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1.发明授权公开(公告)号：US08606057B1
公开(公告)日：2013-12-10
申请号：US13685193
申请日：2012-11-26
Applicant: Heptagon Micro Optics Pte. Ltd.
Inventor： Hartmut Rudmann , Mario Cesana , Jukka Alasirnio , Philippe Bouchilloux , Susanne Westenhoefer , Jens Geiger
IPC: G02B6/12
CPC classification number: H05K3/4697 , H01L23/49833 , H01L24/97 , H01L27/14618 , H01L27/14632 , H01L31/0203 , H01L2224/04026 , H01L2224/24227 , H01L2224/2919 , H01L2224/32225 , H01L2224/33181 , H01L2224/83192 , H01L2224/83851 , H01L2224/97 , H01L2924/12041 , H01L2924/12043 , H01L2924/12044 , H01L2924/15153 , H01L2924/15311 , H01L2924/15787 , H01L2924/1579 , H05K1/182 , H05K1/183 , H05K2201/10121 , H05K2203/063 , H01L2224/83 , H01L2924/00
Abstract: Opto-electronic modules include conductive wiring and connections that can facilitate integrating the modules into an external device. Some opto-electronic modules include an opto-electronic stack that includes at least one lens and an opto-electronic element. Conductive paths can extend from the bottom to the top of the module. The conductive paths can include conductive pads on the surface of the opto-electronic element, as well as wiring at least partially embedded in a substrate and walls of a housing for the opto-electronic stack. Conductive connections can be disposed between a top surface of the substrate and the bottom surface of the walls such that the conductive connections electrically connect the second wiring to the first wiring and to the conductive pads on the surface of the opto-electronic element. The modules can be fabricated, for example, in wafer-level processes so that multiple opto-electronic modules can be manufactured at the same time.
Abstract translation: 光电模块包括导电布线和连接，可以方便将模块集成到外部设备中。 一些光电模块包括包括至少一个透镜和光电元件的光电堆叠。 导电路径可以从模块的底部延伸到顶部。 导电路径可以包括在光电子元件的表面上的导电焊盘，以及至少部分地嵌入基板的布线和用于光电叠层的壳体的壁。 导电连接可以设置在基板的顶表面和壁的底表面之间，使得导电连接将第二布线电连接到第一布线和光电元件表面上的导电垫。 模块可以例如在晶片级处理中制造，从而可以同时制造多个光电模块。
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2.发明申请OPTICAL MODULES INCLUDING FOCAL LENGTH ADJUSTMENT AND FABRICATION OF THE OPTICAL MODULES 有权光学模块包括光学模块的焦距长度调整和制造公开(公告)号：US20140125849A1
公开(公告)日：2014-05-08
申请号：US14064550
申请日：2013-10-28
Applicant: Heptagon Micro Optics Pte. Ltd.
Inventor： Stephan Heimgartner , Ville Kettunen , Nicola Spring , Alexander Bietsch , Mario Cesana , Hartmut Rudmann , Jukka Alasirnio , Robert Lenart
CPC classification number: H01L27/14625 , G02B27/0025 , H01L27/14627 , H01L27/14685 , H01L27/14687 , H01L31/02162 , H01L31/02164 , H01L31/02325 , H01L31/18 , H04N5/2254 , Y10T29/49826
Abstract: Fabricating optical devices can include mounting a plurality of singulated lens systems over a substrate, adjusting a thickness of the substrate below at least some of the lens systems to provide respective focal length corrections for the lens systems, and subsequently separating the substrate into a plurality of optical modules, each of which includes one of the lens systems mounted over a portion of the substrate. Adjusting a thickness of the substrate can include, for example, micro-machining the substrate to form respective holes below at least some of the lens systems or adding one or more layers below at least some of the lens systems so as to correct for variations in the focal lengths of the lens systems.
Abstract translation: 制造光学器件可以包括在衬底上安装多个单独的透镜系统，将衬底的厚度调整到至少一些透镜系统的下方，以为透镜系统提供相应的焦距校正，随后将衬底分离成多个 光学模块，每个光学模块包括安装在基板的一部分上的透镜系统之一。 调整衬底的厚度可以包括例如微加工衬底以在透镜系统的至少一些下方形成相应的孔，或者在透镜系统的至少一些之下添加一个或多个层，以便校正透镜系统中的变化 镜头系统的焦距。
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公开(公告)号：US10101555B2
公开(公告)日：2018-10-16
申请号：US14905391
申请日：2014-07-16
Applicant: Heptagon Micro Optics Pte. Ltd.
Inventor： Jukka Alasirnio , Hartmut Rudmann , Mario Cesana , Stephan Heimgartner
Abstract: Camera modules include a lens, a lens stack and/or an array of lenses. One or more of the lenses have a non-circular shape, which in some cases can provide greater flexibility in the dimensions of the module and can result in a very small camera module.
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Patent Agency Ranking
4.发明授权Optical modules including focal length adjustment and fabrication of the optical modules 有权光学模块包括焦距调整和光学模块的制造公开(公告)号：US09595553B2
公开(公告)日：2017-03-14
申请号：US14064550
申请日：2013-10-28
Applicant: Heptagon Micro Optics Pte. Ltd.
Inventor： Stephan Heimgartner , Ville Kettunen , Nicola Spring , Alexander Bietsch , Mario Cesana , Hartmut Rudmann , Jukka Alasirnio , Robert Lenart
IPC: H04N5/222 , H01L27/146 , G02B27/00 , H04N5/225 , H01L31/18 , H01L31/0216 , H01L31/0232
CPC classification number: H01L27/14625 , G02B27/0025 , H01L27/14627 , H01L27/14685 , H01L27/14687 , H01L31/02162 , H01L31/02164 , H01L31/02325 , H01L31/18 , H04N5/2254 , Y10T29/49826
Abstract: Fabricating optical devices can include mounting a plurality of singulated lens systems over a substrate, adjusting a thickness of the substrate below at least some of the lens systems to provide respective focal length corrections for the lens systems, and subsequently separating the substrate into a plurality of optical modules, each of which includes one of the lens systems mounted over a portion of the substrate. Adjusting a thickness of the substrate can include, for example, micro-machining the substrate to form respective holes below at least some of the lens systems or adding one or more layers below at least some of the lens systems so as to correct for variations in the focal lengths of the lens systems.
Abstract translation: 制造光学器件可以包括在衬底上安装多个单独的透镜系统，将衬底的厚度调整到至少一些透镜系统的下方，以为透镜系统提供相应的焦距校正，随后将衬底分离成多个 光学模块，每个光学模块包括安装在基板的一部分上的透镜系统之一。 调整衬底的厚度可以包括例如微加工衬底以在透镜系统的至少一些下方形成相应的孔，或者在透镜系统的至少一些之下添加一个或多个层，以便校正透镜系统中的变化 镜头系统的焦距。
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公开(公告)号：US20180124327A1
公开(公告)日：2018-05-03
申请号：US15121459
申请日：2015-02-23
Applicant: Heptagon Micro Optics Pte. Ltd.
Inventor： Jukka Alasirnio , Tobias Senn , Ohad Meitav , Moshe Doron , Alireza Yasan , Mario Cesana , Florin Cutu , Hartmut Rudmann , Markus Rossi , Peter Roentgen , Daniel Perez Calero , Bassam Hallal , Jens Geiger
Abstract: Image sensor modules include primary high-resolution imagers and secondary imagers. For example, an image sensor module may include a semiconductor chip including photosensitive regions defining, respectively, a primary camera and a secondary camera. The image sensor module may include an optical assembly that does not substantially obstruct the field-of-view of the secondary camera. Some modules include multiple secondary cameras that have a field-of-view at least as large as the field-of-view of the primary camera. Various features are described to facilitate acquisition of signals that can be used to calculate depth information.
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6.发明申请公开(公告)号：US20170317126A1
公开(公告)日：2017-11-02
申请号：US15651510
申请日：2017-07-17
Applicant: Heptagon Micro Optics Pte. Ltd.
Inventor： Stephan Heimgartner , Ville Kettunen , Nicola Spring , Alexander Bietsch , Mario Cesana , Hartmut Rudmann , Jukka Alasirnio , Robert Lenart
IPC: H01L27/146 , H01L31/18 , H01L31/0232 , G02B27/00 , H01L31/0216 , H04N5/225
CPC classification number: H01L27/14625 , G02B27/0025 , H01L27/14627 , H01L27/14685 , H01L27/14687 , H01L31/02162 , H01L31/02164 , H01L31/02325 , H01L31/18 , H04N5/2254 , Y10T29/49826
Abstract: Fabricating optical devices can include mounting a plurality of singulated lens systems over a substrate, adjusting a thickness of the substrate below at least some of the lens systems to provide respective focal length corrections for the lens systems, and subsequently separating the substrate into a plurality of optical modules, each of which includes one of the lens systems mounted over a portion of the substrate. Adjusting a thickness of the substrate can include, for example, micro-machining the substrate to form respective holes below at least some of the lens systems or adding one or more layers below at least some of the lens systems so as to correct for variations in the focal lengths of the lens systems.
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公开(公告)号：US09748297B2
公开(公告)日：2017-08-29
申请号：US14177552
申请日：2014-02-11
Applicant: Heptagon Micro Optics Pte. Ltd. , Franco Rinaldo
Inventor： Stephan Heimgartner , Ville Kettunen , Nicola Spring , Alexander Bietsch , Mario Cesana , Hartmut Rudmann , Jukka Alasirnio , Robert Lenart
IPC: H04N5/225 , H01L27/146 , G02B27/00 , H01L31/18 , H01L31/0216 , H01L31/0232
CPC classification number: H01L27/14625 , G02B27/0025 , H01L27/14627 , H01L27/14685 , H01L27/14687 , H01L31/02162 , H01L31/02164 , H01L31/02325 , H01L31/18 , H04N5/2254 , Y10T29/49826
Abstract: Fabricating optical devices can include mounting a plurality of singulated lens systems over a substrate, adjusting a thickness of the substrate below at least some of the lens systems to provide respective focal length corrections for the lens systems, and subsequently separating the substrate into a plurality of optical modules, each of which includes one of the lens systems mounted over a portion of the substrate. Adjusting a thickness of the substrate can include, for example, micro-machining the substrate to form respective holes below at least some of the lens systems or adding one or more layers below at least some of the lens systems so as to correct for variations in the focal lengths of the lens systems.
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公开(公告)号：US20140167196A1
公开(公告)日：2014-06-19
申请号：US14177552
申请日：2014-02-11
Applicant: Heptagon Micro Optics Pte. Ltd.
Inventor： Stephan Heimgartner , Ville Kettunen , Nicola Spring , Alexander Bietsch , Mario Cesana , Hartmut Rudmann , Jukka Alasirnio , Robert Lenart
IPC: H01L27/146 , H01L31/18
CPC classification number: H01L27/14625 , G02B27/0025 , H01L27/14627 , H01L27/14685 , H01L27/14687 , H01L31/02162 , H01L31/02164 , H01L31/02325 , H01L31/18 , H04N5/2254 , Y10T29/49826
Abstract: Fabricating optical devices can include mounting a plurality of singulated lens systems over a substrate, adjusting a thickness of the substrate below at least some of the lens systems to provide respective focal length corrections for the lens systems, and subsequently separating the substrate into a plurality of optical modules, each of which includes one of the lens systems mounted over a portion of the substrate. Adjusting a thickness of the substrate can include, for example, micro-machining the substrate to form respective holes below at least some of the lens systems or adding one or more layers below at least some of the lens systems so as to correct for variations in the focal lengths of the lens systems.
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