发明授权
- 专利标题： Microelectronic packages with self-aligning features
- 专利标题（中）： 具有自对准功能的微电子封装
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申请号： US10640177申请日： 2003-08-13
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公开(公告)号： US07053485B2公开(公告)日： 2006-05-30
- 发明人: Kyong-Mo Bang , Teck-Gyu Kang , Jae M. Park
- 申请人： Kyong-Mo Bang , Teck-Gyu Kang , Jae M. Park
- 申请人地址： US CA San Jose
- 专利权人： Tessera, Inc.
- 当前专利权人： Tessera, Inc.
- 当前专利权人地址： US CA San Jose
- 代理机构： Lerner, David, Littenberg, Krumholz & Mentlik, LLP
- 主分类号： H01L23/04
- IPC分类号： H01L23/04 ; H01L23/544 ; H01L23/34 ; H05K1/00
摘要：
A microelectronic package is made by a process which includes folding a substrate. Alignment elements on different parts of the substrate engage one another during the folding process to position the parts of the substrate precisely relative to one another. One or more of the alignment elements may be a mass of an overmolding encapsulant covering a chip.
公开/授权文献
- US20040104470A1 Microelectronic packages with self-aligning features 公开/授权日：2004-06-03
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