公开(公告)号：US06733308B2

公开(公告)日：2004-05-11

申请号：US10175653

申请日：2002-06-19

Applicant: Hans Jedlitschka

Inventor： Hans Jedlitschka

IPC: H01R458

CPC classification number: H01R4/72 ,  H01B1/22 ,  H01B1/24 ,  H01R31/005

Abstract: A coating element for an electrical junction or circuit that reduces surface electric field densities. The coating element comprises a layer of plastic material laden within or in which there is dispersed conductive particles. The coating element surrounds the junction or circuit such that an inner layer or surface of the element is in contact with the outer layer or surface of the junction or circuit. The plastic material may be an elastomer, a polymer, a polyurethane or a silicone. The conductive particles may be a metal powder of aluminum or stainless steel or graphite. The resistivity of the coating element is between about 1 ohm-cm to about 100 kilohm-cm.

Abstract translation: 用于电连接或电路的涂层元件，其减小表面电场密度。 涂层元件包括一层塑料材料，其中有一层分散的导电颗粒。 涂层元件围绕结或电路，使得元件的内层或表面与结或电路的外层或表面接触。 塑料材料可以是弹性体，聚合物，聚氨酯或硅树脂。 导电颗粒可以是铝或不锈钢或石墨的金属粉末。 涂层元件的电阻率在约1欧姆 - 约100千欧姆 - 厘米之间。

公开(公告)号：US06669490B1

公开(公告)日：2003-12-30

申请号：US10315298

申请日：2002-12-10

Applicant: Stephen D. DelPrete ,  Peter D. Wapenski

Inventor： Stephen D. DelPrete ,  Peter D. Wapenski

IPC: H01R458

CPC classification number: H01R12/52 ,  H01R13/2414 ,  H05K3/325 ,  H05K3/368

Abstract: A connector for board-to-board and board to device interconnect applications includes a plurality of conductive elastomeric columnar contacts surrounded by respective insulative support columns. The elastomeric columnar contacts extend through holes in an insulative subtrate. The insulative support columns have opposing end surfaces disposed on opposite sides of a substrate and end surfaces of the columnar contacts are located at a distance from the substrate slightly greater than the distance between the substrate and the support column end surfaces. Insulative intermediate columns serve a mechanical stops that resist further compression of the elastomeric contacts and the support columns when the connector is subjected to excessive axial compressive forces. The intermediate columns have opposing end surfaces on opposing sides of the substrate that are spaced from the substrate a distance less than the support column end surfaces.

Abstract translation: 用于板对板和板对器件互连应用的连接器包括由相应的绝缘支撑柱包围的多个导电弹性柱状接触。 弹性体柱状触点以绝缘子墨滴延伸穿过孔。 绝缘支撑柱具有设置在基板的相对侧上的相对的端面，并且柱状触点的端面位于离衬底稍远大于衬底和支撑柱端面之间的距离处。 当连接器受到过大的轴向压缩力时，绝缘中间柱用于抵抗弹性触点和支撑柱的进一步压缩的机械止动件。 中间柱在基板的相对侧上具有与基板相距一定距离小于支撑柱端面的相对端面。

公开(公告)号：US06497583B1

公开(公告)日：2002-12-24

申请号：US09970072

申请日：2001-10-03

Applicant: Roger E. Weiss ,  Everett F. Simons

Inventor： Roger E. Weiss ,  Everett F. Simons

IPC: H01R458

CPC classification number: H01R13/2414 ,  H01R43/007

Abstract: An interconnection component with integral conductive elastomeric sheet material, comprising a connector frame and an elastomeric conductive polymer interface (ECPI) integrally coupled to the connector frame, the ECPI defining a series of spaced conductive columns through its thickness. Also described is a method of forming an interconnection component with integral conductive elastomeric sheet material, comprising providing a connector frame, casting uncured elastomeric conductive polymer interface (ECPI) material onto the connector frame, and curing the ECPI in the presence of a magnetic field, to integrally couple the ECPI to the connector frame, and create a series of spaced conductive columns through the ECPI thickness.

Abstract translation: 具有整体的导电弹性体片材的互连部件包括连接器框架和与连接器框架整体连接的弹性体导电聚合物界面（ECPI），ECPI通过其厚度限定一系列间隔开的导电柱。 还描述了一种形成具有整体的导电弹性体片材的互连部件的方法，包括提供连接器框架，将未固化的弹性体导电聚合物界面（ECPI）材料铸造到连接器框架上，以及在存在磁场的情况下固化ECPI， 将ECPI整体耦合到连接器框架，并通过ECPI厚度创建一系列间隔开的导电柱。

公开(公告)号：US06422879B1

公开(公告)日：2002-07-23

申请号：US09789963

申请日：2001-02-22

Applicant: Takuma Fujimura

Inventor： Takuma Fujimura

IPC: H01R458

Abstract: An IC or testing socket is provided, which ensures stable electrical connection of an IC or semiconductor device to be tested to the circuit board of a test apparatus. This socket comprises: (a) a socket body made of a rigid material; the body having penetrating openings; (b) anisotropically conductive members formed in the respective openings of the body; each of the anisotropically conductive members being made of an elastic, insulating material, first conductive particles dispersed in the material, and second conductive particles dispersed in the material; the first and second conductive particles being different in average diameter from each other; and (c) a guide for receiving a semiconductor device to be tested and guiding the device toward the conductive members in the body; the guide being fixed to the body in such a way that electrodes of the device are contacted with the corresponding conductive members in the body.

公开(公告)号：US06312266B1

公开(公告)日：2001-11-06

申请号：US09645860

申请日：2000-08-24

Applicant: Zhineng Fan ,  Ai D. Le ,  Che-Yu Li

Inventor： Zhineng Fan ,  Ai D. Le ,  Che-Yu Li

IPC: H01R458

CPC classification number: H01R12/7005 ,  H01R13/2414 ,  Y10T29/4921

Abstract: The present invention provides a carrier that provides improved retention to the individual contact elements resulting in LGA interposer connectors with improved manufacturability, reliability and more uniform mechanical and electrical performance. In one embodiment, the carrier, which includes upper and lower sections of dielectric material with an adhesive layer in between, includes a plurality of openings, each of which may contain an individual contact element. During assembly of the connector, once the contact elements are inserted, the adhesive layer is reflowed, thereby allowing the carrier to capture the location of the contact elements both with respect to each other as well as to the carrier. Alternately, the carrier may be implemented in a fashion that, while not including an adhesive layer to be reflowed, still provides improved retention of the individual contact elements. These embodiments may by easier to assemble, and less expensive to manufacture, especially in high volumes. Description of the processes to assemble the carrier and overall connector are also disclosed.

Abstract translation: 本发明提供一种载体，其提供改进的保持性，从而导致具有改进的可制造性，可靠性和更均匀的机械和电气性能的LGA插入器连接器。 在一个实施例中，包括介电材料的上部和下部在其间具有粘合剂层的载体包括多个开口，每个开口可以包含单独的接触元件。 在连接器的组装期间，一旦接触元件被插入，粘合剂层被回流，从而允许载体相对于彼此以及对载体捕获接触元件的位置。 或者，载体可以以不包括要回流的粘合剂层的方式实现，仍然提供改进的各个接触元件的保持性。 这些实施例可以更容易组装，并且制造成本更低，特别是在大体积中。 还公开了组装载体和整体连接器的过程的描述。

公开(公告)号：US06626684B1

公开(公告)日：2003-09-30

申请号：US10178124

申请日：2002-06-24

Applicant: Heather Lea Stickler ,  Samuel Martin Babb ,  Paul Howard Mazurkiewicz

Inventor： Heather Lea Stickler ,  Samuel Martin Babb ,  Paul Howard Mazurkiewicz

IPC: H01R458

CPC classification number: B82Y10/00 ,  H01R12/52 ,  H01R12/714 ,  H05K7/1061 ,  Y10S977/734

Abstract: A socket comprises a substrate having a plurality of cavities extending therethrough. The socket also comprises an electrically-conductive carbon nanotube structure disposed within at least one of the cavities.

Abstract translation: 插座包括具有延伸穿过其中的多个空腔的基板。 插座还包括设置在至少一个空腔内的导电碳纳米管结构。

公开(公告)号：US06568943B2

公开(公告)日：2003-05-27

申请号：US09982432

申请日：2001-10-18

Applicant: Yoshisada Okayasu ,  Kiyoshi Tomura ,  Shun Kayama ,  Naoyuki Ono

Inventor： Yoshisada Okayasu ,  Kiyoshi Tomura ,  Shun Kayama ,  Naoyuki Ono

IPC: H01R458

CPC classification number: H01R13/112

Abstract: A connection device for electrically connecting a contact 304 of an equipment with a board 36 in a battery 100, the device comprising a housing 41 having an aperture 40H, and a connection terminal 300 arranged within the housing 41 correspondingly to the aperture 40H, the connection terminal having a plurality of first connecting parts 302 for pinching and holding the contact 304 of the equipment so as to be electrically connected with the contact 304 of the equipment and a plurality of second connecting parts 303 provided integrally with the plurality of first connecting parts 302 for pinching the board 36 to electrically connect the plurality of first connecting parts 302 with the contact 304 of the equipment.

公开(公告)号：US06425772B1

公开(公告)日：2002-07-30

申请号：US09911270

申请日：2001-07-23

Applicant: William E. Bernier ,  Edward G. Bundga

Inventor： William E. Bernier ,  Edward G. Bundga

IPC: H01R458

CPC classification number: H01L24/83 ,  H01L24/29 ,  H01L2224/2919 ,  H01L2224/29499 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/14 ,  H01R4/04 ,  H01R12/52 ,  H05K3/321 ,  H05K2201/0129 ,  H05K2201/0218 ,  H05K2201/0245 ,  H05K2201/10977 ,  H05K2203/0307 ,  Y10T428/12569 ,  H01L2924/00

Abstract: Forming an isotropic electrical connection and a mechanical bond between two articles having metal surfaces. The resulting bond is preferably between metal contact pads on a dielectric substrate and on an electronic device. The connection is provided by utilizing a conductive adhesive wherein the conduction is provided by metal particles which have exposed palladium thereon. The particles may be the metal palladium itself or it may be some other metal, such as silver, having palladium coated thereon. The particles typically are flakes with the palladium having an incipient dendritic form on the surface, i.e.; the palladium has a multi-pointed surface configuration that can grow into fully formed needle-like dendritic structures. The polymer preferably is conventional polyimide/siloxane which is a thermoplastic, i.e. upon heating softens and upon cooling sets, and upon reheating will soften and reflow.

Abstract translation: 在具有金属表面的两个制品之间形成各向同性的电连接和机械结合。 所得到的结合优选在电介质基底上的金属接触焊盘和电子器件之间。 通过使用导电粘合剂提供连接，其中导电由其上具有暴露的钯的金属颗粒提供。 颗粒可以是金属钯本身，或者它可以是一些其它金属，例如银，其上涂覆有钯。 颗粒通常是表面上具有初始树枝状形式的钯的薄片，即， 钯具有可以生长成完全形成的针状树枝状结构的多点表面构型。 聚合物优选是热塑性的常规聚酰亚胺/硅氧烷，即加热时软化和冷却组合，并且在再加热时将软化和回流。

公开(公告)号：US06331118B1

公开(公告)日：2001-12-18

申请号：US09334727

申请日：1999-06-17

Applicant: Hiroaki Ono ,  Masanori Hirano

Inventor： Hiroaki Ono ,  Masanori Hirano

IPC: H01R458

CPC classification number: G01R1/0416

Abstract: An electrode spacing conversion adaptor is formed of a plurality of sheet elements having top and bottom electrodes arrayed at different intervals along upper and lower ends of each sheet element, respectively, wherein the top electrodes are individually connected to their corresponding bottom electrodes by intermediate conductors. The individual sheet elements are angled such that the upper portions of the sheet elements carrying the top electrodes are stacked at intervals different from intervals at which the lower portions carrying the bottom electrodes are stacked. The individual sheet elements may be stacked to form laminated pieces in such a way that the bottom electrodes are concentrated in a small area while the top electrodes are distributed over a larger area at greater intervals in two horizontal directions. In this construction, the geometric arrangement of any two test points selected on a fine-pitch conductor pattern of a printed wiring board is enlarged at the top electrodes and electrical connections from the test points to external test equipment can be easily established.

Abstract translation: 电极间隔转换适配器由多个片状元件形成，所述多个片状元件分别具有沿着每个片状元件的上端和下端以不同间隔排列的顶部和底部电极，其中顶部电极通过中间导体单独地连接到它们对应的底部电极。 单个片材元件成角度，使得承载顶部电极的片材元件的上部以与承载底部电极的下部堆叠的间隔不同的方式堆叠。 单个片材元件可以堆叠形成层压件，使得底部电极集中在小的区域中，同时顶部电极在两个水平方向上以更大的间隔分布在较大的区域上。 在这种结构中，在印刷电路板的精细间距导体图案上选择的任何两个测试点的几何排列在顶部电极处扩大，并且可以容易地建立从测试点到外部测试设备的电气连接。

公开(公告)号：US06280208B1

公开(公告)日：2001-08-28

申请号：US09542275

申请日：2000-04-04

Applicant: Satoki Masuda ,  Shigemi Hashizawa ,  Kazuhisa Ishizaki

Inventor： Satoki Masuda ,  Shigemi Hashizawa ,  Kazuhisa Ishizaki

IPC: H01R458

CPC classification number: H01R4/64 ,  H01R13/6593 ,  H01R13/6596 ,  H01R13/74 ,  H02K11/40

Abstract: A shield member is closely contacted with a first seal member 3 projecting in the axial direction of a housing, and a second seal member is closely contacted with the outside thereof. A hole at the housing side is communicated with a long hole of a shield member in the movable range of a projecting portion and an engaging portion. The housing can be conductive. The housing and the shield member can be provided integrally. The housing includes a flange portion and ring walls. The ring wall fitted in a first stage ring portion of the shield member is contacted with a hole portion, the seal member is fitted with the outside of the seal member fitted with a second stage ring portion, and a shield electric wire is connected with a third stage ring portion by a shield sleeve. The ring portions can be provided in two steps, with a large diameter portion of a first seal member fitted into a first stage ring portion, and a second seal member provided at the opening end of the hole portion. A drain hole of the housing, a stopper holder and a cushion ring are provided.

Abstract translation: 屏蔽构件与沿壳体的轴向突出的第一密封构件3紧密接触，第二密封构件与其外部紧密接触。 壳体侧的孔与突出部和接合部的可动范围内的屏蔽部件的长孔连通。 外壳可以导电。 壳体和屏蔽构件可以一体地设置。 壳体包括凸缘部分和环形壁。 安装在屏蔽部件的第一级环部的环壁与孔部接触，密封部件与装配有第二级环部的密封部件的外侧嵌合，并且屏蔽电线与 第三级环部分由屏蔽套管。 环部分可以分成两个阶段，第一密封件的大直径部分嵌入第一阶段环部分，第二密封件设置在孔部分的开口端。 提供了壳体的排水孔，止动器保持器和缓冲环。