公开(公告)号：US20190097066A1

公开(公告)日：2019-03-28

申请号：US15772581

申请日：2016-11-15

Applicant: Heptagon Micro Optics Pte. Ltd.

Inventor： Qichuan Yu ,  Hartmut Rudmann ,  Ji Wang ,  Kian Siang NG ,  Simon Gubser ,  James Eilertsen ,  Sundar Raman Ghana Sambandam

IPC: H01L31/0203 ,  H01L31/0216 ,  H01L31/0232 ,  H01L31/18 ,  H01L33/54 ,  H01L33/58

Abstract: The wafer-level manufacturing method makes possible to manufacture ultrathin optical devices such as opto-electronic modules. A clear encapsulation is applied to an initial wafer including active optical components and a wafer-size substrate, thereon, a photostructurable opaque coating is produced which includes apertures. Then, trenches are produced which extend through the clear encapsulation and establish side walls of intermediate products. Then, an opaque encapsulation is applied to the intermediate products, thus filling the trenches. Cutting through the opaque encapsulation material present in the trenches, singulated optical modules are produced, wherein side walls of the intermediate products are covered by the opaque encapsulation material.

公开(公告)号：US20190051762A1

公开(公告)日：2019-02-14

申请号：US16073418

申请日：2017-02-21

Applicant: Heptagon Micro Optics Pte. Ltd.

Inventor： Qichuan Yu ,  Hartmut Rudmann ,  Ji Wang ,  Kian Siang NG ,  Simon Gubser ,  James Eilertsen ,  Sundar Raman Gnana Sambandam

IPC: H01L31/0203 ,  H01L33/48 ,  H01L33/00 ,  H01L33/44 ,  H01L33/58 ,  H01L31/18 ,  H01L31/0216 ,  H01L31/0232

Abstract: The wafer-level manufacturing method makes possible to manufacture ultrathin optical devices such as opto-electronic modules. A clear encapsulation is applied to an initial wafer including active optical components and a wafer-size substrate. Thereon, a photostructurable opaque coating is produced which includes apertures. Then, trenches are produced which extend through the clear encapsulation and establish side walls of intermediate products. Then, an opaque encapsulation is applied to the intermediate products, thus filling the trenches. Cutting through the opaque encapsulation material present in the trenches, singulated optical modules are produced, wherein side walls of the intermediate products are covered by the opaque encapsulation material. The wafer-size substrate can be attached to a rigid carrier wafer during most process steps.