Invention Grant
- Patent Title: Semiconductor package with low strain seal
- Patent Title (中): 具有低应变密封的半导体封装
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Application No.: US820397Application Date: 1997-03-12
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Publication No.: US5977625APublication Date: 1999-11-02
- Inventor: David Linn Edwards , Raed A. Sherif , Hilton T. Toy , Shaji Farooq , Patrick Anthony Coico
- Applicant: David Linn Edwards , Raed A. Sherif , Hilton T. Toy , Shaji Farooq , Patrick Anthony Coico
- Applicant Address: NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: NY Armonk
- Main IPC: H01L23/02
- IPC: H01L23/02 ; H01L23/04 ; H01L23/06 ; H01L23/08 ; H01L23/10 ; H01L23/12
Abstract:
A semi-conductor packaging structure and a method to reduce the seal strain of the package are disclosed. The structure comprises a cap, substrate, seal and the cap and substrate have a predetermined TCE mismatch. The TCE mismatch between the cap and substrate is predetermined to minimize the seal strain during power-on and power-off use conditions. Preferably, the device has a substrate comprises a ceramic material, a cap with a thermal conductivity of at least about 100 W/m-K. A method of selecting a cap material is disclosed.
Public/Granted literature
- US4102370A Portable router attachment Public/Granted day:1978-07-25
Information query
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