Invention Grant
- Patent Title: Leadframe structures for semiconductor packages
- Patent Title (中): 半导体封装的引线框架结构
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Application No.: US12712170Application Date: 2010-02-24
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Publication No.: US08445998B1Publication Date: 2013-05-21
- Inventor: Young-Gon Kim , Nikhil Vishwanath Kelkar , Louis Elliott Pflughaupt
- Applicant: Young-Gon Kim , Nikhil Vishwanath Kelkar , Louis Elliott Pflughaupt
- Applicant Address: US CA Milpitas
- Assignee: Intersil Americas Inc.
- Current Assignee: Intersil Americas Inc.
- Current Assignee Address: US CA Milpitas
- Agent Wallace G. Walter
- Main IPC: H01L23/495
- IPC: H01L23/495
Abstract:
A semiconductor package includes a lead structure upon which a semiconductor die is mounted with at least some portion of at least some of the leads extending to, at, or across an axis or axis of the package to militate against thermally induced growth of the package and the reduce or minimize strain within the package and reliability issue associated therewith.
Information query
IPC分类:
