APPARATUS FOR TREATING SUBSTRATE
    32.
    发明公开

    公开(公告)号:US20230408925A1

    公开(公告)日:2023-12-21

    申请号:US17749437

    申请日:2022-05-20

    申请人: SEMES CO., LTD.

    IPC分类号: G03F7/16 B05C11/10

    CPC分类号: G03F7/162 B05C11/1039

    摘要: The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes substrate treating apparatus comprising: a treating container having an inner space; a support unit configured to support and rotate a substrate within the inner space; an exhaust duct configured to exhaust the inner space; and at least one guide member combined with the treating container and configured to guide an airflow within the inner space, and wherein the at least one guide member is arranged such that the airflow within the inner space obliquely flows with respect to a rotation direction of the substrate supported by the support unit when seen from above.

    Apparatus for treating substrate
    33.
    发明授权

    公开(公告)号:US11823914B2

    公开(公告)日:2023-11-21

    申请号:US16922430

    申请日:2020-07-07

    申请人: SEMES CO., LTD.

    摘要: An apparatus for performing heat treatment with respect to a substrate is provided. The apparatus for treating the substrate includes a substrate support member to seat a substrate on the substrate support member, a treating bowl to surround the substrate support member, a base plate provided to face a bottom surface of the substrate seated on the substrate support member, and an edge nozzle member mounted on the base plate to spray a treating liquid to a bottom edge part of the substrate seated on the substrate support member. The edge nozzle member includes a main body mounted on the base plate, a nozzle arm to mount an edge nozzle on the nozzle arm to slidably move on the main body, and a fixing member to maintain the nozzle arm at a setting position on the main body.

    SEMICONDUCTOR DEVELOPER TOOL AND METHODS OF OPERATION

    公开(公告)号:US20230367219A1

    公开(公告)日:2023-11-16

    申请号:US18357347

    申请日:2023-07-24

    IPC分类号: G03F7/16 H01L21/027

    CPC分类号: G03F7/162 H01L21/0274

    摘要: A developer tool described herein includes a dispenser that includes a greater quantity of nozzles in a central portion relative to a perimeter portion such that the developer tool is capable of more effectively removing material from a photoresist layer near a center of a substrate (which tends to be thicker near the center of the substrate relative to the edge or perimeter of the substrate). In this way, the developer tool may reduce the amount of photoresist residue or scum remaining on the substrate near the center of the substrate after a development operation, which may enable defect removal and/or prevention, may increase semiconductor processing yield, and/or may increase semiconductor processing quality.