摘要:
A semiconductor package includes a lead structure upon which a semiconductor die is mounted with at least some portion of at least some of the leads extending to, at, or across an axis or axis of the package to militate against thermally induced growth of the package and the reduce or minimize strain within the package and reliability issue associated therewith.
摘要:
An apparatus, memory device controller and method of controlling a memory device are provided. The example apparatus may include a bad block bitmap referencing unit configured to obtain bad block information from a bad block bitmap based on a given memory address, the given memory address being one of a logical memory address and a physical memory address corresponding to the logical memory address, the bad block information indicating whether a given memory block corresponding to the given memory address is a bad block and a memory mapping unit configured to obtain the physical memory address corresponding to the logical memory address, and configured to obtain a reserved physical memory address corresponding to the physical memory address if the bad block information indicates that the given memory block is a bad block. In an example, the apparatus may be embodied as a memory device controller including a flash translation layer (FTL).
摘要:
A radio frequency identifying device minimizes a null point area within a radiation pattern by horizontally or vertically vibrating an antenna plate radiating a radio frequency beam by using at least one vibration motor.
摘要:
A semiconductor package includes a lead structure upon which a semiconductor die is mounted with at least some portion of at least some of the leads extending to, at, or across an axis or axis of the package to militate against thermally induced growth of the package and the reduce or minimize strain within the package and reliability issuse associated therewith.
摘要:
Provided is a signboard for use in a vehicle, which is installed in the rear portion of the inside of the vehicle to thus deliver a message to a driver or passengers in other vehicles which follow. The vehicle signboard includes a support member having a support plate which is adhered on one side of the inner surface of a rear glass window in the vehicle and a support bar supported by the support plate; a display unit connected to the support member; a motor unit which is fixed to the support member and makes the display unit connected with a rotating member rotate; and a power supply unit which supplies electric power to the motor unit. Accordingly, the vehicle signboard provides an effect of conveying the proper expressions such as thanks and sorry to the drivers and passengers in the other vehicles which follow without obstructing the driver's rear field of view during running.
摘要:
Provided is a data writing method of copying data having logical pages prior to logical pages of data to write from a data block used in non-volatile memory device. The data writing method includes copying data having logical pages prior to a logical page of data to write from a second block to a first block, and writing the data to write in a page next to the copied prior logical pages.
摘要:
A bottom unit including a bottom unit semiconductor chip is mounted to a circuit board and one or more top elements such as packaged semiconductor chips are mounted to the bottom unit. Both mounting operations can be performed using the same techniques as commonly employed for mounting components to a circuit board. Ordinary packaged chips can be employed as the top elements, thereby reducing the cost of the assembly and allowing customization of the assembly by selecting packaged chips. The assembly achieves benefits similar to those obtained with a preassembled stacked chip unit, but without the expense of special handling of the bare dies included in the packaged chips.
摘要:
A lead assembly including a connector connecting structure having a plurality of separable portions and a plurality of leads. Each of the leads defined that they have a first end, a second end, a lead axis defined by the first and the second end, and an offset portion disposed between the first end and the second end. The offset portion being offset from the lead axis and adapted to be displaced downwardly with respect to the lead axis and bonded to a contact. The leads are preferably integral with the connecting structure. The connecting structure may be arranged outwardly of the leads, or may include parts interdispersed between groups of leads. The groups of leads may or may not correspond to individual units incorporating a microelectronic element.
摘要:
A laser transmitter includes an input stage generating an input signal to a limiting amplifier, the limiting amplifier generating an input signal to a laser driver, and the laser driver generating an input signal to a light source. The limiting amplifier has a control terminal for receiving a control signal that sets an amplitude characteristic of the input signal to the laser driver. The amplitude characteristic may be a common-mode or a peak amplitude of the input signal to the laser driver.
摘要:
An ultra thin system-in-a-package (SIP) with independent test and repair capability comprises an interposer having arranged on a top surface and a bottom surface thereof a number of packaged semiconductor chips mounted via solder bumps in accordance with a Land Grid Array (LGA) format and wherein no underfill is used on the SIP.