公开(公告)号：US20130175699A1

公开(公告)日：2013-07-11

申请号：US13346167

申请日：2012-01-09

申请人： Belgacem Haba ,  Kyong-Mo Bang

发明人： Belgacem Haba ,  Kyong-Mo Bang

IPC分类号： H01L23/48 ,  H01L21/50

CPC分类号： H01L25/0655 ,  B81C1/00301 ,  H01L23/13 ,  H01L23/3107 ,  H01L23/3128 ,  H01L23/367 ,  H01L24/13 ,  H01L24/16 ,  H01L24/20 ,  H01L24/48 ,  H01L24/49 ,  H01L24/96 ,  H01L25/0652 ,  H01L25/105 ,  H01L2224/12105 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/221 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/48228 ,  H01L2224/4824 ,  H01L2224/49109 ,  H01L2224/4911 ,  H01L2224/96 ,  H01L2225/0651 ,  H01L2225/0652 ,  H01L2225/06524 ,  H01L2225/06548 ,  H01L2225/1023 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2225/1094 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/18161 ,  H01L2924/18165 ,  H01L2924/19107 ,  H01L2924/014 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00012

摘要： A microelectronic assembly includes a first microelectronic package having a substrate with first and second opposed surfaces and substrate contacts thereon. The first package further includes first and second microelectronic elements, each having element contacts electrically connected with the substrate contacts and being spaced apart from one another on the first surface so as to provide an interconnect area of the first surface between the first and second microelectronic elements. A plurality of package terminals at the second surface are electrically interconnected with the substrate contacts for connecting the package with a component external thereto. A plurality of stack terminals are exposed at the first surface in the interconnect area for connecting the package with a component overlying the first surface of the substrate. The assembly further includes a second microelectronic package overlying the first microelectronic package and having terminals joined to the stack terminals of the first microelectronic package.

公开(公告)号：US20080042274A1

公开(公告)日：2008-02-21

申请号：US11975996

申请日：2007-10-23

申请人： Kyong-Mo Bang ,  David Gibson ,  Young-Gon Kim ,  John Riley

发明人： Kyong-Mo Bang ,  David Gibson ,  Young-Gon Kim ,  John Riley

IPC分类号： H01L23/48 ,  H01L21/00

CPC分类号： H01L23/49816 ,  H01L23/5387 ,  H01L24/48 ,  H01L24/73 ,  H01L25/105 ,  H01L2224/05599 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/50 ,  H01L2224/73204 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/14 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/1532 ,  H05K1/141 ,  H05K3/3436 ,  H05K2201/10674 ,  H05K2201/10734 ,  H05K2203/1572 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207

摘要： A bottom unit including a bottom unit semiconductor chip is mounted to a circuit board and one or more top elements such as packaged semiconductor chips are mounted to the bottom unit. Both mounting operations can be performed using the same techniques as commonly employed for mounting components to a circuit board. Ordinary packaged chips can be employed as the top elements, thereby reducing the cost of the assembly and allowing customization of the assembly by selecting packaged chips. The assembly achieves benefits similar to those obtained with a preassembled stacked chip unit, but without the expense of special handling of the bare dies included in the packaged chips.

摘要翻译： 包括底部单元半导体芯片的底部单元安装到电路板，并且诸如封装半导体芯片的一个或多个顶部元件安装到底部单元。 可以使用与将组件安装到电路板上通常使用的相同的技术来执行两种安装操作。 通常的封装芯片可以用作顶部元件，从而降低组装成本，并允许通过选择封装的芯片来定制组件。 该组件实现了与使用预组装的堆叠芯片单元获得的效果相似的优点，但是不包含包装在封装芯片中的裸芯片的特殊处理费用。

公开(公告)号：US07246431B2

公开(公告)日：2007-07-24

申请号：US10654375

申请日：2003-09-03

申请人： Kyong-Mo Bang ,  Teck-Gyu Kang

发明人： Kyong-Mo Bang ,  Teck-Gyu Kang

IPC分类号： H05K3/30

CPC分类号： H01L24/97 ,  H01L23/3121 ,  H01L23/4985 ,  H01L23/5387 ,  H01L24/48 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/05599 ,  H01L2224/16 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48471 ,  H01L2224/85399 ,  H01L2224/97 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06579 ,  H01L2225/06586 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/3011 ,  Y10T29/4913 ,  Y10T29/49133 ,  Y10T29/49135 ,  Y10T29/49169 ,  Y10T29/53174 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00012

摘要： A microelectronic package is fabricated by a process which includes folding a substrate. A substrate is folded by engaging a folding portion of the substrate with a die so that the folding portion pivots with respect to a first portion of the substrate.

摘要翻译： 通过包括折叠衬底的工艺制造微电子封装。 通过使基板的折叠部分与模具接合来折叠基板，使得折叠部分相对于基板的第一部分枢转。

公开(公告)号：US07935569B2

公开(公告)日：2011-05-03

申请号：US11975996

申请日：2007-10-23

申请人： Kyong-Mo Bang ,  David Gibson ,  Young-Gon Kim ,  John B. Riley, III

发明人： Kyong-Mo Bang ,  David Gibson ,  Young-Gon Kim ,  John B. Riley, III

IPC分类号： H01L21/00

CPC分类号： H01L23/49816 ,  H01L23/5387 ,  H01L24/48 ,  H01L24/73 ,  H01L25/105 ,  H01L2224/05599 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/50 ,  H01L2224/73204 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/14 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/1532 ,  H05K1/141 ,  H05K3/3436 ,  H05K2201/10674 ,  H05K2201/10734 ,  H05K2203/1572 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207

摘要： A bottom unit including a bottom unit semiconductor chip is mounted to a circuit board and one or more top elements such as packaged semiconductor chips are mounted to the bottom unit. Both mounting operations can be performed using the same techniques as commonly employed for mounting components to a circuit board. Ordinary packaged chips can be employed as the top elements, thereby reducing the cost of the assembly and allowing customization of the assembly by selecting packaged chips. The assembly achieves benefits similar to those obtained with a preassembled stacked chip unit, but without the expense of special handling of the bare dies included in the packaged chips.

摘要翻译： 包括底部单元半导体芯片的底部单元安装到电路板，并且诸如封装半导体芯片的一个或多个顶部元件安装到底部单元。 可以使用与将组件安装到电路板上通常使用的相同的技术来执行两种安装操作。 通常的封装芯片可以用作顶部元件，从而降低组装成本，并允许通过选择封装的芯片来定制组件。 该组件实现了与使用预组装的堆叠芯片单元获得的效果相似的优点，但是不包含包装在封装芯片中的裸芯片的特殊处理费用。

公开(公告)号：US20080156518A1

公开(公告)日：2008-07-03

申请号：US11649354

申请日：2007-01-03

申请人： Kenneth Allen Honer ,  Christopher Paul Wade ,  Seiichi Tobe ,  Chung-Chuan Tseng ,  Ellis Chau ,  Kyong-Mo Bang

发明人： Kenneth Allen Honer ,  Christopher Paul Wade ,  Seiichi Tobe ,  Chung-Chuan Tseng ,  Ellis Chau ,  Kyong-Mo Bang

IPC分类号： H05K13/00 ,  H01S4/00 ,  H05K1/00

CPC分类号： H05K3/0052 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/97 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01023 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/078 ,  H01L2924/10156 ,  H01L2924/10158 ,  H01L2924/19107 ,  H05K2203/0165 ,  H05K2203/0228 ,  H05K2203/167 ,  Y10T29/49002 ,  Y10T29/49169 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A substrate including plural microelectronic device carriers has metallic alignment elements. The alignment elements desirably are disposed in a predetermined positional relationship to terminals on the carriers. The alignment elements are engaged with a carrier frame and a cutting device is aligned with the carrier frame. The cutting device cuts the carriers so that borders of the carriers are in a precise relationship with the terminals.

摘要翻译： 包括多个微电子器件载体的衬底具有金属对准元件。 对准元件期望地与载体上的端子以预定的位置关系设置。 对准元件与载体框架接合，并且切割装置与载体框架对准。 切割装置切割载体，使得载体的边界与端子具有精确的关系。

公开(公告)号：US07294928B2

公开(公告)日：2007-11-13

申请号：US10656534

申请日：2003-09-05

申请人： Kyong-Mo Bang ,  David Gibson ,  Young-Gon Kim ,  John B. Riley

发明人： Kyong-Mo Bang ,  David Gibson ,  Young-Gon Kim ,  John B. Riley

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L23/538 ,  H01L23/498 ,  H05K1/14

CPC分类号： H01L23/49816 ,  H01L23/5387 ,  H01L24/48 ,  H01L24/73 ,  H01L25/105 ,  H01L2224/05599 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/50 ,  H01L2224/73204 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/14 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/1532 ,  H05K1/141 ,  H05K3/3436 ,  H05K2201/10674 ,  H05K2201/10734 ,  H05K2203/1572 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207

摘要： A bottom unit including a bottom unit semiconductor chip is mounted to a circuit board and one or more top elements such as packaged semiconductor chips are mounted to the bottom unit. Both mounting operations can be performed using the same techniques as commonly employed for mounting components to a circuit board. Ordinary packaged chips can be employed as the top elements, thereby reducing the cost of the assembly and allowing customization of the assembly by selecting packaged chips. The assembly achieves benefits similar to those obtained with a preassembled stacked chip unit, but without the expense of special handling of the bare dies included in the packaged chips.

摘要翻译： 包括底部单元半导体芯片的底部单元安装到电路板，并且诸如封装半导体芯片的一个或多个顶部元件安装到底部单元。 可以使用与将组件安装到电路板上通常使用的相同的技术来执行两种安装操作。 通常的封装芯片可以用作顶部元件，从而降低组装成本，并允许通过选择封装的芯片来定制组件。 该组件实现了与使用预组装的堆叠芯片单元获得的效果相似的优点，但是不包含包装在封装芯片中的裸芯片的特殊处理费用。

公开(公告)号：US07053485B2

公开(公告)日：2006-05-30

申请号：US10640177

申请日：2003-08-13

申请人： Kyong-Mo Bang ,  Teck-Gyu Kang ,  Jae M. Park

发明人： Kyong-Mo Bang ,  Teck-Gyu Kang ,  Jae M. Park

IPC分类号： H01L23/04 ,  H01L23/544 ,  H01L23/34 ,  H05K1/00

CPC分类号： H01L23/3121 ,  H01L23/4985 ,  H01L23/544 ,  H01L24/48 ,  H01L25/105 ,  H01L2223/54473 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/4824 ,  H01L2224/48472 ,  H01L2224/85399 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/3011 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： A microelectronic package is made by a process which includes folding a substrate. Alignment elements on different parts of the substrate engage one another during the folding process to position the parts of the substrate precisely relative to one another. One or more of the alignment elements may be a mass of an overmolding encapsulant covering a chip.

摘要翻译： 微电子封装通过包括折叠衬底的工艺制成。 在折叠过程中，衬底的不同部分上的对准元件彼此接合，以便相对于彼此精确地定位衬底的部分。 一个或多个对准元件可以是覆盖芯片的包覆成型密封剂的质量。

公开(公告)号：US08680684B2

公开(公告)日：2014-03-25

申请号：US13346167

申请日：2012-01-09

申请人： Belgacem Haba ,  Kyong-Mo Bang

发明人： Belgacem Haba ,  Kyong-Mo Bang

IPC分类号： H01L23/48

CPC分类号： H01L25/0655 ,  B81C1/00301 ,  H01L23/13 ,  H01L23/3107 ,  H01L23/3128 ,  H01L23/367 ,  H01L24/13 ,  H01L24/16 ,  H01L24/20 ,  H01L24/48 ,  H01L24/49 ,  H01L24/96 ,  H01L25/0652 ,  H01L25/105 ,  H01L2224/12105 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/221 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/48228 ,  H01L2224/4824 ,  H01L2224/49109 ,  H01L2224/4911 ,  H01L2224/96 ,  H01L2225/0651 ,  H01L2225/0652 ,  H01L2225/06524 ,  H01L2225/06548 ,  H01L2225/1023 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2225/1094 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/18161 ,  H01L2924/18165 ,  H01L2924/19107 ,  H01L2924/014 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00012

摘要： A microelectronic assembly includes a first microelectronic package having a substrate with first and second opposed surfaces and substrate contacts thereon. The first package further includes first and second microelectronic elements, each having element contacts electrically connected with the substrate contacts and being spaced apart from one another on the first surface so as to provide an interconnect area of the first surface between the first and second microelectronic elements. A plurality of package terminals at the second surface are electrically interconnected with the substrate contacts for connecting the package with a component external thereto. A plurality of stack terminals are exposed at the first surface in the interconnect area for connecting the package with a component overlying the first surface of the substrate. The assembly further includes a second microelectronic package overlying the first microelectronic package and having terminals joined to the stack terminals of the first microelectronic package.

摘要翻译： 微电子组件包括具有其上具有第一和第二相对表面的衬底的衬底接触件的第一微电子封装。 第一封装还包括第一和第二微电子元件，每个微电子元件具有与基板触点电连接并且在第一表面上彼此间隔开的元件触点，以便在第一和第二微电子元件之间提供第一表面的互连区域 。 在第二表面处的多个封装端子与衬底触头电连接，用于将封装与外部的部件连接。 多个堆叠端子在互连区域中的第一表面处露出，用于将封装件与覆盖在基板的第一表面上的部件连接。 组件还包括覆盖第一微电子封装并具有连接到第一微电子封装的堆叠端子的端子的第二微电子封装。