公开(公告)号：US6158644A

公开(公告)日：2000-12-12

申请号：US70163

申请日：1998-04-30

Applicant: Peter J. Brofman ,  Mark G. Courtney ,  Shaji Farooq ,  Mario J. Interrante ,  Raymond A. Jackson ,  Gregory B. Martin ,  Sudipta K. Ray ,  William E. Sablinski ,  Kathleen A. Stalter

Inventor： Peter J. Brofman ,  Mark G. Courtney ,  Shaji Farooq ,  Mario J. Interrante ,  Raymond A. Jackson ,  Gregory B. Martin ,  Sudipta K. Ray ,  William E. Sablinski ,  Kathleen A. Stalter

IPC: H01L23/12 ,  B23K35/02 ,  B23K35/14 ,  H01L21/60 ,  H01L23/498 ,  H05K3/34 ,  B23K35/24 ,  B23K35/26

CPC classification number: H01L24/12 ,  B23K35/0222 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/16 ,  H05K3/3436 ,  B23K35/0244 ,  H01L2224/1184 ,  H01L2224/13099 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15787 ,  H05K2201/10992 ,  H05K2203/041 ,  H05K2203/0415 ,  H05K2203/0435 ,  Y02P70/613 ,  Y10T428/12687 ,  Y10T428/2991

Abstract: This invention relates to a solder structure which provides enhanced fatigue life properties when used to bond substrates particularly at the second level such as BGA and CGA interconnections. The solder structure is preferably a sphere or column and has a metal layer wettable by solder and the structure is used to make solder connections in electronic components such as joining an electronic module such as a chip connected to a MLC which module is connected to a circuit board. The solder structure preferably has an overcoat of solder on the metal layer to provide a passivation coating to the metal layer to keep it clean from oxidation and corrosion and also provide a wettable surface for attachment of the solder structure to solder on the pads of the substrate being bonded.

Abstract translation: 本发明涉及一种焊料结构，当用于特别是在第二层（例如BGA和CGA互连）的基材上时，其提供增强的疲劳寿命特性。 焊料结构优选是球形或柱状，并且具有可被焊料润湿的金属层，并且该结构用于在电子部件中形成焊接连接​​，例如连接诸如连接到MLC的芯片的电子模块，该模块连接到电路 板。 焊料结构优选地在金属层上具有焊料的外涂层，以向金属层提供钝化涂层以保持其免于氧化和腐蚀，并且还提供用于将焊料结构附着到衬底的焊盘上的焊料的可润湿表面 被绑定。

公开(公告)号：US5975409A

公开(公告)日：1999-11-02

申请号：US909865

申请日：1997-08-12

Applicant: Peter J. Brofman ,  Patrick A. Coico ,  Mark G. Courtney ,  Shaji Farooq ,  Lewis S. Goldmann ,  Raymond A. Jackson ,  David C. Linnell ,  Gregory B. Martin ,  Frank L. Pompeo ,  Kathleen A. Stalter ,  Hilton T. Toy

Inventor： Peter J. Brofman ,  Patrick A. Coico ,  Mark G. Courtney ,  Shaji Farooq ,  Lewis S. Goldmann ,  Raymond A. Jackson ,  David C. Linnell ,  Gregory B. Martin ,  Frank L. Pompeo ,  Kathleen A. Stalter ,  Hilton T. Toy

IPC: H01L21/60 ,  H05K3/34 ,  B23K31/02 ,  B23K37/04

CPC classification number: H01L24/81 ,  H01L24/75 ,  H05K3/3436 ,  H01L2224/16 ,  H01L2224/75 ,  H01L2224/75743 ,  H01L2224/81801 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/30107 ,  H05K2203/0195 ,  H05K2203/0465 ,  H05K2203/082 ,  H05K2203/306 ,  Y02P70/613

Abstract: A method and apparatus is provided for forming an elongated solder joint between two soldered substrates of an electronic module by applying a controlled separating force between the two soldered substrates during and/or after heating of the module. The solder joints are plasticized, preferably to the molten state above the liquidus temperature, and are thereby stretched and the module is then cooled to solidify the stretched joints. An apparatus and method are provided which preferably uses a vacuum device as the separating force to stretch the existing solder joints to the desired solder height and configuration which is preferably an hour-glass shape.

Abstract translation: 提供了一种方法和装置，用于在电子模块的两个焊接的基板之间通过在模块的加热期间和/或之后施加受控的分离力来在两个焊接的基板之间形成细长的焊接接头。 焊接接头被塑化，优选地熔化到高于液相线温度的熔融状态，并且由此被拉伸，然后将模块冷却以固化拉伸接头。 提供了一种优选使用真空装置作为将现有焊料接头拉伸到期望的焊料高度和优选为沙漏形状的构造的分离力的装置和方法。

公开(公告)号：US06984792B2

公开(公告)日：2006-01-10

申请号：US10427459

申请日：2003-05-01

Applicant: Peter J. Brofman ,  Shaji Farooq ,  John U. Knickerbocker ,  Scott I. Langenthal ,  Sudipta K. Ray ,  Kathleen A. Stalter

Inventor： Peter J. Brofman ,  Shaji Farooq ,  John U. Knickerbocker ,  Scott I. Langenthal ,  Sudipta K. Ray ,  Kathleen A. Stalter

IPC: H01R12/06

CPC classification number: H05K3/3436 ,  H01L23/49827 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2924/00014 ,  H01L2924/09701 ,  H05K2201/10378 ,  H05K2201/10424 ,  H05K2201/10674 ,  H05K2203/0415 ,  Y02P70/613 ,  Y10T29/49144 ,  Y10T29/49149 ,  H01L2224/05599

Abstract: A pre-thermal reflown dielectric interposer having a plurality of vias traversing through the interposer which correspond to the I/O pads on a chip and substrate. Cone shaped solder elements reside within the vias, whereby these solder elements are cone shaped prior to thermal reflow to permit a reduced force for allowing some non-planarity for joining the chip to the substrate. The interposer may comprise a polyester film, glass, alumina, polyimide, a heat curable polymer or an inorganic powder filler in an organic material. The interposer may also have an adhesive or adhesive layers disposed on the linear surfaces thereof. The present pre-thermal reflown interposer prohibits contact between the solder joints by isolating each of the joints and corresponding bonding pads, as well as preventing over compression of the solder joints by acting as a stand off.

Abstract translation: 具有穿过插入件的多个通孔对应于芯片和基板上的I / O焊盘的预热退火介电插入器。 锥形焊料元件驻留在通孔内，由此这些焊料元件在热回流之前是锥形的，以允许减小的力以允许用于将芯片连接到衬底的一些非平面性。 中间层可以在有机材料中包含聚酯膜，玻璃，氧化铝，聚酰亚胺，热固化聚合物或无机粉末填料。 插入器也可以具有设置在其线性表面上的粘合剂或粘合剂层。 本发明的预热反射中介层通过隔离每个接头和相应的接合焊盘来防止焊点之间的接触，并且通过作为脱开来防止焊点过度压缩。

公开(公告)号：US06258625B1

公开(公告)日：2001-07-10

申请号：US09315374

申请日：1999-05-18

Applicant: Peter J. Brofman ,  Sudipta K. Ray ,  Kathleen A. Stalter

Inventor： Peter J. Brofman ,  Sudipta K. Ray ,  Kathleen A. Stalter

IPC: H01L2144

CPC classification number: H01L24/81 ,  H01L23/49827 ,  H01L2224/13147 ,  H01L2224/81801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/3511 ,  H05K3/325 ,  H05K2201/0367 ,  H05K2201/09481 ,  H05K2201/10378 ,  H01L2924/00

Abstract: A method of interconnecting electronic components by using a plurality of conductive studs on a surface of a first electronic component and a plurality of corresponding conductive vias on the surface of a second electronic component. Camber on the surface of electronic components may be overcome by coating the surface with a dielectric, planarizing the dielectric, and forming conductive vias corresponding to the contact pads thereon. The conductive studs are substantially lead-free and preferably comprise of copper.

Abstract translation: 一种通过使用第一电子部件的表面上的多个导电柱和在第二电子部件的表面上的多个对应的导电通孔来互连电子部件的方法。 可以通过用电介质涂覆表面来平衡电介质，并形成对应于其上的接触焊盘的导电通孔来克服电子部件表面上的弯曲。 导电柱基本上是无铅的，优选地包括铜。

公开(公告)号：US06253986B1

公开(公告)日：2001-07-03

申请号：US09400784

申请日：1999-09-22

Applicant: Peter J. Brofman ,  Patrick A. Coico ,  Mark G. Courtney ,  Lewis S. Goldmann ,  Raymond A. Jackson ,  William E. Sablinski ,  Kathleen A. Stalter ,  Hilton T. Toy ,  Li Wang

Inventor： Peter J. Brofman ,  Patrick A. Coico ,  Mark G. Courtney ,  Lewis S. Goldmann ,  Raymond A. Jackson ,  William E. Sablinski ,  Kathleen A. Stalter ,  Hilton T. Toy ,  Li Wang

IPC: B23K3514

CPC classification number: H01L24/12 ,  B23K1/0016 ,  B23K2101/42 ,  H01L23/10 ,  H01L23/50 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/0401 ,  H01L2224/06102 ,  H01L2224/13099 ,  H01L2224/1403 ,  H01L2224/81801 ,  H01L2224/83101 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15787 ,  H05K3/3436 ,  H05K2201/1025 ,  H05K2201/10992 ,  H05K2203/0415 ,  Y02P70/613 ,  Y10T29/49144 ,  H01L2924/00

Abstract: A solder preform is provided for forming interconnections between multilayer ceramic substrates comprising an upper layer and lower layer of solder separated by an intermediate layer of a material which is wettable by solder and which does not melt at the temperatures used to reflow the solder and form the connections. The solder preform is used to join the substrates and is particularly useful to simultaneously electrically interconnect the substrates and to form a hermetic seal between the substrates being joined.

Abstract translation: 提供焊料预成型件，用于在多层陶瓷基片之间形成互连，包括上层和下层焊料，该材料由可由焊料润湿的材料的中间层分开，并且在用于回流焊料的温度下不熔化，形成 连接。 焊料预成型件用于连接基板，并且特别可用于同时电连接基板并且在被接合的基板之间形成气密密封。

公开(公告)号：US06657313B1

公开(公告)日：2003-12-02

申请号：US09233385

申请日：1999-01-19

Applicant: Peter J. Brofman ,  Shaji Faroon ,  John U. Knickerbocker ,  Scott I. Langenthal ,  Sudipta K. Ray ,  Kathleen A. Stalter

Inventor： Peter J. Brofman ,  Shaji Faroon ,  John U. Knickerbocker ,  Scott I. Langenthal ,  Sudipta K. Ray ,  Kathleen A. Stalter

IPC: H01L2348

CPC classification number: H05K3/3436 ,  H01L23/49827 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2924/00014 ,  H01L2924/09701 ,  H05K2201/10378 ,  H05K2201/10424 ,  H05K2201/10674 ,  H05K2203/0415 ,  Y02P70/613 ,  Y10T29/49144 ,  Y10T29/49149 ,  H01L2224/05599

Abstract: A device for preventing short circuits between solder joints in flip chip packaging. The dielectric interposer has a plurality of apertures or vias which correspond to the I/O pads on a chip and substrate. Preferably, the interposer comprises a polyester film, glass, alumina, polyimide, a heat curable polymer or an inorganic powder filler in an organic material. More preferably, the interposer contains an adhesive or has adhesive layers disposed on the linear surfaces of the interposer. Cone shaped solder elements are formed within the apertures of the interposer. The dielectric interposer is positioned between a chip and substrate in an electronic module and thermally reflowed to create an electrical and mechanical interconnection. The interposer prohibits contact between the solder joints by isolating each of the joints and corresponding bonding pads. The interposer also prevents over compression of the solder joints by acting as a stand off.

Abstract translation: 一种用于防止倒装芯片封装中焊点之间短路的装置。 电介质插入件具有与芯片和基板上的I / O焊盘对应的多个孔或通孔。 优选地，中间层包括有机材料中的聚酯膜，玻璃，氧化铝，聚酰亚胺，可热固化聚合物或无机粉末填料。 更优选地，插入件包含粘合剂或者具有设置在插入件的线性表面上的粘合剂层。 锥形焊料元件形成在插入件的孔内。 电介质插入件位于电子模块中的芯片和衬底之间并被热回流以产生电气和机械互连。 插入器通过隔离每个接头和相应的接合焊盘来禁止焊点之间的接触。 插入器还通过作为支架来防止焊点的过度压缩。

公开(公告)号：US06216937B1

公开(公告)日：2001-04-17

申请号：US09470455

申请日：1999-12-22

Applicant: Stephen A. DeLaurentis ,  Mario J. Interrante ,  Raymond A. Jackson ,  John U. Knickerbocker ,  Sudipta K. Ray ,  Kathleen A. Stalter

Inventor： Stephen A. DeLaurentis ,  Mario J. Interrante ,  Raymond A. Jackson ,  John U. Knickerbocker ,  Sudipta K. Ray ,  Kathleen A. Stalter

IPC: B23K100

CPC classification number: H01L21/687 ,  B23K1/018 ,  H01L24/98

Abstract: A process and apparatus for removing flip chips with C4 joints mounted on a multi-chip module by applying a tensile force to one or more removal member bonded to the back of one or more flip chips during heating of the module to a temperature sufficient to cause the C4 joints to become molten. The tensile force can either be a compressed spring, or a bimetallic member which is flat at room temperature and becomes curved when heated to such temperature, or a memory alloy whose original shape is curved and which is bent flat at room temperature but returns to its original curved shape when heated to such temperature. An adhesive is used to bond the removal member to the chip to be removed and is a low temperature, fast curing adhesive with high temperature tolerance after curing.

Abstract translation: 一种用于通过在将模块加热到足以导致的温度的温度下向一个或多个倒装芯片的背面施加张力而将一个或多个去除构件施加拉力而移除通过安装在多芯片模块上的C4接头的倒装芯片的方法和装置 C4接头变得熔化。 张力可以是压缩弹簧，也可以是在室温下平坦并在加热到这样的温度时变得弯曲的双金属构件，或者原始形状是弯曲的并且在室温下弯曲平坦但回到其中的记忆合金 原来弯曲的形状加热到这样的温度。 使用粘合剂将去除构件粘合到要去除的芯片上，并且是固化后具有耐高温性的低温快速固化粘合剂。

公开(公告)号：US5968670A

公开(公告)日：1999-10-19

申请号：US909864

申请日：1997-08-12

Applicant: Peter J. Brofman ,  Patrick A. Coico ,  Mark G. Courtney ,  James H. Covell, II ,  Shaji Farooq ,  Lewis S. Goldmann ,  Raymond A. Jackson ,  David C. Linnell ,  Gregory B. Martin ,  Frank L. Pompeo ,  Kathleen A. Stalter ,  Hilton T. Toy

Inventor： Peter J. Brofman ,  Patrick A. Coico ,  Mark G. Courtney ,  James H. Covell, II ,  Shaji Farooq ,  Lewis S. Goldmann ,  Raymond A. Jackson ,  David C. Linnell ,  Gregory B. Martin ,  Frank L. Pompeo ,  Kathleen A. Stalter ,  Hilton T. Toy

IPC: B23K35/02 ,  H01L21/60 ,  H01L23/48 ,  H05K3/34 ,  B23K35/14

CPC classification number: H01L24/81 ,  B23K35/0222 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/17 ,  H05K3/3436 ,  H01L2224/10135 ,  H01L2224/13076 ,  H01L2224/131 ,  H01L2224/14051 ,  H01L2224/14505 ,  H01L2224/16058 ,  H01L2224/16227 ,  H01L2224/17051 ,  H01L2224/81136 ,  H01L2224/81139 ,  H01L2224/81801 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/30107 ,  H05K2201/09781 ,  H05K2201/10265 ,  H05K2203/0415 ,  H05K2203/0465 ,  H05K2203/306 ,  Y02P70/613 ,  Y10T428/12222 ,  Y10T428/12333 ,  Y10T428/12486

Abstract: A method and apparatus are provided for forming an elongated solder joint between two soldered substrates of an electronic module or an electronic module in the process of being fabricated by using expandable solder bump means disposed between the substrates. The expandable solder bumps means comprise solder having a higher reflow temperature than the solder used to join the substrates and expansion means such as a compressed spring encased within the solder and are activated (expanded) by reflowing at a higher temperature than the melting point temperature of the solder joints.

Abstract translation: 提供了一种方法和装置，用于在通过使用设置在基板之间的可膨胀焊料凸块装置制造过程中，在电子模块或电子模块的两个焊接基板之间形成细长焊接接头。 可膨胀焊料凸点装置包括具有比用于接合基板的焊料更高的回流温度的焊料和诸如包封在焊料内的压缩弹簧的膨胀装置，并且通过在比熔融温度高于 焊点。

公开(公告)号：US06278184B1

公开(公告)日：2001-08-21

申请号：US09400783

申请日：1999-09-22

Applicant: Peter J. Brofman ,  Patrick A. Coico ,  Mark G. Courtney ,  Lewis S. Goldmann ,  Raymond A. Jackson ,  William E. Sablinski ,  Kathleen A. Stalter ,  Hilton T. Toy ,  Li Wang

Inventor： Peter J. Brofman ,  Patrick A. Coico ,  Mark G. Courtney ,  Lewis S. Goldmann ,  Raymond A. Jackson ,  William E. Sablinski ,  Kathleen A. Stalter ,  Hilton T. Toy ,  Li Wang

IPC: H01L2348

CPC classification number: H01L24/12 ,  B23K1/0016 ,  B23K2101/42 ,  H01L23/10 ,  H01L23/50 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/0401 ,  H01L2224/06102 ,  H01L2224/13099 ,  H01L2224/1403 ,  H01L2224/81801 ,  H01L2224/83101 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15787 ,  H05K3/3436 ,  H05K2201/1025 ,  H05K2201/10992 ,  H05K2203/0415 ,  Y02P70/613 ,  Y10T29/49144 ,  H01L2924/00

Abstract: A solder preform is provided for forming interconnections between multilayer ceramic substrates comprising an upper layer and lower layer of solder separated by an intermediate layer of a material which is wettable by solder and which does not melt at the temperatures used to reflow the solder and form the connections. The solder preform is used to join the substrates and is particularly useful to simultaneously electrically interconnect the substrates and to form a hermetic seal between the substrates being joined.

公开(公告)号：US06270363B1

公开(公告)日：2001-08-07

申请号：US09315373

申请日：1999-05-18

Applicant: Peter J. Brofman ,  John U. Knickerbocker ,  Sudipta K. Ray ,  Kathleen A. Stalter

Inventor： Peter J. Brofman ,  John U. Knickerbocker ,  Sudipta K. Ray ,  Kathleen A. Stalter

IPC: H01R458

CPC classification number: H01L24/29 ,  H01L24/83 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/293 ,  H01L2224/81101 ,  H01L2224/83101 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01R12/52 ,  H01R13/2414 ,  H01R43/0256 ,  H05K3/321 ,  H05K2201/0129 ,  H05K2201/0154 ,  H05K2201/0162 ,  H05K2201/0272 ,  H05K2201/0284 ,  H05K2201/09945 ,  H05K2201/10378 ,  H05K2203/0425 ,  H01L2924/00 ,  H01L2224/05599

Abstract: A compressible interposer comprising an interposer sheet having a plurality of apertures filled with a dielectric material having a substantially uniform suspension of conductive particles therein forming a plurality of conductive sites. Preferably, the number of conductive sites on the interposer are greater in number than the number of contact pads on the electronic components such that precise alignment of the interposer between the electronic components is not required. The apertures of the interposer sheet confine the conductive particles within the dielectric material such that during compression of the interposer between the electronic components, z-axis conductive pathways are formed without shorting in the x and y directions. Preferably, the interposer sheet comprises polyimide. Preferably, the dielectric material comprises polyimide-siloxane. Preferably, the conductive particles have a diameter of about 2 to about 20 &mgr;m and comprise of a material selected from the group consisting of copper, gold, silver, nickel, palladium, platinum, and alloys thereof. The particles may also be coated with an additional conductive material such as solder having a lower melting temperature. Most preferably, the conductive particles comprise solder coated copper particles. The conductive particles are present in an amount of about 30 to about 90 wt. % of the total weight of the conductive particles and the dielectric material.

Abstract translation: 一种可压缩插入件，其包括插入片，所述插入片具有填充有形成多个导电部位的导电粒子的基本均匀悬浮液的电介质材料的多个孔。 优选地，内插器上的导电位置的数量大于电子部件上的接触焊盘的数量，使得不需要电子部件之间的插入器的精确对准。 插入片的孔径将导电粒子限制在电介质材料内，使得在电子部件之间的插入件压缩期间，在x和y方向上形成z轴传导路径而不会短路。 优选地，插入片包括聚酰亚胺。 优选地，电介质材料包括聚酰亚胺 - 硅氧烷。 优选地，导电颗粒的直径为约2至约20μm，并且包括选自铜，金，银，镍，钯，铂及其合金的材料。 颗粒也可以涂覆有另外的导电材料，例如具有较低熔融温度的焊料。 最优选地，导电颗粒包括焊料涂覆的铜颗粒。 导电颗粒的存在量为约30至约90wt。 导电颗粒和电介质材料的总重量的百分比。