公开(公告)号：US09595553B2

公开(公告)日：2017-03-14

申请号：US14064550

申请日：2013-10-28

Applicant: Heptagon Micro Optics Pte. Ltd.

Inventor： Stephan Heimgartner ,  Ville Kettunen ,  Nicola Spring ,  Alexander Bietsch ,  Mario Cesana ,  Hartmut Rudmann ,  Jukka Alasirnio ,  Robert Lenart

IPC: H04N5/222 ,  H01L27/146 ,  G02B27/00 ,  H04N5/225 ,  H01L31/18 ,  H01L31/0216 ,  H01L31/0232

CPC classification number: H01L27/14625 ,  G02B27/0025 ,  H01L27/14627 ,  H01L27/14685 ,  H01L27/14687 ,  H01L31/02162 ,  H01L31/02164 ,  H01L31/02325 ,  H01L31/18 ,  H04N5/2254 ,  Y10T29/49826

Abstract: Fabricating optical devices can include mounting a plurality of singulated lens systems over a substrate, adjusting a thickness of the substrate below at least some of the lens systems to provide respective focal length corrections for the lens systems, and subsequently separating the substrate into a plurality of optical modules, each of which includes one of the lens systems mounted over a portion of the substrate. Adjusting a thickness of the substrate can include, for example, micro-machining the substrate to form respective holes below at least some of the lens systems or adding one or more layers below at least some of the lens systems so as to correct for variations in the focal lengths of the lens systems.

Abstract translation: 制造光学器件可以包括在衬底上安装多个单独的透镜系统，将衬底的厚度调整到至少一些透镜系统的下方，以为透镜系统提供相应的焦距校正，随后将衬底分离成多个 光学模块，每个光学模块包括安装在基板的一部分上的透镜系统之一。 调整衬底的厚度可以包括例如微加工衬底以在透镜系统的至少一些下方形成相应的孔，或者在透镜系统的至少一些之下添加一个或多个层，以便校正透镜系统中的变化 镜头系统的焦距。

公开(公告)号：US20140125849A1

公开(公告)日：2014-05-08

申请号：US14064550

申请日：2013-10-28

Applicant: Heptagon Micro Optics Pte. Ltd.

Inventor： Stephan Heimgartner ,  Ville Kettunen ,  Nicola Spring ,  Alexander Bietsch ,  Mario Cesana ,  Hartmut Rudmann ,  Jukka Alasirnio ,  Robert Lenart

IPC: G02B27/00 ,  H04N5/225

CPC classification number: H01L27/14625 ,  G02B27/0025 ,  H01L27/14627 ,  H01L27/14685 ,  H01L27/14687 ,  H01L31/02162 ,  H01L31/02164 ,  H01L31/02325 ,  H01L31/18 ,  H04N5/2254 ,  Y10T29/49826

Abstract: Fabricating optical devices can include mounting a plurality of singulated lens systems over a substrate, adjusting a thickness of the substrate below at least some of the lens systems to provide respective focal length corrections for the lens systems, and subsequently separating the substrate into a plurality of optical modules, each of which includes one of the lens systems mounted over a portion of the substrate. Adjusting a thickness of the substrate can include, for example, micro-machining the substrate to form respective holes below at least some of the lens systems or adding one or more layers below at least some of the lens systems so as to correct for variations in the focal lengths of the lens systems.

Abstract translation: 制造光学器件可以包括在衬底上安装多个单独的透镜系统，将衬底的厚度调整到至少一些透镜系统的下方，以为透镜系统提供相应的焦距校正，随后将衬底分离成多个 光学模块，每个光学模块包括安装在基板的一部分上的透镜系统之一。 调整衬底的厚度可以包括例如微加工衬底以在透镜系统的至少一些下方形成相应的孔，或者在透镜系统的至少一些之下添加一个或多个层，以便校正透镜系统中的变化 镜头系统的焦距。

公开(公告)号：US09000377B2

公开(公告)日：2015-04-07

申请号：US13720645

申请日：2012-12-19

Applicant: Heptagon Micro Optics Pte. Ltd.

Inventor： Markus Rossi ,  Ville Kettunen

IPC: G01S17/02 ,  G01V8/12 ,  G01S7/481 ,  G01J5/08 ,  G01J1/04

CPC classification number: G01V8/12 ,  G01J1/0411 ,  G01J5/08 ,  G01S7/4811 ,  G01S17/026

Abstract: An opto-electronic module includes a detecting channel comprising a detecting member for detecting light and an emission channel comprising an emission member for emitting light generally detectable by said detecting member. Therein, a radiation distribution characteristic for an emission of light from said emission channel is non rotationally symmetric; and/or a sensitivity distribution characteristic for a detection in said detecting channel of light incident on said detection channel is non rotationally symmetric; and/or a central or main emission direction for an emission of light from said emission channel and a central or main detection direction for a detection of light incident on said detection channel are aligned not parallel to each other; and/or at least a first one of the channels comprises one or more passive optical components.

Abstract translation: 光电模块包括检测通道，该检测通道包括用于检测光的检测部件和发射通道，该发射通道包括用于发射由所述检测部件可检测的光的发射部件。 其中，用于从所述发射通道发射光的辐射分布特性是非旋转对称的; 和/或用于在入射到所述检测通道的光的所述检测通道中的检测的灵敏度分布特性是非旋转对称的; 和/或用于发射来自所述发射通道的光的中心或主发射方向以及用于检测入射在所述检测通道上的光的中心或主检测方向彼此不对准; 和/或至少第一个通道包括一个或多个无源光学部件。

公开(公告)号：US08674305B2

公开(公告)日：2014-03-18

申请号：US13926058

申请日：2013-06-25

Applicant: Heptagon Micro Optics Pte. Ltd.

Inventor： Markus Rossi ,  Ville Kettunen

IPC: G01S17/08 ,  G08B13/181

CPC classification number: G01V8/12 ,  G01J1/0411 ,  G01J5/08 ,  G01S7/4811 ,  G01S17/026

Abstract: An opto-electronic module includes a detecting channel comprising a detecting member for detecting light and an emission channel comprising an emission member for emitting light generally detectable by said detecting member. Therein, a radiation distribution characteristic for an emission of light from said emission channel is non rotationally symmetric; and/or a sensitivity distribution characteristic for a detection in said detecting channel of light incident on said detection channel is non rotationally symmetric; and/or a central or main emission direction for an emission of light from said emission channel and a central or main detection direction for a detection of light incident on said detection channel are aligned not parallel to each other; and/or at least a first one of the channels comprises one or more passive optical components.

Abstract translation: 光电模块包括检测通道，该检测通道包括用于检测光的检测部件和发射通道，该发射通道包括用于发射由所述检测部件可检测的光的发射部件。 其中，用于从所述发射通道发射光的辐射分布特性是非旋转对称的; 和/或用于在入射到所述检测通道的光的所述检测通道中的检测的灵敏度分布特性是非旋转对称的; 和/或用于发射来自所述发射通道的光的中心或主发射方向以及用于检测入射在所述检测通道上的光的中心或主检测方向彼此不对准; 和/或至少第一个通道包括一个或多个无源光学部件。

公开(公告)号：US20160006913A1

公开(公告)日：2016-01-07

申请号：US14768989

申请日：2014-02-07

Applicant: HEPTAGON MICRO OPTICS PTE. LTD.

Inventor： Ville Kettunen ,  Markus Rossi

IPC: H04N5/225 ,  H04N5/369 ,  H01L27/146 ,  H04N9/04

CPC classification number: H04N5/2254 ,  H01L27/14618 ,  H01L27/14625 ,  H01L27/14645 ,  H01L27/14685 ,  H01L2924/0002 ,  H04N5/2253 ,  H04N5/2257 ,  H04N5/2258 ,  H04N5/369 ,  H04N9/045 ,  H01L2924/00

Abstract: The optical apparatus comprises a semiconductor substrate and at least one optics substrate. The semiconductor substrate comprises a first active region establishing a first image sensor, said semiconductor substrate further comprising an additional active region, different from said first active region. The additional active region establishes or is part of an additional sensor which is not an image sensor. And the at least one optics substrate comprises for said first image sensor at least one lens element for imaging light impinging on the optical apparatus from a front side onto the first image sensor. Preferably, at least two or rather at least three image sensors are provided, such that a computational camera can be realized. The additional sensor may comprise, e.g., an ambient light sensor and/or a proximity sensor.

Abstract translation: 光学装置包括半导体衬底和至少一个光学衬底。 半导体衬底包括建立第一图像传感器的第一有源区，所述半导体衬底还包括不同于所述第一有源区的附加有源区。 额外的有源区域建立或者是不是图像传感器的附加传感器的一部分。 并且所述至少一个光学基板包括用于所述第一图像传感器的至少一个透镜元件，用于将入射到所述光学设备上的光从前侧成像到所述第一图像传感器上。 优选地，提供至少两个或至少三个图像传感器，使得可以实现计算摄像机。 附加传感器可以包括例如环境光传感器和/或接近传感器。

公开(公告)号：US20140167196A1

公开(公告)日：2014-06-19

申请号：US14177552

申请日：2014-02-11

Applicant: Heptagon Micro Optics Pte. Ltd.

Inventor： Stephan Heimgartner ,  Ville Kettunen ,  Nicola Spring ,  Alexander Bietsch ,  Mario Cesana ,  Hartmut Rudmann ,  Jukka Alasirnio ,  Robert Lenart

IPC: H01L27/146 ,  H01L31/18

CPC classification number: H01L27/14625 ,  G02B27/0025 ,  H01L27/14627 ,  H01L27/14685 ,  H01L27/14687 ,  H01L31/02162 ,  H01L31/02164 ,  H01L31/02325 ,  H01L31/18 ,  H04N5/2254 ,  Y10T29/49826

Abstract: Fabricating optical devices can include mounting a plurality of singulated lens systems over a substrate, adjusting a thickness of the substrate below at least some of the lens systems to provide respective focal length corrections for the lens systems, and subsequently separating the substrate into a plurality of optical modules, each of which includes one of the lens systems mounted over a portion of the substrate. Adjusting a thickness of the substrate can include, for example, micro-machining the substrate to form respective holes below at least some of the lens systems or adding one or more layers below at least some of the lens systems so as to correct for variations in the focal lengths of the lens systems.

公开(公告)号：US20130153772A1

公开(公告)日：2013-06-20

申请号：US13720645

申请日：2012-12-19

Applicant: HEPTAGON MICRO OPTICS PTE. LTD.

Inventor： Markus Rossi ,  Ville Kettunen

IPC: G01J5/08

CPC classification number: G01V8/12 ,  G01J1/0411 ,  G01J5/08 ,  G01S7/4811 ,  G01S17/026

Abstract: An opto-electronic module includes a detecting channel comprising a detecting member for detecting light and an emission channel comprising an emission member for emitting light generally detectable by said detecting member. Therein, a radiation distribution characteristic for an emission of light from said emission channel is non rotationally symmetric; and/or a sensitivity distribution characteristic for a detection in said detecting channel of light incident on said detection channel is non rotationally symmetric; and/or a central or main emission direction for an emission of light from said emission channel and a central or main detection direction for a detection of light incident on said detection channel are aligned not parallel to each other; and/or at least a first one of the channels comprises one or more passive optical components.

Abstract translation: 光电模块包括检测通道，该检测通道包括用于检测光的检测部件和发射通道，该发射通道包括用于发射由所述检测部件可检测的光的发射部件。 其中，用于从所述发射通道发射光的辐射分布特性是非旋转对称的; 和/或用于在入射到所述检测通道的光的所述检测通道中的检测的灵敏度分布特性是非旋转对称的; 和/或用于发射来自所述发射通道的光的中心或主发射方向以及用于检测入射在所述检测通道上的光的中心或主检测方向彼此不对准; 和/或至少第一个通道包括一个或多个无源光学部件。

公开(公告)号：US20170317126A1

公开(公告)日：2017-11-02

申请号：US15651510

申请日：2017-07-17

Applicant: Heptagon Micro Optics Pte. Ltd.

Inventor： Stephan Heimgartner ,  Ville Kettunen ,  Nicola Spring ,  Alexander Bietsch ,  Mario Cesana ,  Hartmut Rudmann ,  Jukka Alasirnio ,  Robert Lenart

IPC: H01L27/146 ,  H01L31/18 ,  H01L31/0232 ,  G02B27/00 ,  H01L31/0216 ,  H04N5/225

CPC classification number: H01L27/14625 ,  G02B27/0025 ,  H01L27/14627 ,  H01L27/14685 ,  H01L27/14687 ,  H01L31/02162 ,  H01L31/02164 ,  H01L31/02325 ,  H01L31/18 ,  H04N5/2254 ,  Y10T29/49826

Abstract: Fabricating optical devices can include mounting a plurality of singulated lens systems over a substrate, adjusting a thickness of the substrate below at least some of the lens systems to provide respective focal length corrections for the lens systems, and subsequently separating the substrate into a plurality of optical modules, each of which includes one of the lens systems mounted over a portion of the substrate. Adjusting a thickness of the substrate can include, for example, micro-machining the substrate to form respective holes below at least some of the lens systems or adding one or more layers below at least some of the lens systems so as to correct for variations in the focal lengths of the lens systems.

公开(公告)号：US09748297B2

公开(公告)日：2017-08-29

申请号：US14177552

申请日：2014-02-11

Applicant: Heptagon Micro Optics Pte. Ltd. ,  Franco Rinaldo

Inventor： Stephan Heimgartner ,  Ville Kettunen ,  Nicola Spring ,  Alexander Bietsch ,  Mario Cesana ,  Hartmut Rudmann ,  Jukka Alasirnio ,  Robert Lenart

IPC: H04N5/225 ,  H01L27/146 ,  G02B27/00 ,  H01L31/18 ,  H01L31/0216 ,  H01L31/0232

CPC classification number: H01L27/14625 ,  G02B27/0025 ,  H01L27/14627 ,  H01L27/14685 ,  H01L27/14687 ,  H01L31/02162 ,  H01L31/02164 ,  H01L31/02325 ,  H01L31/18 ,  H04N5/2254 ,  Y10T29/49826

Abstract: Fabricating optical devices can include mounting a plurality of singulated lens systems over a substrate, adjusting a thickness of the substrate below at least some of the lens systems to provide respective focal length corrections for the lens systems, and subsequently separating the substrate into a plurality of optical modules, each of which includes one of the lens systems mounted over a portion of the substrate. Adjusting a thickness of the substrate can include, for example, micro-machining the substrate to form respective holes below at least some of the lens systems or adding one or more layers below at least some of the lens systems so as to correct for variations in the focal lengths of the lens systems.

公开(公告)号：US09621773B2

公开(公告)日：2017-04-11

申请号：US14768989

申请日：2014-02-07

Applicant: Heptagon Micro Optics Pte. Ltd.

Inventor： Ville Kettunen ,  Markus Rossi

IPC: H04N5/225 ,  H01L27/146 ,  H04N5/369 ,  H04N9/04 ,  H04N5/238

CPC classification number: H04N5/2254 ,  H01L27/14618 ,  H01L27/14625 ,  H01L27/14645 ,  H01L27/14685 ,  H01L2924/0002 ,  H04N5/2253 ,  H04N5/2257 ,  H04N5/2258 ,  H04N5/369 ,  H04N9/045 ,  H01L2924/00

Abstract: The optical apparatus comprises a semiconductor substrate and at least one optics substrate. The semiconductor substrate comprises a first active region establishing a first image sensor, said semiconductor substrate further comprising an additional active region, different from said first active region. The additional active region establishes or is part of an additional sensor which is not an image sensor. And the at least one optics substrate comprises for said first image sensor at least one lens element for imaging light impinging on the optical apparatus from a front side onto the first image sensor. Preferably, at least two or rather at least three image sensors are provided, such that a computational camera can be realized. The additional sensor may comprise, e.g., an ambient light sensor and/or a proximity sensor.