公开(公告)号：US06848173B2

公开(公告)日：2005-02-01

申请号：US09766814

申请日：2001-01-22

Applicant: Joseph Fjelstad ,  Masud Beroz ,  John W. Smith ,  Belgacem Haba

Inventor： Joseph Fjelstad ,  Masud Beroz ,  John W. Smith ,  Belgacem Haba

IPC: H01L21/44 ,  H01L23/48 ,  H01L23/52 ,  H01L29/40 ,  H01R43/02 ,  H05K3/34

CPC classification number: H01L24/29 ,  H01L23/49811 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/50 ,  H01L24/73 ,  H01L24/78 ,  H01L24/83 ,  H01L24/85 ,  H01L24/86 ,  H01L25/0657 ,  H01L2224/0401 ,  H01L2224/05553 ,  H01L2224/05599 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/29 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/48465 ,  H01L2224/49431 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73257 ,  H01L2224/73265 ,  H01L2224/78 ,  H01L2224/83138 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2224/8393 ,  H01L2224/85186 ,  H01L2224/85205 ,  H01L2224/85207 ,  H01L2224/85399 ,  H01L2224/8593 ,  H01L2224/92247 ,  H01L2225/0651 ,  H01L2225/06558 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/10161 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49149 ,  Y10T29/49169 ,  Y10T29/49179 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2924/00012 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299

Abstract: A method of making a microelectronic assembly includes juxtaposing a first element, such as a dielectric sheet having conductive leads thereon with a second element, such as a semiconductor chip, having contact thereon, and wire bonding the conductive leads on the first element to the contacts on the second element so that elongated bonding wires extend between the conductive leads and the contacts. After the wire bonding step, the first and second elements are moved through a pre-selected displacement relative to one another so as to deform the bonding wires. A flowable dielectric material may be introduced between the first and second elements and around the bonding wires during or after the moving step. The flowable material may be cured to form an encapsulant around at least a portion of the bonding wires.

Abstract translation: 一种制造微电子组件的方法包括将第一元件（例如具有导电引线的电介质片）与其上接触的第二元件（例如半导体芯片）并置，将第一元件上的导电引线接合到触点上 在第二元件上，使得细长的接合线在导电引线和触点之间延伸。 在引线接合步骤之后，第一和第二元件相对于彼此移动通过预先选择的位移，以使接合线变形。 可移动介电材料可以在移动步骤期间或之后在第一和第二元件之间以及接合线周围引入。 可流动材料可以固化以形成围绕至少一部分接合线的密封剂。

公开(公告)号：US06737265B2

公开(公告)日：2004-05-18

申请号：US10242017

申请日：2002-09-12

Applicant: Masud Beroz ,  Joseph Fjelstad ,  Belgacem Haba ,  Christopher M. Pickett ,  John Smith

Inventor： Masud Beroz ,  Joseph Fjelstad ,  Belgacem Haba ,  Christopher M. Pickett ,  John Smith

IPC: C12M100

CPC classification number: H01L24/02 ,  H01L2221/68359 ,  H01L2221/68381 ,  H01L2224/02313 ,  H01L2224/02319 ,  H01L2224/02331 ,  H01L2224/02333 ,  H01L2224/02335 ,  H01L2224/0235 ,  H01L2224/02377 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/13024 ,  H01L2224/48091 ,  H01L2224/48245 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2224/94 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/3511 ,  H01L2924/00015 ,  H01L2224/03 ,  H01L2924/00 ,  H01L2224/13099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/29099 ,  H01L2224/29599

Abstract: Releasable leads having an elongated fixed portion extend over a surface defined by a dielectric material of a component or by a semiconductor body. A semiconductor element having a conductive structure connected to a set of contacts is also disclosed. A method of making the conductive structure is disclosed.

Abstract translation: 具有细长固定部分的可释放引线在由部件的介电材料或半导体本体限定的表面上延伸。 还公开了具有连接到一组触点的导电结构的半导体元件。 公开了制造导电结构的方法。

公开(公告)号：US06361959B1

公开(公告)日：2002-03-26

申请号：US09317675

申请日：1999-05-24

Applicant: Masud Beroz ,  Joseph Fjelstad ,  Belgacem Haba ,  Christopher M. Pickett ,  John Smith

Inventor： Masud Beroz ,  Joseph Fjelstad ,  Belgacem Haba ,  Christopher M. Pickett ,  John Smith

IPC: C12Q154

CPC classification number: C12Q1/00 ,  C12Q1/54 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/01039 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/10253 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00

Abstract: Electrically conductive elements such as terminals and leads are held on a support structure by a degradable connecting layer such as a adhesive degradable by heat or radiant energy. After connecting these elements to a microelectronic element such as a chip or wafer, the conductive elements are released from the support structure by degrading the connecting layer. The support structure desirably has a predictable, isotropic coefficient of thermal expansion and such coefficient of thermal expansion may be close to that of silicon to minimize the effect of the temperature changes. The conductive elements may be mounted on a plurality of individual tiles rather than on an unitary sheet covering an entire wafer to minimize dimensional changes when the dielectric is released from the support structure.

Abstract translation: 诸如端子和引线的导电元件通过可降解的连接层（例如通过热或辐射能降解的粘合剂）保持在支撑结构上。 在将这些元件连接到诸如芯片或晶片的微电子元件之后，通过降低连接层而将导电元件从支撑结构释放。 支撑结构理想地具有可预测的各向同性热膨胀系数，并且这种热膨胀系数可能接近于硅的热膨胀系数以最小化温度变化的影响。 导电元件可以安装在多个单独的瓦片上，而不是在覆盖整个晶片的整体片材上安装，以便当电介质从支撑结构释放时最小化尺寸变化。

公开(公告)号：US06329605B1

公开(公告)日：2001-12-11

申请号：US09277677

申请日：1999-03-26

Applicant: Masud Beroz ,  Belgacem Haba

Inventor： Masud Beroz ,  Belgacem Haba

IPC: H05K103

CPC classification number: H01L24/16 ,  H01L23/49816 ,  H01L24/05 ,  H01L24/73 ,  H01L24/83 ,  H01L24/90 ,  H01L2224/0401 ,  H01L2224/05001 ,  H01L2224/0554 ,  H01L2224/05551 ,  H01L2224/05555 ,  H01L2224/13021 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/2919 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01076 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K1/0201 ,  H05K3/3452 ,  H05K3/3457 ,  H05K2201/062 ,  H05K2201/0715 ,  H05K2201/2081 ,  H05K2203/0315 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A component for forming solder connections includes a diectric base having a non solder-wettable surface, a plurality of solder-wettable pads exposed to said surface, and an electrically conductive potential plane element having a non solder-wettable surface overlying the surface of the base in proximity to the pads but spaced from said pads. The non-wettable surface of the potential plane element may include a metal such as nickel or a metal oxide. The potential plane element thus performs the functions of a solder mask to prevent solder from forming short circuits between adjacent pads, and may also act as a ground plane, power plane or shielding element.

Abstract translation: 用于形成焊接连接​​的部件包括具有不可焊接润湿表面的多个基底，暴露于所述表面的多个焊料可润湿垫，以及具有覆盖在基底表面上的不可焊接润湿表面的导电电势平面元件 靠近垫，但与所述垫间隔开。 电位平面元件的不可润湿表面可以包括诸如镍或金属氧化物的金属。 因此，电位平面元件执行焊接掩模的功能，以防止焊料在相邻焊盘之间形成短路，并且还可以用作接地层，电源层或屏蔽元件。

公开(公告)号：US06188028B1

公开(公告)日：2001-02-13

申请号：US09094089

申请日：1998-06-09

Applicant: Belgacem Haba ,  Masud Beroz

Inventor： Belgacem Haba ,  Masud Beroz

IPC: H01R909

CPC classification number: H05K3/4617 ,  H01R12/523 ,  H05K3/325 ,  H05K3/4647 ,  H05K2201/09509 ,  H05K2201/09845 ,  H05K2203/1184 ,  Y10T29/49126

Abstract: A multilayer structure includes a plurality of stacked circuit panels interconnected by posts extending through each panel. Circuit traces provided on one or both surfaces of each circuit panel interconnect the connectors in a predetermined pattern. The connectors are provided with a blind via which is in electrical contact with a pair of contact pads on either surface of the circuit panel. One of the contact pads has an opening to allow access of a connecting post to the interior of the blind via, the other contact pad having a protruding post. The circuit panels are interconnected by inserting the post of one circuit panel into the blind via of an adjacent circuit panel.

Abstract translation: 多层结构包括通过延伸穿过每个面板的柱相互连接的多个堆叠电路板。 设置在每个电路板的一个或两个表面上的电路迹线以预定图案互连连接器。 连接器设置有盲孔，电路板与电路板的任一表面上的一对接触焊盘电接触。 接触垫中的一个具有开口以允许连接柱进入盲孔的内部，另一个接触垫具有突出的柱。 通过将一个电路板的柱插入相邻电路板的盲孔中，将电路板互连。

公开(公告)号：US08531020B2

公开(公告)日：2013-09-10

申请号：US12938094

申请日：2010-11-02

Applicant: Belgacem Haba ,  Craig S. Mitchell ,  Masud Beroz

Inventor： Belgacem Haba ,  Craig S. Mitchell ,  Masud Beroz

IPC: H01L23/02

CPC classification number: H01L24/81 ,  H01L21/56 ,  H01L21/78 ,  H01L23/49575 ,  H01L23/49833 ,  H01L24/48 ,  H01L24/97 ,  H01L25/105 ,  H01L25/18 ,  H01L25/50 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/97 ,  H01L2225/1023 ,  H01L2225/1029 ,  H01L2225/1041 ,  H01L2225/1052 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01002 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07811 ,  H01L2924/15311 ,  H01L2924/19107 ,  H01L2924/3011 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A plurality of microelectronic assemblies are made by severing an in-process unit including an upper substrate and lower substrate with microelectronic elements disposed between the substrates. In a further embodiment, a lead frame is joined to a substrate so that the leads project from this substrate. Lead frame is joined to a further substrate with one or more microelectronic elements disposed between the substrates.

Abstract translation: 多个微电子组件是通过用设置在基板之间的微电子元件切断包括上基板和下基板的在线单元制成的。 在另一个实施例中，引线框架连接到基板，使得引线从该基板突出。 引线框架连接到具有设置在基板之间的一个或多个微电子元件的另一基板。

公开(公告)号：US07816251B2

公开(公告)日：2010-10-19

申请号：US12291853

申请日：2008-11-14

Applicant: Belgacem Haba ,  Masud Beroz ,  Young-Gon Kim ,  David B. Tuckerman

Inventor： Belgacem Haba ,  Masud Beroz ,  Young-Gon Kim ,  David B. Tuckerman

IPC: H01L21/44

CPC classification number: H01L24/48 ,  H01L23/13 ,  H01L23/49811 ,  H01L24/45 ,  H01L24/49 ,  H01L2224/0233 ,  H01L2224/02377 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/4824 ,  H01L2224/48465 ,  H01L2224/48599 ,  H01L2224/49175 ,  H01L2224/85444 ,  H01L2224/85455 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  Y10T29/49208 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A connection component for mounting a chip or other microelectronic element is formed from a starting unit including posts projecting from a dielectric element by crushing or otherwise reducing the height of at least some of the posts.

Abstract translation: 用于安装芯片或其他微电子元件的连接部件由起动单元形成，起动单元包括通过压碎或以其它方式减小至少一些柱的高度从电介质元件伸出的柱。

公开(公告)号：US07554206B2

公开(公告)日：2009-06-30

申请号：US11607372

申请日：2006-12-01

Applicant: Belgacem Haba ,  Masud Beroz ,  Ronald Green ,  Ilyas Mohammed ,  Stuart E. Wilson ,  Wael Zohni ,  Yoichi Kubota ,  Jesse Burl Thompson

Inventor： Belgacem Haba ,  Masud Beroz ,  Ronald Green ,  Ilyas Mohammed ,  Stuart E. Wilson ,  Wael Zohni ,  Yoichi Kubota ,  Jesse Burl Thompson

IPC: H01L23/52 ,  H01L23/48 ,  H01L23/40 ,  H01L23/485 ,  H01L23/498

CPC classification number: H01L23/49811 ,  G01R1/06744 ,  G01R1/0735 ,  H01L21/563 ,  H01L23/4985 ,  H01L24/12 ,  H01L24/16 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/0401 ,  H01L2224/05599 ,  H01L2224/0603 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/13187 ,  H01L2224/13188 ,  H01L2224/1319 ,  H01L2224/1329 ,  H01L2224/133 ,  H01L2224/1357 ,  H01L2224/136 ,  H01L2224/1403 ,  H01L2224/16 ,  H01L2224/17 ,  H01L2224/1703 ,  H01L2224/48091 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73257 ,  H01L2224/73265 ,  H01L2224/83194 ,  H01L2224/85399 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01084 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/3011 ,  H01L2224/13099 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A microelectronic assembly includes a microelectronic package having a microelectronic element with faces and contacts, a flexible substrate spaced from and overlying a first face of the microelectronic element, and a plurality of conductive posts extending from the flexible substrate and projecting away from the first face of the microelectronic element, at least some of the conductive posts being electrically interconnected with the microelectronic element. The package includes a plurality of support elements disposed between the microelectronic element and the substrate and supporting the flexible substrate over the microelectronic element. At least some of the conductive posts are offset from the support elements. The assembly includes a circuitized substrate having conductive pads confronting the conductive posts of the microelectronic package, whereby the conductive posts are electrically interconnected with the conductive pads.

Abstract translation: 微电子组件包括具有微电子元件的微电子封装，所述微电子元件具有面和触点，与微电子元件的第一面间隔开并覆盖所述微电子元件的第一面的柔性基板以及从所述柔性基板延伸并远离所述第一面突出的多个导电柱 微电子元件，至少一些导电柱与微电子元件电互连。 所述封装包括设置在所述微电子元件和所述基板之间的多个支撑元件，并且在所述微电子元件上支撑所述柔性基板。 至少一些导电柱从支撑元件偏移。 组件包括具有面对微电子封装的导电柱的导电焊盘的电路化衬底，由此导电柱与导电焊盘电互连。

公开(公告)号：US07268304B2

公开(公告)日：2007-09-11

申请号：US11111145

申请日：2005-04-21

Applicant: Masud Beroz ,  Jae M. Park ,  Belgacem Haba ,  Fion Tan ,  Philip R. Osborn

Inventor： Masud Beroz ,  Jae M. Park ,  Belgacem Haba ,  Fion Tan ,  Philip R. Osborn

IPC: H01R43/00 ,  H01R12/04 ,  H05K13/00 ,  H05K1/11

CPC classification number: H01L23/13 ,  H01L23/3114 ,  H01L23/4951 ,  H01L23/4952 ,  H01L23/49811 ,  H01L23/49816 ,  H01L24/48 ,  H01L24/85 ,  H01L2224/05647 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/4824 ,  H01L2224/48463 ,  H01L2224/48471 ,  H01L2224/85447 ,  H01L2924/00014 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/19107 ,  H01L2224/45099 ,  H01L2924/00

Abstract: A connection component for a semiconductor chip includes a substrate having a gap over which extends a plurality of parallel spaced apart leads. The ends of the leads are adhered to the substrate either by being bonded to contacts or being embedded in the substrate. The connection component can be formed, in one embodiment, by stitch bonding wire leads across the gap. In another embodiment, a prefabricated lead assembly supporting spaced apart parallel leads is juxtaposed and transferred to the substrate. The connection component is juxtaposed overlying a semiconductor chip whereby leads extending over the gap may have one end detached and bonded to an underlying chip contact.

Abstract translation: 用于半导体芯片的连接部件包括具有间隙的基板，多个平行间隔开的​​引线延伸。 引线的端部通过结合到触点或嵌入基板中而粘附到基板上。 在一个实施例中，连接部件可以通过将导线穿过间隙缝合而形成。 在另一个实施例中，支撑间隔开的平行引线的预制引线组件并置并转移到衬底。 连接部件并置在半导体芯片上，由此在间隙上延伸的引线可以具有一端分离并结合到下面的芯片触点。

公开(公告)号：US20070094874A1

公开(公告)日：2007-05-03

申请号：US11642570

申请日：2006-12-20

Applicant: Belgacem Haba ,  Masud Beroz ,  David Tuckerman ,  Giles Humpston ,  Richard Crisp

Inventor： Belgacem Haba ,  Masud Beroz ,  David Tuckerman ,  Giles Humpston ,  Richard Crisp

IPC: H05K1/11

CPC classification number: H01L23/49838 ,  H01L23/49827 ,  H01L2924/0002 ,  H05K1/115 ,  H05K3/041 ,  H05K3/06 ,  H05K3/202 ,  H05K3/4038 ,  H05K2201/09609 ,  H05K2201/097 ,  H05K2201/09827 ,  H05K2201/09881 ,  H05K2203/0733 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49165 ,  H01L2924/00

Abstract: Provided are connection structures for a microelectronic device and methods for forming the structure. A substrate is included having opposing surfaces and a plurality of holes extending through the surfaces. Also included is a plurality of electrically conductive posts. Each post extends from a base to a tip located within a corresponding hole of the substrate. An additional substrate may be provided such that the base of each post is located on a surface thereof. Additional electrically conductive posts may be provided having tips in corresponding holes of the additional substrate. Optionally, a dielectric material may be placed between the substrate and the posts.

Abstract translation: 提供了用于微电子器件的连接结构和用于形成结构的方法。 包括具有相对表面的基板和延伸穿过该表面的多个孔。 还包括多个导电柱。 每个柱从基部延伸到位于基板的相应孔内的尖端。 可以提供另外的基底，使得每个柱的基部位于其表面上。 可以提供额外的导电柱，其具有在附加衬底的相应孔中的尖端。 可选地，介电材料可以放置在基板和柱之间。