公开(公告)号：US06300164B1

公开(公告)日：2001-10-09

申请号：US09559314

申请日：2000-04-27

申请人： Anson J. Call ,  Stephen Anthony DeLaurentis ,  Shaji Farooq ,  Sung Kwon Kang ,  Sampath Purushothaman ,  Kathleen Ann Stalter

发明人： Anson J. Call ,  Stephen Anthony DeLaurentis ,  Shaji Farooq ,  Sung Kwon Kang ,  Sampath Purushothaman ,  Kathleen Ann Stalter

IPC分类号： H01L2144

CPC分类号： H05K3/3436 ,  H01L23/49816 ,  H01L2924/0002 ,  H05K3/321 ,  H05K3/3447 ,  H05K3/4015 ,  H05K2201/10234 ,  H05K2201/10333 ,  H05K2201/10962 ,  Y02P70/613 ,  Y10S428/901 ,  Y10T428/12528 ,  Y10T428/24917 ,  Y10T428/256 ,  H01L2924/00

摘要： A socketable ball grid array structure is disclosed which comprises mechanically rigid (compared to solder alloys) balls coated with noble contact metals joined to the chip carrier terminals by means of a novel electrically conducting adhesive. Because of the nature of the filler that includes conducting particles with a fusible coating and the appropriate selection of the polymer resin used in the adhesive, the balls are attached to the module in a compliant and resilient manner while leaving the majority of the bottom surface of the balls pristine. The array of balls can therefore be plugged into mating sockets in a printed circuit board forming a demountable contact. This facilitates easy removal of the socketable BGA from a board for repair or upgrade purposes as well as allows ease of plugging and unplugging of these BGA's into test and burn-in boards.

摘要翻译： 公开了一种可插座的球栅阵列结构，其包括通过新颖的导电粘合剂机械地刚性（与焊料合金相比）涂覆有接合到芯片载体端子的贵金属接触金属的球。 由于包括具有可熔涂层的导电颗粒和粘合剂中使用的聚合物树脂的适当选择的填料的性质，球以顺应性和弹性方式附着到模块上，同时留下了大部分的底表面 球原始。 因此，球阵可以插入形成可拆卸接触的印刷电路板中的配合插座中。 这样便于从板上轻松取出可插拔的BGA，以进行修理或升级，同时也可以方便地将这些BGA插入测试和老化板。

公开(公告)号：US5977625A

公开(公告)日：1999-11-02

申请号：US820397

申请日：1997-03-12

申请人： David Linn Edwards ,  Raed A. Sherif ,  Hilton T. Toy ,  Shaji Farooq ,  Patrick Anthony Coico

发明人： David Linn Edwards ,  Raed A. Sherif ,  Hilton T. Toy ,  Shaji Farooq ,  Patrick Anthony Coico

IPC分类号： H01L23/02 ,  H01L23/04 ,  H01L23/06 ,  H01L23/08 ,  H01L23/10 ,  H01L23/12

CPC分类号： H01L23/10 ,  H01L23/04 ,  H01L2924/0002 ,  H01L2924/09701

摘要： A semi-conductor packaging structure and a method to reduce the seal strain of the package are disclosed. The structure comprises a cap, substrate, seal and the cap and substrate have a predetermined TCE mismatch. The TCE mismatch between the cap and substrate is predetermined to minimize the seal strain during power-on and power-off use conditions. Preferably, the device has a substrate comprises a ceramic material, a cap with a thermal conductivity of at least about 100 W/m-K. A method of selecting a cap material is disclosed.

摘要翻译： 公开了半导体封装结构和减小封装应变的方法。 该结构包括帽，衬底，密封件，帽和衬底具有预定的TCE不匹配。 盖和基板之间的TCE失配是预先确定的，以最小化上电和断电使用条件期间的密封应变。 优选地，该装置具有包括陶瓷材料的基底，具有至少约100W / m-K的热导率的帽。 公开了一种选择盖材料的方法。

公开(公告)号：US5968670A

公开(公告)日：1999-10-19

申请号：US909864

申请日：1997-08-12

申请人： Peter J. Brofman ,  Patrick A. Coico ,  Mark G. Courtney ,  James H. Covell, II ,  Shaji Farooq ,  Lewis S. Goldmann ,  Raymond A. Jackson ,  David C. Linnell ,  Gregory B. Martin ,  Frank L. Pompeo ,  Kathleen A. Stalter ,  Hilton T. Toy

发明人： Peter J. Brofman ,  Patrick A. Coico ,  Mark G. Courtney ,  James H. Covell, II ,  Shaji Farooq ,  Lewis S. Goldmann ,  Raymond A. Jackson ,  David C. Linnell ,  Gregory B. Martin ,  Frank L. Pompeo ,  Kathleen A. Stalter ,  Hilton T. Toy

IPC分类号： B23K35/02 ,  H01L21/60 ,  H01L23/48 ,  H05K3/34 ,  B23K35/14

CPC分类号： H01L24/81 ,  B23K35/0222 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/17 ,  H05K3/3436 ,  H01L2224/10135 ,  H01L2224/13076 ,  H01L2224/131 ,  H01L2224/14051 ,  H01L2224/14505 ,  H01L2224/16058 ,  H01L2224/16227 ,  H01L2224/17051 ,  H01L2224/81136 ,  H01L2224/81139 ,  H01L2224/81801 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/30107 ,  H05K2201/09781 ,  H05K2201/10265 ,  H05K2203/0415 ,  H05K2203/0465 ,  H05K2203/306 ,  Y02P70/613 ,  Y10T428/12222 ,  Y10T428/12333 ,  Y10T428/12486

摘要： A method and apparatus are provided for forming an elongated solder joint between two soldered substrates of an electronic module or an electronic module in the process of being fabricated by using expandable solder bump means disposed between the substrates. The expandable solder bumps means comprise solder having a higher reflow temperature than the solder used to join the substrates and expansion means such as a compressed spring encased within the solder and are activated (expanded) by reflowing at a higher temperature than the melting point temperature of the solder joints.

摘要翻译： 提供了一种方法和装置，用于在通过使用设置在基板之间的可膨胀焊料凸块装置制造过程中，在电子模块或电子模块的两个焊接基板之间形成细长焊接接头。 可膨胀焊料凸点装置包括具有比用于接合基板的焊料更高的回流温度的焊料和诸如包封在焊料内的压缩弹簧的膨胀装置，并且通过在比熔融温度高于 焊点。

公开(公告)号：US5925443A

公开(公告)日：1999-07-20

申请号：US758991

申请日：1991-09-10

申请人： Farid Youssif Aoude ,  Lawrence Daniel David ,  Renuka Shastri Divakaruni ,  Shaji Farooq ,  Lester Wynn Herron ,  Hal Mitchell Lasky ,  Anthony Mastreani ,  Govindarajan Natarajan ,  Srinivasa S. N. Reddy ,  Vivek Madan Sura ,  Rao Venkateswara Vallabhaneni ,  Donald Rene Wall

发明人： Farid Youssif Aoude ,  Lawrence Daniel David ,  Renuka Shastri Divakaruni ,  Shaji Farooq ,  Lester Wynn Herron ,  Hal Mitchell Lasky ,  Anthony Mastreani ,  Govindarajan Natarajan ,  Srinivasa S. N. Reddy ,  Vivek Madan Sura ,  Rao Venkateswara Vallabhaneni ,  Donald Rene Wall

IPC分类号： H01L23/12 ,  H01L21/48 ,  H01L23/498 ,  H05K1/09 ,  H05K3/46 ,  H01B1/06

CPC分类号： H05K1/092 ,  H01L21/486 ,  H01L23/49883 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K3/4611 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/25 ,  Y10T428/252 ,  Y10T428/31678

摘要： A copper-based paste is disclosed for filling vias in, and forming conductive surface patterns on, ceramic substrate packages for semiconductor chip devices. The paste contains copper aluminate powder in proper particle size and weight proportion to achieve grain size and shrinkage control of the via and thick film copper produced by sintering. The shrinkage of the copper material during sintering is closely matched to that of the ceramic substrate.

公开(公告)号：US5874369A

公开(公告)日：1999-02-23

申请号：US761028

申请日：1996-12-05

申请人： Mukta Shaji Farooq ,  Mark Joseph LaPlante

发明人： Mukta Shaji Farooq ,  Mark Joseph LaPlante

IPC分类号： H01L21/02 ,  H01L21/768 ,  C03C25/06

CPC分类号： H01L21/76802 ,  H01L28/55

摘要： Vias are formed in a dielectric film overlying an electrode layer by sweeping a laser beam over the area in which the via is to be formed. In particular, a Nd:YAG laser, producing a beam of light having a 266 nm wave length, effectively ablates a barium strontium titanate dielectric film, without adversely affecting an underlying platinum electrode. The present invention overcomes the problem of wet chemical etching of dielectric films to form vias. Wet chemical etching often requires etchants that adversely affect the underlying metal electrode and typically require the use of environmentally undesirable chemicals.

摘要翻译： 通过在要形成通孔的区域上扫掠激光束，在覆盖电极层的电介质膜中形成通孔。 特别地，产生具有266nm波长的光束的Nd：YAG激光器有效地烧蚀钛酸锶钡电介质膜，而不会对下面的铂电极产生不利影响。 本发明克服了介电膜的湿化学蚀刻形成通孔的问题。 湿式化学蚀刻通常需要对底层金属电极产生不利影响的蚀刻剂，通常需要使用对环境无害的化学品。

公开(公告)号：US5439636A

公开(公告)日：1995-08-08

申请号：US836675

申请日：1992-02-18

申请人： Raschid J. Bezama ,  Jon A. Casey ,  Mario E. Ecker ,  Shaji Farooq ,  Irene S. Frantz ,  Katharine G. Frase ,  David H. Gabriels ,  Lester W. Herron ,  John U. Knickerbocker ,  Sara H. Knickerbocker ,  Govindarajan Natarajan ,  John Thomson ,  Yee-Ming Ting ,  Sharon L. Tracy ,  Robert M. Troncillito ,  Vivek M. Sura ,  Donald R. Wall ,  Giai V. Yen

发明人： Raschid J. Bezama ,  Jon A. Casey ,  Mario E. Ecker ,  Shaji Farooq ,  Irene S. Frantz ,  Katharine G. Frase ,  David H. Gabriels ,  Lester W. Herron ,  John U. Knickerbocker ,  Sara H. Knickerbocker ,  Govindarajan Natarajan ,  John Thomson ,  Yee-Ming Ting ,  Sharon L. Tracy ,  Robert M. Troncillito ,  Vivek M. Sura ,  Donald R. Wall ,  Giai V. Yen

IPC分类号： B28B11/02 ,  H01L21/48 ,  H01L21/768 ,  H01L23/15 ,  H01L23/522 ,  H05K1/03 ,  H05K1/14 ,  H05K3/46 ,  B22F3/00

CPC分类号： H05K1/142 ,  H01L21/4807 ,  H01L23/15 ,  H05K3/46 ,  H05K3/4629 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/0306 ,  H05K2201/09972 ,  Y10T428/12049 ,  Y10T428/12146 ,  Y10T428/16 ,  Y10T428/163 ,  Y10T428/166 ,  Y10T428/192

摘要： A large ceramic substrate article for electronic applications including at least one layer of sintered ceramic material, the layer including a plurality of greensheet segments of ceramic material joined edge to edge. Also disclosed is a method of fabricating a large ceramic greensheet article as well as a large ceramic substrate article.

摘要翻译： 一种用于电子应用的大型陶瓷衬底制品，包括至少一层烧结陶瓷材料，该层包括多个边缘到边缘连接的陶瓷材料毛坯块。 还公开了一种制造大型陶瓷毛坯制品的方法以及大型陶瓷基片制品。

公开(公告)号：US5283104A

公开(公告)日：1994-02-01

申请号：US672272

申请日：1991-03-20

申请人： Farid Y. Aoude ,  Emanuel I. Cooper ,  Peter R. Duncombe ,  Shaji Farooq ,  Edward A. Giess ,  Young-Ho Kim ,  Sarah H. Knickerbocker ,  Friedel Muller-Landau ,  Mark O. Neisser ,  Jae M. Park ,  Robert R. Shaw ,  Robert A. Rita ,  Thomas M. Shaw ,  Rao Vallabhaneni ,  Jon A. Van Hise ,  George F. Walker ,  Jungihl Kim ,  James M. Brownlow, deceased

发明人： Farid Y. Aoude ,  Emanuel I. Cooper ,  Peter R. Duncombe ,  Shaji Farooq ,  Edward A. Giess ,  Young-Ho Kim ,  Sarah H. Knickerbocker ,  Friedel Muller-Landau ,  Mark O. Neisser ,  Jae M. Park ,  Robert R. Shaw ,  Robert A. Rita ,  Thomas M. Shaw ,  Rao Vallabhaneni ,  Jon A. Van Hise ,  George F. Walker ,  Jungihl Kim ,  James M. Brownlow, deceased

IPC分类号： H01B1/16 ,  H01L21/48 ,  H01L23/498 ,  H05K1/03 ,  H05K1/09 ,  H05K3/46 ,  B32B9/00

CPC分类号： H05K1/092 ,  H01B1/16 ,  H01L21/486 ,  H01L21/4867 ,  H01L23/49883 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/0306 ,  H05K3/4611 ,  H05K3/4629 ,  Y10S428/901 ,  Y10T29/49147 ,  Y10T29/49165 ,  Y10T428/12472 ,  Y10T428/12556 ,  Y10T428/12604 ,  Y10T428/12611 ,  Y10T428/24322 ,  Y10T428/24802 ,  Y10T428/25 ,  Y10T428/251 ,  Y10T428/252 ,  Y10T428/2982 ,  Y10T428/2991

摘要： Improved via-filling compositions for producing conductive vias in circuitized ceramic substrates, particularly multilayer substrates, without cracking and/or loss of hermetic sealing. The via-filling compositions comprise pastes containing a mixture of (a) ceramic and/or glass spheres of substantially- uniform diameter between about 0.5 and 6 .mu.m, (b) conductive metal particles or spheres having a maximum dimension or diameter between about 1/3 and 1/4 of the diameter of the ceramic and/or glass spheres, and (c) a binder vehicle. The formed conductive via bodies comprise a uniform conductive skeletal network of sintered metal particles densely packed within a uniform matrix of the co-sintered ceramic and/or glass spheres, which matrix is hermetically fused and integrated with ceramic layers forming the wall of the via in the ceramic circuit substrate.

摘要翻译： 用于在电路化陶瓷衬底，特别是多层衬底中产生导电通孔的改进的通孔填充组合物，不会破裂和/或失去气密密封。 通孔填充组合物包含含有（a）在约0.5和6（my）m之间的基本均匀直径的陶瓷和/或玻璃球的混合物的浆料，（b）具有最大尺寸或直径在 约为陶瓷和/或玻璃球直径的1/3和1/4，和（c）粘合剂载体。 形成的导电通孔体包括致密地包裹在共烧结陶瓷和/或玻璃球的均匀基质内的烧结金属颗粒的均匀导电骨架网络，该基质被气密地融合并与形成通孔壁的陶瓷层成一体 陶瓷电路基板。

公开(公告)号：US06984792B2

公开(公告)日：2006-01-10

申请号：US10427459

申请日：2003-05-01

申请人： Peter J. Brofman ,  Shaji Farooq ,  John U. Knickerbocker ,  Scott I. Langenthal ,  Sudipta K. Ray ,  Kathleen A. Stalter

发明人： Peter J. Brofman ,  Shaji Farooq ,  John U. Knickerbocker ,  Scott I. Langenthal ,  Sudipta K. Ray ,  Kathleen A. Stalter

IPC分类号： H01R12/06

CPC分类号： H05K3/3436 ,  H01L23/49827 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2924/00014 ,  H01L2924/09701 ,  H05K2201/10378 ,  H05K2201/10424 ,  H05K2201/10674 ,  H05K2203/0415 ,  Y02P70/613 ,  Y10T29/49144 ,  Y10T29/49149 ,  H01L2224/05599

摘要： A pre-thermal reflown dielectric interposer having a plurality of vias traversing through the interposer which correspond to the I/O pads on a chip and substrate. Cone shaped solder elements reside within the vias, whereby these solder elements are cone shaped prior to thermal reflow to permit a reduced force for allowing some non-planarity for joining the chip to the substrate. The interposer may comprise a polyester film, glass, alumina, polyimide, a heat curable polymer or an inorganic powder filler in an organic material. The interposer may also have an adhesive or adhesive layers disposed on the linear surfaces thereof. The present pre-thermal reflown interposer prohibits contact between the solder joints by isolating each of the joints and corresponding bonding pads, as well as preventing over compression of the solder joints by acting as a stand off.

摘要翻译： 具有穿过插入件的多个通孔对应于芯片和基板上的I / O焊盘的预热退火介电插入器。 锥形焊料元件驻留在通孔内，由此这些焊料元件在热回流之前是锥形的，以允许减小的力以允许用于将芯片连接到衬底的一些非平面性。 中间层可以在有机材料中包含聚酯膜，玻璃，氧化铝，聚酰亚胺，热固化聚合物或无机粉末填料。 插入器也可以具有设置在其线性表面上的粘合剂或粘合剂层。 本发明的预热反射中介层通过隔离每个接头和相应的接合焊盘来防止焊点之间的接触，并且通过作为脱开来防止焊点过度压缩。

公开(公告)号：US06559527B2

公开(公告)日：2003-05-06

申请号：US09753819

申请日：2001-01-03

申请人： Peter Jeffrey Brofman ,  Shaji Farooq ,  John U. Knickerbocker ,  Scott Ira Langenthal ,  Sudipta Kumar Ray ,  Kathleen Ann Stalter

发明人： Peter Jeffrey Brofman ,  Shaji Farooq ,  John U. Knickerbocker ,  Scott Ira Langenthal ,  Sudipta Kumar Ray ,  Kathleen Ann Stalter

IPC分类号： H01L2302

CPC分类号： H01L24/81 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/0401 ,  H01L2224/05666 ,  H01L2224/05671 ,  H01L2224/0603 ,  H01L2224/06505 ,  H01L2224/10135 ,  H01L2224/11002 ,  H01L2224/11472 ,  H01L2224/1184 ,  H01L2224/13017 ,  H01L2224/13019 ,  H01L2224/13082 ,  H01L2224/13111 ,  H01L2224/13116 ,  H01L2224/14 ,  H01L2224/1403 ,  H01L2224/14051 ,  H01L2224/141 ,  H01L2224/14505 ,  H01L2224/16058 ,  H01L2224/16238 ,  H01L2224/81136 ,  H01L2224/81139 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/351 ,  H05K3/303 ,  H05K3/3436 ,  H05K3/3457 ,  H05K3/3473 ,  H05K2201/10992 ,  H05K2201/2036 ,  H05K2203/0113 ,  H05K2203/0465 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2924/01083 ,  H01L2924/013 ,  H01L2924/00013 ,  H01L2924/00014

摘要： A method of forming non-spherically shaped solder interconnects, preferably conical, for attachment of electronic components in an electronic module. Preferably, the solder interconnects of the present invention are cone shaped and comprise of depositing a first solder followed by a second solder having a lower reflow temperature than the first solder. Warm placement of the electronic component at a somewhat elevated temperature than room temperature but less than the solder reflow temperature reduces the force required during placement of a semiconductor chip to a substrate. After warm placement, reflow of the module occurs at the lower reflow temperature of the second solder. The conical shape of the solder interconnects are formed by a heated coining die which may also coin a portion of the interconnects with flat surfaces for stand-offs. The ability of the cone shaped solder interconnects to meet the opposing surface of a chip or substrate at different heights accommodates the camber typically associated with chip and substrate surfaces.

摘要翻译： 形成用于将电子部件附接到电子模块中的非球形焊料互连（优选为圆锥形）的方法。 优选地，本发明的焊料互连件是锥形的，并且包括沉积第一焊料，接着是具有比第一焊料低的回流温度的第二焊料。 电子部件在比室温略高的温度但低于焊料回流温度的温度放置降低了将半导体芯片放置到衬底期间所需的力。 在温热放置之后，模块的回流在第二焊料的较低回流温度下发生。 焊接互连的圆锥形由加热的压印模具形成，其也可以将一部分互连件用平坦表面硬化以用于支架。 锥形焊料互连件在不同高度处与芯片或基板的相对表面相遇的能力适应通常与芯片和基板表面相关联的外倾。

公开(公告)号：US06333563B1

公开(公告)日：2001-12-25

申请号：US09587944

申请日：2000-06-06

申请人： Raymond A. Jackson ,  Anson J. Call ,  Mark G. Courtney ,  Stephen A. DeLaurentis ,  Mukta S. Farooq ,  Shaji Farooq ,  Lewis S. Goldmann ,  Gregory B. Martin ,  Sudipta K. Ray

发明人： Raymond A. Jackson ,  Anson J. Call ,  Mark G. Courtney ,  Stephen A. DeLaurentis ,  Mukta S. Farooq ,  Shaji Farooq ,  Lewis S. Goldmann ,  Gregory B. Martin ,  Sudipta K. Ray

IPC分类号： H01L2940

CPC分类号： H05K1/141 ,  H01L23/49833 ,  H01L2224/16 ,  H01L2924/01322 ,  H01L2924/09701 ,  H01L2924/12044 ,  H01L2924/15311 ,  H05K3/284 ,  H05K3/3436 ,  H05K3/368 ,  H05K2201/049 ,  H05K2201/10734 ,  H05K2201/10977

摘要： The present invention relates generally to an electrical interconnection package and a method thereof. More particularly, the invention encompasses an invention that increases the fatigue life of a Ball Grid Array (BGA) electrical interconnection. This invention structurally couples at least one module to an organic interposer using a high modulus underfill material. The organic interposer is then joined to a organic board using standard joining processes. The inventive module can then be removed from the organic board at any time by moving the organic interposer using standard rework techniques.

摘要翻译： 本发明一般涉及电互连封装及其方法。 更具体地，本发明包括增加球栅阵列（BGA）电互连的疲劳寿命的发明。 本发明使用高模量底部填充材料将至少一个模块结构地耦合到有机插入件。 然后使用标准连接工艺将有机插入物连接到有机基板。 随后可以通过使用标准返工技术移动有机插入件，随时从有机板上移除本发明的模块。