公开(公告)号：US10157878B2

公开(公告)日：2018-12-18

申请号：US15641985

申请日：2017-07-05

申请人： Renesas Electronics Corporation

发明人： Tadatoshi Danno ,  Atsushi Nishikizawa

IPC分类号： H01L23/00 ,  H01L23/047 ,  H01L23/367 ,  H01L23/495 ,  H01L23/498 ,  H01L21/48 ,  H01L23/31 ,  H05K1/02

摘要： An improvement is achieved in the reliability of a semiconductor device. Over a die pad, first and second semiconductor chips are mounted. The first and second semiconductor chips and a part of the die pad are sealed in a sealing portion. The first semiconductor chip includes a power transistor. The second semiconductor chip controls the first semiconductor chip. The thickness of the portion of the die pad over which the first semiconductor chip is mounted is smaller than the thickness of the portion of the die pad over which the second semiconductor chip is mounted.

公开(公告)号：US10008473B2

公开(公告)日：2018-06-26

申请号：US15140928

申请日：2016-04-28

申请人： TriQuint Semiconductor, Inc.

发明人： Robert Charles Dry ,  Steve Jones ,  Jonathan Fain

IPC分类号： H05K1/11 ,  H01L25/065 ,  H01L23/00 ,  H01L23/047 ,  H01L23/13 ,  H01L23/36 ,  H01L23/538 ,  H01L23/10

CPC分类号： H01L25/0655 ,  H01L23/047 ,  H01L23/10 ,  H01L23/13 ,  H01L23/36 ,  H01L23/5383 ,  H01L23/66 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2223/6611 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48177 ,  H01L2224/49111 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/83447 ,  H01L2224/83805 ,  H01L2924/00014 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/15153 ,  H01L2924/15724 ,  H01L2924/15738 ,  H01L2924/15747 ,  H01L2924/16152 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/05599

摘要： The present disclosure relates to a ring-frame power package. In this regard, the ring-frame power package includes a thermal carrier and a ring structure. The thermal carrier has a carrier surface. The ring structure includes a ring body that is disposed over the carrier surface of the thermal carrier so that a portion of the carrier surface is exposed through an interior opening of the ring body. The ring-frame power package also includes a power package lid that is disposed over the ring body. The power package lid includes a cavity in communication with the interior opening of the ring body. In this manner, the power package lid covers and protects semiconductor devices and corresponding wires encased by the ring-frame power package.

公开(公告)号：US09966344B2

公开(公告)日：2018-05-08

申请号：US15360562

申请日：2016-11-23

申请人： FUJI ELECTRIC CO., LTD.

发明人： Shin Soyano

IPC分类号： H01L23/00 ,  H01L23/48 ,  H01L23/047 ,  H01L23/367 ,  H01L25/07 ,  H02M7/537 ,  H02M7/00 ,  H01L25/18

CPC分类号： H01L23/562 ,  H01L23/047 ,  H01L23/367 ,  H01L23/48 ,  H01L24/48 ,  H01L24/49 ,  H01L25/072 ,  H01L25/18 ,  H01L2224/45124 ,  H01L2224/48227 ,  H01L2224/4846 ,  H01L2224/4847 ,  H01L2224/4903 ,  H01L2224/49111 ,  H01L2224/49112 ,  H01L2224/49113 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/1203 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/14253 ,  H01L2924/19107 ,  H01L2924/3511 ,  H02M7/003 ,  H02M7/537 ,  H01L2224/05599 ,  H01L2924/00

摘要： A semiconductor device includes a plurality of main terminals extending from one end of a base plate toward the other end thereof, a group of semiconductor chips on a side of higher electric potential disposed on one side of the main terminal and mounted on the base plate, and a group of semiconductor chips on a side of lower electric potential disposed on the other side of the main terminal and mounted on the base plate. The one main terminal has an extending portion extending, in a direction perpendicular to the extending direction of the main terminal, toward one of both sides of the main terminal, and two adjacent semiconductor chips in one of the group of semiconductor chips on the side of higher electric potential and the group of semiconductor chips on the side of lower electric potential are axisymmetrically disposed with respect to the extending portion.

公开(公告)号：US20180082915A1

公开(公告)日：2018-03-22

申请号：US15269629

申请日：2016-09-19

申请人： FREESCALE SEMICONDUCTOR INC.

发明人： LAKSHMINARAYAN VISWANATHAN ,  JAYNAL A. MOLLA ,  DAVID ABDO ,  MALI MAHALINGAM ,  CARL D'ACOSTA

IPC分类号： H01L23/20 ,  H01L23/047 ,  H01L21/48 ,  H01L23/057 ,  H01L23/367 ,  B22F3/10 ,  B22F1/00 ,  B23K35/02 ,  B23K35/30

CPC分类号： H01L23/20 ,  B22F1/0062 ,  B22F3/10 ,  B22F5/10 ,  B22F7/02 ,  B22F2301/10 ,  B22F2301/255 ,  B22F2302/45 ,  B23K35/025 ,  B23K35/30 ,  H01L21/4817 ,  H01L21/50 ,  H01L23/04 ,  H01L23/047 ,  H01L23/057 ,  H01L23/10 ,  H01L23/3675 ,  H01L24/32 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/48177 ,  H01L2224/73265 ,  H01L2924/01042 ,  H01L2924/15747 ,  H01L2924/3511

摘要： Air cavity packages and methods for producing air cavity packages containing sintered bonded components, multipart window frames, and/or other unique structural features are disclosed. In one embodiment, a method for fabricating an air cavity package includes the step or process of forming a first metal particle-containing precursor layer between a base flange and a window frame positioned over the base flange. A second metal particle-containing precursor layer is further formed between the base flange and a microelectronic device positioned over the base flange. The metal particle-containing precursor layers are sintered substantially concurrently at a maximum processing temperature less than melt point(s) of metal particles within the layers to produce a first sintered bond layer from the first precursor layer joining the window frame to the base flange and to produce a second sintered bond layer from the second precursor layer joining the microelectronic device to the base flange.

公开(公告)号：US09852958B2

公开(公告)日：2017-12-26

申请号：US15427792

申请日：2017-02-08

申请人： Kyocera Corporation

发明人： Hiroshi Shibayama ,  Shigenori Takaya

IPC分类号： H01L23/047 ,  H01L33/48

CPC分类号： H01L23/047 ,  H01L23/053 ,  H01L33/483 ,  H01L2924/0002 ,  H05K5/0091 ,  H05K5/0247 ,  H01L2924/00

摘要： A container for housing an electronic component includes: a container body including a bottom plate and a polygonal side wall surrounding a central region of the bottom plate, the container body housing an electronic component inside a cavity defined by the bottom plate and the polygonal side wall; and an input-output terminal that penetrates through the polygonal side wall and is attached to two sides of the polygonal side wall, wherein a first side of the polygonal side wall is adjacent to a second side of the polygonal side wall, wherein the input-output terminal includes an insulator and a conductor, and wherein the conductor penetrates through the insulator and provides electrical continuity between an interior portion of the polygonal side wall and an exterior portion of the polygonal side wall.

公开(公告)号：US09837328B2

公开(公告)日：2017-12-05

申请号：US15070308

申请日：2016-03-15

申请人： Freescale Semiconductor, Inc.

发明人： Lakshminarayan Viswanathan

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/40 ,  H01L23/047 ,  H01L23/00 ,  H01L23/057 ,  H01L23/31 ,  H01L23/14 ,  H01L23/367 ,  H01L21/50 ,  H01L23/492 ,  H01L23/498 ,  H01L25/065 ,  H01L21/288 ,  H01L21/48

CPC分类号： H01L23/047 ,  H01L21/288 ,  H01L21/486 ,  H01L21/4867 ,  H01L21/50 ,  H01L23/057 ,  H01L23/142 ,  H01L23/3121 ,  H01L23/3675 ,  H01L23/3677 ,  H01L23/4924 ,  H01L23/49861 ,  H01L23/49866 ,  H01L24/13 ,  H01L24/27 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/80 ,  H01L24/83 ,  H01L25/0655 ,  H01L2224/2731 ,  H01L2224/29139 ,  H01L2224/29339 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/48137 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/48245 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/83447 ,  H01L2224/8384 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01042 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/0461 ,  H01L2924/0469 ,  H01L2924/1421 ,  H01L2924/15738 ,  H01L2924/15747 ,  H01L2924/15763 ,  H01L2924/16152 ,  H01L2924/16598 ,  H01L2924/171 ,  H01L2924/181 ,  H01L2924/20106 ,  H01L2924/20107 ,  H01L2924/20108 ,  H01L2924/3025 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2924/00012

摘要： A semiconductor device package that incorporates a combination of ceramic, organic, and metallic materials that are coupled using silver is provided. The silver is applied in the form of fine particles under pressure and a low temperature. After application, the silver forms a solid that has a typical melting point of silver, and therefore the finished package can withstand temperatures significantly higher than the manufacturing temperature. Further, since the silver is an interfacial material between the various combined materials, the effect of differing material properties between ceramic, organic, and metallic components, such as coefficient of thermal expansion, is reduced due to low temperature of bonding and the ductility of the silver.

公开(公告)号：US09455245B2

公开(公告)日：2016-09-27

申请号：US14608836

申请日：2015-01-29

申请人： Mitsubishi Electric Corporation

发明人： Katsumi Miyawaki

IPC分类号： H01L25/00 ,  H01L25/065 ,  H01L23/13 ,  H01L23/66 ,  H01L23/047

CPC分类号： H01L25/50 ,  H01L23/047 ,  H01L23/13 ,  H01L23/66 ,  H01L25/0655 ,  H01L2224/05554 ,  H01L2224/48091 ,  H01L2224/49175 ,  H01L2924/00014

摘要： A semiconductor device is provided with a base member having a front surface and a plurality of semiconductor chips provided on the front surface and each having a long side and a short side, the plurality of semiconductor chips being aligned so that the long sides are faced with each other. The plurality of semiconductor chips are provided diagonally, respectively, so that the adjacent semiconductor chips are inclined to the same side in a planar view of the front surface.

摘要翻译： 半导体器件设置有具有前表面的基底构件和设置在前表面上的每个具有长边和短边的多个半导体芯片，所述多个半导体芯片被对准以使得长边面对 彼此。 多个半导体芯片分别对角地设置，使得相邻的半导体芯片在前表面的平面图中倾斜到同一侧。

公开(公告)号：US20160071777A1

公开(公告)日：2016-03-10

申请号：US14404393

申请日：2014-03-13

申请人： Panasonic Intellectual Property Management Co., Ltd.

发明人： Kazuhiro YAHATA ,  Takashi UNO ,  Hikaru IKEDA

IPC分类号： H01L23/047 ,  H01L23/373 ,  H01L23/00 ,  H01L23/10

CPC分类号： H01L23/047 ,  H01L23/10 ,  H01L23/36 ,  H01L23/373 ,  H01L23/66 ,  H01L24/83 ,  H01L2223/6655 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/49175 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/095 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor package or a semiconductor device includes a heat sink onto which a semiconductor or a matching circuit is to be placed, a lead terminal which is to be electrically-connected to the semiconductor or the matching circuit on the heat sink, and a securing member which secures the lead terminal to the heat sink, wherein the securing member is formed by a composite resin material in which a resin and a ceramic powder are mixed.

摘要翻译： 半导体封装或半导体器件包括其上要放置半导体或匹配电路的散热器，要与半导体电连接的引线端子或散热器上的匹配电路，以及固定部件 其将引线端子固定到散热器，其中固定构件由其中混合有树脂和陶瓷粉末的复合树脂材料形成。

公开(公告)号：US09257370B2

公开(公告)日：2016-02-09

申请号：US14446390

申请日：2014-07-30

申请人： Ubotic Company Limited

发明人： Chun Ho Fan

IPC分类号： H01L23/495 ,  H01L23/047 ,  H01L23/10 ,  H01L23/498 ,  H01L21/50 ,  H01L23/00

CPC分类号： H01L23/49503 ,  H01L21/4825 ,  H01L21/50 ,  H01L21/565 ,  H01L21/78 ,  H01L23/047 ,  H01L23/10 ,  H01L23/3114 ,  H01L23/4952 ,  H01L23/49537 ,  H01L23/49541 ,  H01L23/49575 ,  H01L23/49582 ,  H01L23/49861 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/85 ,  H01L24/92 ,  H01L24/97 ,  H01L2224/32245 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/73265 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2224/85455 ,  H01L2224/85464 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/15153 ,  H01L2924/15747 ,  H01L2924/16251 ,  H01L2924/165 ,  H01L2924/1659 ,  H01L2924/167 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A cavity package is disclosed comprising a metal leadframe, a metal ring connected to the metal leadframe, a plastic body molded to the metal leadframe forming a substrate cavity including an exposed die attach pad of the leadframe for affixing a semiconductor device, exposed lead fingers of the leadframe for wire bonding to the semiconductor device and an external circuit, and an exposed top surface of the metal ring, and a metal cap for closing and encapsulating the substrate cavity. The metal ring is integrated into the pre-molded cavity leadframe for providing an electrical ground path from the metal cap to the die attach pad and permitting attachment of the metal cap to the pre-molded leadframe using solder reflow.

摘要翻译： 公开了一种空腔封装，其包括金属引线框架，连接到金属引线框架的金属环，模制到金属引线框架的塑料体，形成衬底腔体，该衬底腔体包括用于固定半导体器件的引线框架的暴露管芯附着焊盘，暴露的引线指 用于引线键合到半导体器件的引线框架和外部电路，以及金属环的暴露的顶表面，以及用于封闭和封装衬底腔的金属帽。 金属环集成到预成型腔引线框架中，用于提供从金属帽到管芯附接垫的电接地路径，并允许使用回流焊将金属帽附接到预成型的引线框架上。

公开(公告)号：US09095044B2

公开(公告)日：2015-07-28

申请号：US14252516

申请日：2014-04-14

申请人： Apple Inc.

发明人： Christopher D. Prest ,  Stephen P. Zadesky ,  Trent Weber ,  Lucy E. Browning

IPC分类号： H05K5/00 ,  G06F1/18 ,  H01L23/043 ,  H01L23/047 ,  H01L23/053 ,  H01L23/057 ,  H01L23/10 ,  H05K13/00

CPC分类号： B60R7/04 ,  A45C11/00 ,  A45C2011/001 ,  A45C2011/002 ,  A45C2011/003 ,  B60R11/0211 ,  B60R11/0241 ,  B60R11/0252 ,  B60R2011/0003 ,  B60R2011/0057 ,  G06F1/1656 ,  G06F1/181 ,  H01L23/043 ,  H01L23/047 ,  H01L23/053 ,  H01L23/057 ,  H01L23/10 ,  H01L2924/0002 ,  H05K5/0004 ,  H05K5/0021 ,  H05K5/02 ,  H05K5/04 ,  H05K5/069 ,  H05K13/00 ,  Y10T29/302 ,  Y10T29/49002 ,  Y10T29/49826 ,  H01L2924/00

摘要： An electronic device having a unitary housing is disclosed. The device can include a first housing component having an open cavity, an internal electronic part disposed within the cavity, a second housing component disposed across the cavity, and a support feature disposed within the cavity and arranged to support the second housing component. The first housing component can be formed from metal, while the second housing component can be formed from a plurality of laminated foil metal layers. The second housing component can be attached to the first housing component via one or more ultrasonic welds, such that a fully enclosed housing is created. The fully enclosed housing can be hermetically sealed, and the outside surfaces thereof can be machined or otherwise finished after the ultrasonic welding.

摘要翻译： 公开了具有整体式壳体的电子设备。 该装置可以包括具有开放空腔的第一壳体部件，设置在腔体内部的内部电子部件，跨越腔体设置的第二壳体部件和设置在腔体内并被布置成支撑第二壳体部件的支撑部件。 第一壳体部件可以由金属形成，而第二壳体部件可以由多个层压箔金属层形成。 第二壳体部件可以经由一个或多个超声波焊缝附接到第一壳体部件，使得产生完全封闭的壳体。 完全封闭的壳体可以被密封，并且其外表面可以在超声波焊接之后被加工或以其他方式完成。