公开(公告)号：US06277799B1

公开(公告)日：2001-08-21

申请号：US09344886

申请日：1999-06-25

Applicant: Krishna G. Sachdev ,  James N. Humenik ,  John U. Knickerbocker ,  Glenn A. Pomerantz

Inventor： Krishna G. Sachdev ,  James N. Humenik ,  John U. Knickerbocker ,  Glenn A. Pomerantz

IPC: C11D172

CPC classification number: C11D11/0047 ,  C11D1/008 ,  C11D1/02 ,  C11D1/24 ,  C11D1/29 ,  C11D1/66 ,  C11D1/662 ,  C11D1/72 ,  C11D1/88 ,  C11D1/90 ,  C11D3/2086 ,  H05K3/1216 ,  H05K3/26

Abstract: This invention relates to an aqueous cleaning method for removal of metal-organic composite paste residue from the surface of components, such as, screening masks, associated paste screening equipment, substrates, to name a few. The invention is particularly concerned with aqueous alkaline cleaning solutions comprising alkali metal salt and/or quaternary ammonium salt of an organic acid preferably &agr;-hydroxy carboxylic acid in the presence of excess alkali and optionally a surface active agent for use in cleaning components, such as, screening masks, associated screening equipment, substrates, etc., which are used in the production of electronic components.

Abstract translation: 本发明涉及从组分表面除去金属 - 有机复合糊状残留物的水性清洗方法，例如筛选掩模，相关的糊状物筛选设备，底物等等。 本发明特别涉及含有碱金属盐和/或季铵盐的含水碱性清洗溶液，所述碱性金属盐和/或有机酸优选为α-羟基羧酸的季铵盐，所述碱性金属盐和/或季铵盐在过量碱和任选的表面活性剂存在下用于清洁组分，例如 ，筛选掩模，相关筛选设备，基材等，用于生产电子元件。

公开(公告)号：US06228682B1

公开(公告)日：2001-05-08

申请号：US09469157

申请日：1999-12-21

Applicant: Mukta S. Farooq ,  John U. Knickerbocker ,  Srinivasa S. Reddy

Inventor： Mukta S. Farooq ,  John U. Knickerbocker ,  Srinivasa S. Reddy

IPC: H01L2144

CPC classification number: H01L24/11 ,  H01L25/165 ,  H01L2224/13099 ,  H01L2224/16227 ,  H01L2224/16265 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15159 ,  H01L2924/15312 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19103 ,  H01L2924/19104 ,  H01L2924/30107 ,  H05K1/023 ,  H05K1/183 ,  H05K2201/1053 ,  H05K2201/10734 ,  H01L2924/00

Abstract: The distance between a discrete or passive electrical component and an electrical semiconductor device and substrate or carrier is minimized by shortening the lead length connections of the passive component. One or more passive electronic components are mounted within the body of a carrier or board by creating a cavity in the substrate or carrier that is directly below a semiconductor device. The passive component is electrically connected to the substrate and device using solder bump technology resulting in much shorter lead length connections to and from the passive component.

公开(公告)号：US6136419A

公开(公告)日：2000-10-24

申请号：US320532

申请日：1999-05-26

Applicant: Benjamin V. Fasano ,  Richard F. Indyk ,  Sundar M. Kamath ,  John U. Knickerbocker ,  Scott I. Langenthal ,  Daniel P. O'Connor ,  Srinivasa S. N. Reddy

Inventor： Benjamin V. Fasano ,  Richard F. Indyk ,  Sundar M. Kamath ,  John U. Knickerbocker ,  Scott I. Langenthal ,  Daniel P. O'Connor ,  Srinivasa S. N. Reddy

IPC: H05K1/11 ,  B32B18/00 ,  H01L23/12 ,  H01L23/498 ,  H05K1/03 ,  H05K3/24 ,  H05K3/40 ,  H05K3/46 ,  B32B3/00

CPC classification number: H05K3/4061 ,  B32B18/00 ,  C04B37/021 ,  H01L23/49822 ,  H01L23/49827 ,  C04B2237/343 ,  C04B2237/345 ,  C04B2237/346 ,  C04B2237/348 ,  C04B2237/407 ,  C04B2237/408 ,  C04B2237/706 ,  C04B2237/708 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/0272 ,  H05K1/0306 ,  H05K2201/0347 ,  H05K2201/0352 ,  H05K2201/096 ,  H05K3/246 ,  H05K3/4611 ,  H05K3/4629 ,  Y10T428/24926

Abstract: Disclosed is a multilayer ceramic substrate, and a method for forming same, which has an outer unsealed layer having a metallic via, an inner sealed layer having a composite via of metallic and ceramic materials and a further unsealed layer having a metallic via.

Abstract translation: 公开了一种多层陶瓷基板及其形成方法，其具有具有金属通孔的外部未密封层，具有金属和陶瓷材料的复合通孔的内密封层和具有金属通孔的另外的未密封层。

公开(公告)号：US6133540A

公开(公告)日：2000-10-17

申请号：US128446

申请日：1998-08-03

Applicant: Thomas Weiss ,  John U. Knickerbocker ,  Mark J. LaPlante ,  David C. Long

Inventor： Thomas Weiss ,  John U. Knickerbocker ,  Mark J. LaPlante ,  David C. Long

IPC: B23K20/00 ,  B23K11/16 ,  B23K9/04

CPC classification number: H01L24/78 ,  B23K20/007 ,  B23K2201/40 ,  H01L2224/45147 ,  H01L2224/7865 ,  H01L24/45 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01007 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19043

Abstract: An apparatus and method is provided for forming a punch retaining ball at the end of a wire to form a headed punch pin for making vias in greensheets comprising advancing the wire through a die, contacting the end of the wire with a movable electrode which forms the ball by completing an electrical circuit with the wire and the electrode, after which the wire is retracted so that the formed punch pin is restrained from movement by the die and is cut forming the punch pin. A formed punch pin collection device is also provided as is a defective punch pin removal device. After the formation and removal from the apparatus of a formed punch pin or a reject defective punch pin, the apparatus is moved to its starting position and again activated to advance the wire through the die and the above procedure repeated.

Abstract translation: 提供了一种装置和方法，用于在线的端部处形成冲头保持球，以形成头部穿孔，用于在通风孔中形成通孔，包括使导线穿过模头，使导线的端部与可动电极接触，可动电极形成 通过用线和电极完成电路，然后将电线缩回，使得形成的冲头被模具阻止运动并被切割形成冲头销。 还提供了形成的冲头销收集装置，就像缺陷冲头销移除装置一样。 在从成形的冲头销或拒收缺陷冲头销的装置中形成和移除之后，装置被移动到其起始位置并且再次被启动以将线材推进通过模具并重复上述过程。

公开(公告)号：US6032683A

公开(公告)日：2000-03-07

申请号：US258970

申请日：1999-02-26

Applicant: Jon A. Casey ,  Michael E. Cropp ,  Donald W. DiAngelo ,  John F. Harmuth ,  John U. Knickerbocker ,  David C. Long ,  Daniel S. Mackin ,  Glenn A. Pomerantz ,  Krishna G. Sachdev ,  David E. Speed ,  Candace A. Sullivan ,  Robert J. Sullivan ,  Bruce E. Tripp ,  James C. Utter

Inventor： Jon A. Casey ,  Michael E. Cropp ,  Donald W. DiAngelo ,  John F. Harmuth ,  John U. Knickerbocker ,  David C. Long ,  Daniel S. Mackin ,  Glenn A. Pomerantz ,  Krishna G. Sachdev ,  David E. Speed ,  Candace A. Sullivan ,  Robert J. Sullivan ,  Bruce E. Tripp ,  James C. Utter

IPC: B08B3/02 ,  B41F35/00 ,  G03F1/82 ,  G03F7/12 ,  G03F7/42 ,  H01L21/00 ,  H05K3/12 ,  H05K3/26 ,  B08B3/00

CPC classification number: H01L21/67028 ,  B08B3/02 ,  B41F35/005 ,  G03F1/82 ,  G03F7/425 ,  B41P2235/26 ,  B41P2235/50 ,  G03F7/12 ,  H05K3/1216 ,  H05K3/26

Abstract: A cleaning method and related apparatus for cleaning semiconductor screening masks using an aqueous alkali detergent solution applied under high pressure simultaneously from both sides of the mask, followed by a drying step that uses air knives to blow off the mask surface any residual cleaner solution.

Abstract translation: 一种清洁方法和相关设备，用于使用在面罩的两侧同时施加的高压下的碱性洗涤剂水溶液来清洗半导体掩模掩模，随后进行干燥步骤，其使用空气刀将掩模表面吹出任何残余的清洁剂溶液。

公开(公告)号：US6023407A

公开(公告)日：2000-02-08

申请号：US31235

申请日：1998-02-26

Applicant: Mukta S. Farooq ,  Shaji Farooq ,  Harvey C. Hamel ,  John U. Knickerbocker ,  Robert A. Rita ,  Herbert I. Stoller

Inventor： Mukta S. Farooq ,  Shaji Farooq ,  Harvey C. Hamel ,  John U. Knickerbocker ,  Robert A. Rita ,  Herbert I. Stoller

IPC: H01L27/04 ,  H01G4/30 ,  H01G4/33 ,  H01L21/02 ,  H01L21/822 ,  H01G4/005 ,  H01G4/228

CPC classification number: H01L28/40 ,  H01G4/306 ,  Y10T29/435

Abstract: An electronic component structure is proposed, wherein an interposer thin film capacitor structure is employed between an active electronic component and a multilayer circuit card. A method for making the interposer thin film capacitor is also proposed. In order to eliminate fatal electrical shorts in the overlying thin film regions that arise from pits, voids, or undulations on the substrate surface, a thick first metal layer, on the order of 0.5-10 .mu.m thick, is deposited on the substrate upon which the remaining thin films, including a dielectric film and second metal layer, are then applied. The first metal layer includes of Pt or other electrode metal, or a combination of Pt, Cr, and Cu metals, and a diffusion barrier layer. Additional Ti layers may be employed for adhesion enhancement. The thickness of the first metal layers are approximately: 200 A for the Cr layer; 0.5-10 .mu.m for the Cu layer; 1000 A-5000 A for the diffusion barrier; and 100 A-2500 A for a Pt layer.

Abstract translation: 提出了一种电子部件结构，其中在有源电子部件和多层电路卡之间采用中介层薄膜电容器结构。 还提出了一种用于制造中介层薄膜电容器的方法。 为了消除由衬底表面上的凹坑，空隙或起伏引起的上覆薄膜区域中的致命电短路，厚度为0.5-10μm的厚的第一金属层沉积在衬底上 然后施加剩余的薄膜，包括电介质膜和第二金属层。 第一金属层包括Pt或其它电极金属，或Pt，Cr和Cu金属的组合以及扩散阻挡层。 另外的Ti层可以用于附着增强。 对于Cr层，第一金属层的厚度约为：200A; Cu层为0.5-10μm; 1000 A-5000 A用于扩散阻挡层; 和Pt层的100A-2500A。

公开(公告)号：US5916374A

公开(公告)日：1999-06-29

申请号：US21046

申请日：1998-02-09

Applicant: Jon A. Casey ,  Michael E. Cropp ,  Donald W. DiAngelo ,  John F. Harmuth ,  John U. Knickerbocker ,  David C. Long ,  Daniel S. Mackin ,  Glenn A. Pomerantz ,  Krishna G. Sachdev ,  David E. Speed ,  Candace A. Sullivan ,  Robert J. Sullivan ,  Bruce E. Tripp ,  James C. Utter

Inventor： Jon A. Casey ,  Michael E. Cropp ,  Donald W. DiAngelo ,  John F. Harmuth ,  John U. Knickerbocker ,  David C. Long ,  Daniel S. Mackin ,  Glenn A. Pomerantz ,  Krishna G. Sachdev ,  David E. Speed ,  Candace A. Sullivan ,  Robert J. Sullivan ,  Bruce E. Tripp ,  James C. Utter

IPC: B08B3/02 ,  B41F35/00 ,  G03F1/82 ,  G03F7/12 ,  G03F7/42 ,  H01L21/00 ,  H05K3/12 ,  H05K3/26 ,  B08B3/04

CPC classification number: H01L21/67028 ,  B08B3/02 ,  B41F35/005 ,  G03F1/82 ,  G03F7/425 ,  B41P2235/26 ,  B41P2235/50 ,  G03F7/12 ,  H05K3/1216 ,  H05K3/26

Abstract: A cleaning method and related apparatus for cleaning semiconductor screening masks using an aqueous alkali detergent solution applied under high pressure simultaneously from both sides of the mask, followed by a drying step that uses air knives to blow off the mask surface any residual cleaner solution.

Abstract translation: 一种清洁方法和相关设备，用于使用在面罩的两侧同时施加的高压下的碱性洗涤剂水溶液来清洗半导体掩模掩模，随后进行干燥步骤，其使用空气刀将掩模表面吹出任何残余的清洁剂溶液。

公开(公告)号：US5635000A

公开(公告)日：1997-06-03

申请号：US577180

申请日：1995-12-22

Applicant: Jon A. Casey ,  Cynthia J. Calli ,  Darren T. Cook ,  David B. Goland ,  John U. Knickerbocker ,  Mark J. LaPlante ,  David C. Long ,  Daniel S. Mackin ,  Kathleen M. McGuire ,  Keith C. O'Neil ,  Kevin M. Prettyman ,  Michael T. Puchalski ,  Joseph C. Saltarelli ,  Candace A. Sullivan

Inventor： Jon A. Casey ,  Cynthia J. Calli ,  Darren T. Cook ,  David B. Goland ,  John U. Knickerbocker ,  Mark J. LaPlante ,  David C. Long ,  Daniel S. Mackin ,  Kathleen M. McGuire ,  Keith C. O'Neil ,  Kevin M. Prettyman ,  Michael T. Puchalski ,  Joseph C. Saltarelli ,  Candace A. Sullivan

IPC: H01L21/48 ,  H01L21/683 ,  H05K1/03 ,  H05K3/40 ,  B32B31/04 ,  B32B31/28

CPC classification number: H05K3/4061 ,  H01L21/4867 ,  H01L21/6833 ,  H05K1/0306 ,  H05K2203/105 ,  Y10T156/1056 ,  Y10T156/1158 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49139 ,  Y10T428/239 ,  Y10T428/31 ,  Y10T428/31786

Abstract: The present invention relates generally to a new apparatus and method for screening using electrostatic adhesion. More particularly, the invention encompasses an apparatus that uses an electrostatic charge during the screening process for a semiconductor substrate. Basically, a backing layer is adhered to a green ceramic sheet using an electrostatic charge, while the green ceramic sheet is processed.

Abstract translation: 本发明一般涉及使用静电粘附进行筛选的新装置和方法。 更具体地，本发明包括在半导体衬底的筛选过程中使用静电电荷的装置。 基本上，使用静电荷将背衬层附着在生坯陶瓷片上，同时处理生坯陶瓷片。

公开(公告)号：US5541005A

公开(公告)日：1996-07-30

申请号：US438825

申请日：1995-05-11

Applicant: Raschid J. Bezama ,  Jon A. Casey ,  Mario E. Ecker ,  Shaji Farooq ,  Irene S. Frantz ,  Katherine G. Frase ,  David H. Gabriels ,  Lester W. Herron ,  John U. Knickerbocker ,  Sarah H. Knickerbocker ,  Govindarajan Natarajan ,  John Thomson ,  Yee-Ming Ting ,  Sharon L. Tracy ,  Robert M. Troncillito ,  Vivek M. Sura ,  Donald R. Wall ,  Giai V. Yen

Inventor： Raschid J. Bezama ,  Jon A. Casey ,  Mario E. Ecker ,  Shaji Farooq ,  Irene S. Frantz ,  Katherine G. Frase ,  David H. Gabriels ,  Lester W. Herron ,  John U. Knickerbocker ,  Sarah H. Knickerbocker ,  Govindarajan Natarajan ,  John Thomson ,  Yee-Ming Ting ,  Sharon L. Tracy ,  Robert M. Troncillito ,  Vivek M. Sura ,  Donald R. Wall ,  Giai V. Yen

IPC: B28B11/02 ,  H01L21/48 ,  H01L21/768 ,  H01L23/15 ,  H01L23/522 ,  H05K1/03 ,  H05K1/14 ,  H05K3/46 ,  B22F3/105

CPC classification number: H05K1/142 ,  H01L21/4807 ,  H01L23/15 ,  H05K3/46 ,  H05K3/4629 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/0306 ,  H05K2201/09972 ,  Y10T428/12049 ,  Y10T428/12146 ,  Y10T428/16 ,  Y10T428/163 ,  Y10T428/166 ,  Y10T428/192

Abstract: A large ceramic substrate article for electronic applications including at least one layer of sintered ceramic material, the layer including a plurality of greensheet segments of ceramic material joined edge to edge. Also disclosed is a method of fabricating a large ceramic greensheet article as well as a large ceramic substrate article.

Abstract translation: 一种用于电子应用的大型陶瓷衬底制品，包括至少一层烧结陶瓷材料，该层包括多个边缘到边缘连接的陶瓷材料毛坯块。 还公开了一种制造大型陶瓷毛坯制品的方法以及大型陶瓷基片制品。

公开(公告)号：US5277725A

公开(公告)日：1994-01-11

申请号：US881448

申请日：1992-05-11

Applicant: John Acocella ,  Peter A. Agostino ,  Arnold I. Baise ,  Richard A. Bates ,  Ray M. Bryant ,  Jon A. Casey ,  David R. Clarke ,  George Czornyj ,  Allen J. Dam ,  Lawrence D. David ,  Renuka S. Divakaruni ,  Werner E. Dunkel ,  Ajay P. Giri ,  Liang-Choo Hsia ,  James N. Humenik ,  Steven M. Kandetzke ,  Daniel P. Kirby ,  John U. Knickerbocker ,  Sarah H. Knickerbocker ,  Anthony Mastreani ,  Amy T. Matts ,  Robert W. Nufer ,  Charles H. Perry ,  Srinivasa S. N. Reddy ,  Salvatore J. Scilla ,  Mark A. Takacs ,  Lovell B. Wiggins

Inventor： John Acocella ,  Peter A. Agostino ,  Arnold I. Baise ,  Richard A. Bates ,  Ray M. Bryant ,  Jon A. Casey ,  David R. Clarke ,  George Czornyj ,  Allen J. Dam ,  Lawrence D. David ,  Renuka S. Divakaruni ,  Werner E. Dunkel ,  Ajay P. Giri ,  Liang-Choo Hsia ,  James N. Humenik ,  Steven M. Kandetzke ,  Daniel P. Kirby ,  John U. Knickerbocker ,  Sarah H. Knickerbocker ,  Anthony Mastreani ,  Amy T. Matts ,  Robert W. Nufer ,  Charles H. Perry ,  Srinivasa S. N. Reddy ,  Salvatore J. Scilla ,  Mark A. Takacs ,  Lovell B. Wiggins

IPC: H05K1/03 ,  C04B41/48 ,  C04B41/49 ,  H01L21/48 ,  H01L23/08 ,  H01L23/538 ,  H05K3/40 ,  C04B37/00 ,  B05D5/12

CPC classification number: H01L21/4857 ,  C04B41/488 ,  C04B41/4961 ,  H01L23/5383 ,  H05K3/4061 ,  C04B2111/00672 ,  C04B2111/00844 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/12044 ,  H05K1/0306 ,  H05K2201/09581 ,  H05K2203/1147 ,  H05K2203/308

Abstract: The cracking experienced during thermal cycling of metal:dielectric semiconductor packages results from a mismatch in thermal co-efficients of expansion. The non-hermeticity associated with such cracking can be addressed by backfilling the permeable cracks with a flexible material. Uniform gaps between the metal and dielectric materials can similarly be filled with flexible materials to provide stress relief, bulk compressibility and strength to the package. Furthermore, a permeable, skeletal dielectric can be fabricated as a fired, multilayer structure having sintered metallurgy and subsequently infused with a flexible, temperature-stable material to provide hermeticity and strength.

Abstract translation: 在金属的热循环过程中经历的裂纹：电介质半导体封装是由热膨胀系数不匹配引起的。 与这种开裂相关的非气密性可以通过用柔性材料回填可渗透裂缝来解决。 金属和电介质材料之间的均匀间隙可以类似地填充柔性材料，以提供应力消除，体积可压缩性和包装的强度。 此外，可渗透的骨架电介质可以被制造为具有烧结冶金的烧结多层结构，并随后注入柔性的温度稳定的材料以提供气密性和强度。