公开(公告)号：US20230367219A1

公开(公告)日：2023-11-16

申请号：US18357347

申请日：2023-07-24

申请人： Taiwan Semiconductor Manufacturing Copmany, Ltd.

发明人： Yung-Yao LEE ,  Chen Yi HSU

IPC分类号： G03F7/16 ,  H01L21/027

CPC分类号： G03F7/162 ,  H01L21/0274

摘要： A developer tool described herein includes a dispenser that includes a greater quantity of nozzles in a central portion relative to a perimeter portion such that the developer tool is capable of more effectively removing material from a photoresist layer near a center of a substrate (which tends to be thicker near the center of the substrate relative to the edge or perimeter of the substrate). In this way, the developer tool may reduce the amount of photoresist residue or scum remaining on the substrate near the center of the substrate after a development operation, which may enable defect removal and/or prevention, may increase semiconductor processing yield, and/or may increase semiconductor processing quality.