circuit substrates can permit better performance, reduce electronic module thickness, and reduce fabrication costs. Methods for fabricating molded circuit substrates can facilitate precise positioning of insulating sidewalls, insulating partitions, electrical contacts and other components.

公开(公告)号：US20170244490A1

公开(公告)日：2017-08-24

申请号：US15504613

申请日：2015-08-18

Applicant: Heptagon Micro Optics Pte. Ltd.

Inventor： Bassam Hallal ,  Hartmut Rudmann ,  Mario Cesana ,  Nicole Ebentheuer

IPC: H04B10/40 ,  H04B10/112 ,  H04L5/16 ,  H04B10/114 ,  H04M1/737

Abstract: An optoelectronic module includes a transceiver operable to transmit data optically. The transceiver includes a light emitter to emit light from the module, and a light detector to detect light entering the module. The light detector is disposed at a rotationally symmetric position with respect to a central axis of the module. Such modules can help facilitate the exchange of data optically between two devices.

公开(公告)号：US20160154198A1

公开(公告)日：2016-06-02

申请号：US14905391

申请日：2014-07-16

Applicant: HEPTAGON MICRO OPTICS PTE. LTD.

Inventor： Jukka Alasimio Alasimio ,  Hartmut Rudmann ,  Mario Cesana ,  Stephan Heimgartner

IPC: G02B7/02 ,  H04N5/225

CPC classification number: G02B7/021 ,  G02B3/00 ,  G02B7/02 ,  G03B17/02 ,  G03B29/00 ,  H04N5/225 ,  H04N5/2254 ,  H04N5/2257

Abstract: Camera modules include a lens, a lens stack and/or an array of lenses. One or more of the lenses have a non-circular shape, which in some cases can provide greater flexibility in the dimensions of the module and can result in a very small camera module.

Abstract translation: 相机模块包括透镜，透镜组和/或透镜阵列。 一个或多个透镜具有非圆形形状，这在一些情况下可以在模块的尺寸上提供更大的灵活性并且可以导致非常小的相机模块。

公开(公告)号：US20140125849A1

公开(公告)日：2014-05-08

申请号：US14064550

申请日：2013-10-28

Applicant: Heptagon Micro Optics Pte. Ltd.

Inventor： Stephan Heimgartner ,  Ville Kettunen ,  Nicola Spring ,  Alexander Bietsch ,  Mario Cesana ,  Hartmut Rudmann ,  Jukka Alasirnio ,  Robert Lenart

IPC: G02B27/00 ,  H04N5/225

CPC classification number: H01L27/14625 ,  G02B27/0025 ,  H01L27/14627 ,  H01L27/14685 ,  H01L27/14687 ,  H01L31/02162 ,  H01L31/02164 ,  H01L31/02325 ,  H01L31/18 ,  H04N5/2254 ,  Y10T29/49826

Abstract: Fabricating optical devices can include mounting a plurality of singulated lens systems over a substrate, adjusting a thickness of the substrate below at least some of the lens systems to provide respective focal length corrections for the lens systems, and subsequently separating the substrate into a plurality of optical modules, each of which includes one of the lens systems mounted over a portion of the substrate. Adjusting a thickness of the substrate can include, for example, micro-machining the substrate to form respective holes below at least some of the lens systems or adding one or more layers below at least some of the lens systems so as to correct for variations in the focal lengths of the lens systems.

Abstract translation: 制造光学器件可以包括在衬底上安装多个单独的透镜系统，将衬底的厚度调整到至少一些透镜系统的下方，以为透镜系统提供相应的焦距校正，随后将衬底分离成多个 光学模块，每个光学模块包括安装在基板的一部分上的透镜系统之一。 调整衬底的厚度可以包括例如微加工衬底以在透镜系统的至少一些下方形成相应的孔，或者在透镜系统的至少一些之下添加一个或多个层，以便校正透镜系统中的变化 镜头系统的焦距。

公开(公告)号：US09977153B2

公开(公告)日：2018-05-22

申请号：US15116599

申请日：2015-02-02

Applicant: Heptagon Micro Optics Pte. Ltd.

Inventor： Hartmut Rudmann ,  Markus Rossi ,  Mario Cesana ,  Ohad Meitav ,  Peter Roentgen ,  Jukka Alasirniö ,  Stephan Heimgartner ,  Kai Engelhardt

IPC: G02B27/10 ,  G02B3/00 ,  G02B7/00 ,  G02B7/02 ,  G02B27/09

CPC classification number: G02B3/0062 ,  G02B7/003 ,  G02B7/021 ,  G02B7/022 ,  G02B27/0961

Abstract: Various stacks of arrays of beam shaping elements are described. Each array of beam shaping elements can be formed, for example, as part of a monolithic piece that includes a body portion as well as the beam shaping elements. In some implementations, the monolithic pieces may be formed, for example, as integrally formed molded pieces. The monolithic pieces can include one or more features to facilitate stacking, aligning and/or centering of the arrays with respect to one another.

公开(公告)号：US20170207374A1

公开(公告)日：2017-07-20

申请号：US15473935

申请日：2017-03-30

Applicant: Heptagon Micro Optics Pte. Ltd.

Inventor： Simon Gubser ,  Mario Cesana ,  Markus Rossi ,  Hartmut Rudmann

IPC: H01L33/56 ,  H01L33/58 ,  H01L31/0232 ,  H01L31/0203 ,  H01L31/0216 ,  H01L33/44 ,  H01L33/48 ,  H01L33/54

Abstract: Various optoelectronic modules are described and include one or more optoelectronic devices. Each optoelectronic module includes one or more optoelectronic devices. Sidewalls laterally surround each optoelectronic device and can be in direct contact with sides of the optoelectronic device or, in some cases, with an overmold surrounding the optoelectronic device. The sidewalls can be composed, for example, of a vacuum injected material that is non-transparent to light emitted by or detectable by the optoelectronic device. The module also includes a passive optical element. Depending on the implementation, the passive optical element can be on a cover for the module, directly on a top surface of the optoelectronic device, or on an overmold surrounding the optoelectronic device. Methods of fabricating such modules are described as well, and can facilitate manufacturing the modules using wafer-level processes.

公开(公告)号：US20170135617A1

公开(公告)日：2017-05-18

申请号：US15325811

申请日：2015-07-13

Applicant: Heptagon Micro Optics Pte. Ltd.

Inventor： Jukka Alasirniö ,  Tobias Senn ,  Mario Cesana ,  Hartmut Rudmann ,  Markus Rossi ,  Peter Roentgen ,  Daniel Pérez Calero ,  Bassam Hallal ,  Jens Geiger

IPC: A61B5/1455 ,  A61B5/024 ,  G01J1/42 ,  G01S17/48 ,  G01S7/497

CPC classification number: A61B5/14551 ,  A61B5/02416 ,  A61B5/02433 ,  A61B5/14552 ,  G01J1/4204 ,  G01S7/497 ,  G01S17/48 ,  G01S2007/4975

Abstract: The present disclosure describes modules operable to perform optical sensing. The module can be operable to distinguish between signals indicative of reflections from an object or interest and signals indicative of a spurious reflection such as from a smudge (i.e., a blurred or smeared mark) on the host device's cover glass. Signals assigned to reflections from the object of interest can be used to for various purposes, depending on the application (e.g., determining an object's proximity, a person's heart rate or a person's blood oxygen level).

公开(公告)号：US09640709B2

公开(公告)日：2017-05-02

申请号：US14917104

申请日：2014-08-20

Applicant: Heptagon Micro Optics Pte. Ltd.

Inventor： Simon Gubser ,  Mario Cesana ,  Markus Rossi ,  Hartmut Rudmann

IPC: H01L31/18 ,  H01L31/0232 ,  H01L27/146 ,  H01L23/00 ,  H01L31/0203 ,  H01L33/00 ,  H01L33/56 ,  H01L33/58 ,  H01L51/52 ,  H01L51/56 ,  H01S5/00 ,  H01S5/02 ,  H01S5/183

CPC classification number: H01L33/56 ,  H01L24/97 ,  H01L27/14618 ,  H01L27/14625 ,  H01L27/14685 ,  H01L31/0203 ,  H01L31/02164 ,  H01L31/02327 ,  H01L31/186 ,  H01L33/0095 ,  H01L33/44 ,  H01L33/486 ,  H01L33/54 ,  H01L33/58 ,  H01L51/5237 ,  H01L51/5275 ,  H01L51/56 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2933/0025 ,  H01L2933/0033 ,  H01L2933/005 ,  H01L2933/0058 ,  H01S5/005 ,  H01S5/02 ,  H01S5/183 ,  H01L2924/00012 ,  H01L2924/00

Abstract: A wafer-level method of fabricating optoelectronic modules performing a first vacuum injection technique, using a first vacuum injection tool, to surround optoelectronic devices laterally with a transparent overmold region, performing a replication technique to form a respective passive optical element on a top surface of each overmold region, and performing a second vacuum injected technique to form sidewalls laterally surrounding and in contact with sides of each overmold region. The replication technique and the second vacuum injection technique are performed using a combined replication and vacuum injection tool.

公开(公告)号：US08606057B1

公开(公告)日：2013-12-10

申请号：US13685193

申请日：2012-11-26

Applicant: Heptagon Micro Optics Pte. Ltd.

Inventor： Hartmut Rudmann ,  Mario Cesana ,  Jukka Alasirnio ,  Philippe Bouchilloux ,  Susanne Westenhoefer ,  Jens Geiger

IPC: G02B6/12

CPC classification number: H05K3/4697 ,  H01L23/49833 ,  H01L24/97 ,  H01L27/14618 ,  H01L27/14632 ,  H01L31/0203 ,  H01L2224/04026 ,  H01L2224/24227 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/33181 ,  H01L2224/83192 ,  H01L2224/83851 ,  H01L2224/97 ,  H01L2924/12041 ,  H01L2924/12043 ,  H01L2924/12044 ,  H01L2924/15153 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/1579 ,  H05K1/182 ,  H05K1/183 ,  H05K2201/10121 ,  H05K2203/063 ,  H01L2224/83 ,  H01L2924/00

Abstract: Opto-electronic modules include conductive wiring and connections that can facilitate integrating the modules into an external device. Some opto-electronic modules include an opto-electronic stack that includes at least one lens and an opto-electronic element. Conductive paths can extend from the bottom to the top of the module. The conductive paths can include conductive pads on the surface of the opto-electronic element, as well as wiring at least partially embedded in a substrate and walls of a housing for the opto-electronic stack. Conductive connections can be disposed between a top surface of the substrate and the bottom surface of the walls such that the conductive connections electrically connect the second wiring to the first wiring and to the conductive pads on the surface of the opto-electronic element. The modules can be fabricated, for example, in wafer-level processes so that multiple opto-electronic modules can be manufactured at the same time.

Abstract translation: 光电模块包括导电布线和连接，可以方便将模块集成到外部设备中。 一些光电模块包括包括至少一个透镜和光电元件的光电堆叠。 导电路径可以从模块的底部延伸到顶部。 导电路径可以包括在光电子元件的表面上的导电焊盘，以及至少部分地嵌入基板的布线和用于光电叠层的壳体的壁。 导电连接可以设置在基板的顶表面和壁的底表面之间，使得导电连接将第二布线电连接到第一布线和光电元件表面上的导电垫。 模块可以例如在晶片级处理中制造，从而可以同时制造多个光电模块。

公开(公告)号：US20180124327A1

公开(公告)日：2018-05-03

申请号：US15121459

申请日：2015-02-23

Applicant: Heptagon Micro Optics Pte. Ltd.

Inventor： Jukka Alasirnio ,  Tobias Senn ,  Ohad Meitav ,  Moshe Doron ,  Alireza Yasan ,  Mario Cesana ,  Florin Cutu ,  Hartmut Rudmann ,  Markus Rossi ,  Peter Roentgen ,  Daniel Perez Calero ,  Bassam Hallal ,  Jens Geiger

IPC: H04N5/247 ,  H04N5/225 ,  H04N5/33 ,  G02B13/00

Abstract: Image sensor modules include primary high-resolution imagers and secondary imagers. For example, an image sensor module may include a semiconductor chip including photosensitive regions defining, respectively, a primary camera and a secondary camera. The image sensor module may include an optical assembly that does not substantially obstruct the field-of-view of the secondary camera. Some modules include multiple secondary cameras that have a field-of-view at least as large as the field-of-view of the primary camera. Various features are described to facilitate acquisition of signals that can be used to calculate depth information.