公开(公告)号：US5552232A

公开(公告)日：1996-09-03

申请号：US361351

申请日：1994-12-21

Applicant: Jon A. Casey ,  Carla N. Cordero ,  Benjamin V. Fasano ,  David B. Goland ,  Robert Hannon ,  Jonathan H. Harris ,  Lester W. Herron ,  Gregory M. Johnson ,  Niranjan M. Patel ,  Andrew M. Reitter ,  Subhash L. Shinde ,  Rao V. Vallabhaneni ,  Robert A. Youngman

Inventor： Jon A. Casey ,  Carla N. Cordero ,  Benjamin V. Fasano ,  David B. Goland ,  Robert Hannon ,  Jonathan H. Harris ,  Lester W. Herron ,  Gregory M. Johnson ,  Niranjan M. Patel ,  Andrew M. Reitter ,  Subhash L. Shinde ,  Rao V. Vallabhaneni ,  Robert A. Youngman

IPC: B32B18/00 ,  B22F7/02 ,  C04B35/581 ,  C04B37/02 ,  C04B41/51 ,  C04B41/52 ,  C04B41/88 ,  C04B41/89 ,  C22C29/16 ,  H01L21/48 ,  H01L23/373 ,  H05K1/03 ,  H05K3/24 ,  H05K3/40 ,  H05K3/46 ,  B22F3/00

CPC classification number: C04B41/009 ,  B22F7/02 ,  C04B41/5133 ,  C04B41/52 ,  C04B41/88 ,  C04B41/89 ,  C22C29/16 ,  H01L21/4846 ,  H01L21/486 ,  H01L23/3731 ,  H05K3/4061 ,  B22F2998/00 ,  C04B2111/00405 ,  C04B2111/00844 ,  H01L2924/0002 ,  H05K1/0306 ,  H05K2201/035 ,  H05K2201/09981 ,  H05K3/248 ,  H05K3/4611 ,  H05K3/4629 ,  Y10S428/901 ,  Y10T428/12021 ,  Y10T428/12028 ,  Y10T428/12056 ,  Y10T428/31678

Abstract: Disclosed is an aluminum nitride body having graded metallurgy and a method for making such a body. The aluminum nitride body has at least one via and includes a first layer in direct contact with the aluminum nitride body and a second layer in direct contact with, and that completely encapsulates, the first layer. The first layer includes 30 to 60 volume percent aluminum nitride and 40 to 70 volume percent tungsten and/or molybdenum while the second layer includes 90 to 100 volume percent of tungsten and/or molybdenum and 0 to 10 volume percent of aluminum nitride.

公开(公告)号：US4971738A

公开(公告)日：1990-11-20

申请号：US220192

申请日：1988-07-18

Applicant: Lester W. Herron ,  Sarah H. Knickerbocker ,  Ananda Hosakere Kumar ,  Govindarajan Natarajan ,  Srinivasa S. N. Reddy

Inventor： Lester W. Herron ,  Sarah H. Knickerbocker ,  Ananda Hosakere Kumar ,  Govindarajan Natarajan ,  Srinivasa S. N. Reddy

IPC: C04B35/64 ,  B32B18/00 ,  C04B35/634 ,  C04B35/638 ,  H01L21/48 ,  H05K3/46

CPC classification number: C04B35/6342 ,  B32B18/00 ,  C04B35/634 ,  C04B35/638 ,  C04B35/645 ,  H01L21/4857 ,  C04B2235/6582 ,  C04B2235/6588 ,  C04B2237/34 ,  C04B2237/341 ,  C04B2237/343 ,  C04B2237/363 ,  C04B2237/68 ,  C04B2237/704

Abstract: There is disclosed the enhancement of the removal of carbon from multilayer ceramic substrate laminate during the sintering thereof. A multilayer ceramic substrate laminate having metallic lines and vias is provided with a reducible metal oxide in close proximity to the substrate laminate. The multilayer ceramic substrate laminate contains a polymeric binder which upon heating depolymerizes into carbon. The substrate laminate is sintered in an atmosphere which is reducing with respect to the reducible metal oxide and which is oxidizing with respect to the carbon.

公开(公告)号：US4753694A

公开(公告)日：1988-06-28

申请号：US859092

申请日：1986-05-02

Applicant: Lester W. Herron ,  Robert O. Lussow ,  Robert W. Nufer ,  Bernard Schwartz ,  John Acocella ,  Srinivasa N. Reddy

Inventor： Lester W. Herron ,  Robert O. Lussow ,  Robert W. Nufer ,  Bernard Schwartz ,  John Acocella ,  Srinivasa N. Reddy

IPC: H05K3/46 ,  H01L21/48 ,  H01L23/538 ,  H05K1/03 ,  H05K3/20 ,  C03B29/00

CPC classification number: H01L23/5383 ,  H01L21/4857 ,  H05K3/20 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/3011 ,  H05K1/0306 ,  H05K2201/0317 ,  H05K2203/0156 ,  H05K3/4611 ,  H05K3/4629

Abstract: A multilayered ceramic (MLC) substrate having embedded and exposed conductors suitable for mounting and interconnecting a plurality of electronic devices exterior thereof. The horizontal planar conductors comprise substantially a plurality of solid, non-porous, homogeneous metal patterns, whereas the vertical interplanar connection conductors are substantially porous metal conductors that are formed by methods such as screening. The process to form the MLC substrate involves forming a pattern of solid, nonporous conductors to a backing sheet having a release layer, then transferring the pattern to a ceramic green sheet. Zero X-Y shrinkage sintering processes allow the MLC substrate and solid metal conductors to be densified without distortion of the solid metal patterns or the ceramic.

Abstract translation: 一种多层陶瓷（MLC）衬底，其具有适于安装和互连其外部的多个电子器件的嵌入和暴露的导体。 水平平面导体基本上包括多个固体，非多孔均质的金属图案，而垂直平面连接导体是通过诸如筛选的方法形成的基本上多孔的金属导体。 形成MLC衬底的方法包括将固体，无孔导体的图案形成为具有剥离层的背衬片，然后将图案转移到陶瓷生片。 零X-Y收缩烧结工艺允许MLC衬底和固体金属导体致密化而不会使固体金属图案或陶瓷变形。

公开(公告)号：US4598107A

公开(公告)日：1986-07-01

申请号：US763157

申请日：1985-08-07

Applicant: Lester W. Herron ,  Robert W. Nufer

Inventor： Lester W. Herron ,  Robert W. Nufer

IPC: C04B35/111 ,  C04B35/634 ,  H01L21/48 ,  C08K5/09 ,  C04B33/34 ,  C08L1/08

CPC classification number: H01L21/48 ,  C04B35/111 ,  C04B35/634

Abstract: Disclosed is a method of forming a slurry for casting into ceramic green sheets. Starting from selected quantities of a solvent, plasticizer, polymeric binder material, frit and aluminum oxide, a low viscosity pre-mix is formed by combining predetermined portions of the solvent and binder material and all of the plasticizer. The remaining portions of the solvent and binder material are combined into a post-mix. Next, the pre-mix and frit are milled in a ball mill. Then the aluminum oxide is added to the ball mill in steps using predetermined portions and milled for predetermined periods of time to achieve the desired degree of aluminum oxide deagglomeration and particle packing density. Finally, the post-mix is added to the ball mill and milled to obtain the final slurry.

Abstract translation: 公开了一种形成用于铸造成陶瓷生片的浆料的方法。 从选定量的溶剂，增塑剂，聚合物粘合剂材料，玻璃料和氧化铝开始，通过将预定部分的溶剂和粘合剂材料以及所有的增塑剂组合形成低粘度预混物。 溶剂和粘合剂材料的剩余部分组合成后混合物。 接下来，将预混合物和玻璃料在球磨机中研磨。 然后，使用预定的部分，将步骤中的氧化铝加入到球磨机中并研磨预定的时间以达到所需程度的氧化铝解聚和颗粒堆积密度。 最后，将后混合物添加到球磨机中并研磨以获得最终的浆料。

公开(公告)号：US06306528B1

公开(公告)日：2001-10-23

申请号：US09311812

申请日：1999-05-13

Applicant: Richard A. Bates ,  Carla N. Cordero ,  Benjamin V. Fasano ,  David B. Goland ,  Robert Hannon ,  Lester W. Herron ,  Gregory M. Johnson ,  Andrew Reitter ,  Subhash L. Shinde ,  Lisa Studzinski

Inventor： Richard A. Bates ,  Carla N. Cordero ,  Benjamin V. Fasano ,  David B. Goland ,  Robert Hannon ,  Lester W. Herron ,  Gregory M. Johnson ,  Andrew Reitter ,  Subhash L. Shinde ,  Lisa Studzinski

IPC: B32B1800

CPC classification number: C04B41/009 ,  C04B41/5133 ,  C04B41/88 ,  C04B2111/00844 ,  H01L23/15 ,  H01L2924/0002 ,  H05K1/0306 ,  H05K1/092 ,  Y10T428/265 ,  C04B41/4539 ,  C04B41/4556 ,  C04B41/4578 ,  C04B41/5032 ,  C04B41/526 ,  C04B35/581 ,  H01L2924/00

Abstract: Electronic packages made with a high area percent coverage of blanket metal may be prone to certain kinds of ceramic defects. In aluminum nitride, these defects may be related to decomposition of the liquid sintering aid. In this experiment, unique additions to the metallization prevented the formation of certain ceramic defects. Our approach involves a unique composition used in an existing process.

Abstract translation: 用橡皮布金属覆盖面积百分比高的电子封装可能容易产生某些种类的陶瓷缺陷。 在氮化铝中，这些缺陷可能与液体烧结助剂的分解有关。 在该实验中，金属化的独特添加防止了某些陶瓷缺陷的形成。 我们的方法涉及在现有过程中使用的独特组合。

公开(公告)号：US06200373B1

公开(公告)日：2001-03-13

申请号：US09311811

申请日：1999-05-13

Applicant: Richard A. Bates ,  Carla N. Cordero ,  Benjamin V. Fasano ,  David B. Goland ,  Robert Hannon ,  Lester W. Herron ,  Gregory M. Johnson ,  Andrew Reitter ,  Subhash L. Shinde ,  Lisa Studzinski

Inventor： Richard A. Bates ,  Carla N. Cordero ,  Benjamin V. Fasano ,  David B. Goland ,  Robert Hannon ,  Lester W. Herron ,  Gregory M. Johnson ,  Andrew Reitter ,  Subhash L. Shinde ,  Lisa Studzinski

IPC: B32B1700

CPC classification number: C04B41/009 ,  C04B41/5133 ,  C04B41/88 ,  C04B2111/00844 ,  H01L23/15 ,  H01L2924/0002 ,  H05K1/0306 ,  H05K1/092 ,  Y10T428/265 ,  C04B41/4539 ,  C04B41/4556 ,  C04B41/4578 ,  C04B41/5032 ,  C04B41/526 ,  C04B35/581 ,  H01L2924/00

Abstract: Electronic packages made with a high area percent coverage of blanket metal may be prone to certain kinds of ceramic defects. In aluminum nitride, these defects may be related to decomposition of the liquid sintering aid. In this experiment, unique additions to the metallization prevented the formation of certain ceramic defects. Our approach involves a unique composition used in an existing process.

Abstract translation: 用橡皮布金属覆盖面积百分比高的电子封装可能容易产生某些种类的陶瓷缺陷。 在氮化铝中，这些缺陷可能与液体烧结助剂的分解有关。 在该实验中，金属化的独特添加防止了某些陶瓷缺陷的形成。 我们的方法涉及在现有过程中使用的独特组合。

公开(公告)号：US5773377A

公开(公告)日：1998-06-30

申请号：US489610

申请日：1995-06-12

Applicant: Jonathan H. Harris ,  Robert A. Youngman ,  Subhash L. Shinde ,  Lester W. Herron ,  Benjamin V. Fasano

Inventor： Jonathan H. Harris ,  Robert A. Youngman ,  Subhash L. Shinde ,  Lester W. Herron ,  Benjamin V. Fasano

IPC: C04B35/581 ,  C04B35/64 ,  C04B35/582

CPC classification number: C04B35/581 ,  C04B35/64 ,  Y10S428/901

Abstract: An aluminum nitride ceramic having enhanced properties suitable for electronic packaging applications can be prepared from a synergistic aluminum nitride powder/sintering aid mixture, in which the sintering aid is formulated to provide a resultant desirable second phase within the sintered body. The aluminum nitride powder/sintering aid mixture can be formed into green sheet-metal laminates and sintered at low temperature to yield high density, high electrical resistivity, and high thermal conductivity metal ceramic sintered bodies with low camber.

Abstract translation: 具有适合于电子封装应用的增强性能的氮化铝陶瓷可以由协同的氮化铝粉末/烧结助剂混合物制备，其中配制烧结助剂以在烧结体内提供所需的所需第二相。 氮化铝粉末/烧结助剂混合物可以形成生坯薄片金属层压板，并在低温下烧结以产生高密度，高电阻率，以及具有低弧度的高导热性金属陶瓷烧结体。

公开(公告)号：US5541145A

公开(公告)日：1996-07-30

申请号：US489615

申请日：1995-06-12

Applicant: Jonathan H. Harris ,  Subhash L. Shinde ,  Takeshi Takamori ,  Robert A. Youngman ,  Lester W. Herron ,  Benjamin V. Fasano

Inventor： Jonathan H. Harris ,  Subhash L. Shinde ,  Takeshi Takamori ,  Robert A. Youngman ,  Lester W. Herron ,  Benjamin V. Fasano

IPC: C04B35/581

CPC classification number: C04B35/581 ,  Y10S428/901

Abstract: An aluminum nitride ceramic having desired properties suitable for electronic packaging applications can be prepared from a novel aluminum nitride powder/sintering aid mixture. The sintering aid comprises a glassy component formed from alumina, calcia and boria, and a non-vitreous component comprising an element or compound of a metal of Group IIa, IIIa, or the lanthanides, preferably crystalline oxides, reactibis with the crystallized glass component and the alumina from the Al N grains. Alternatively, the sintering aid comprises a multi-component glass composition capable of forming the above components upon melting and thereafter crystallizing upon reaction.

Abstract translation: 可以由新型氮化铝粉末/烧结助剂混合物制备具有适合于电子封装应用的所需性能的氮化铝陶瓷。 烧结助剂包括由氧化铝，氧化钙和氧化硼形成的玻璃状组分，以及包含IIa，IIIa族金属或镧系元素的元素或化合物的非玻璃状组分，优选结晶氧化物与结晶的玻璃组分反应， 来自Al N颗粒的氧化铝。 或者，烧结助剂包括能够在熔化后形成上述组分并随后在反应后结晶的多组分玻璃组合物。

公开(公告)号：US5480503A

公开(公告)日：1996-01-02

申请号：US175727

申请日：1993-12-30

Applicant: Jon A. Casey ,  David B. Goland ,  Dinesh Gupta ,  Lester W. Herron ,  James N. Humenik ,  Thomas E. Lombardi ,  John U. Knickerbocker ,  Robert J. Sullivan ,  James R. Wylder

Inventor： Jon A. Casey ,  David B. Goland ,  Dinesh Gupta ,  Lester W. Herron ,  James N. Humenik ,  Thomas E. Lombardi ,  John U. Knickerbocker ,  Robert J. Sullivan ,  James R. Wylder

IPC: H01L21/48 ,  H01L21/68 ,  H01L23/538 ,  H05K1/03 ,  H05K3/20 ,  H05K3/40 ,  H05K3/46 ,  B32B31/04 ,  B32B31/12 ,  B32B31/26 ,  B32B31/28

CPC classification number: H01L21/568 ,  H01L21/4857 ,  H01L21/6835 ,  H01L23/5383 ,  H01L23/5385 ,  H05K3/20 ,  H05K3/4061 ,  H05K3/4617 ,  H05K3/4629 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/0306 ,  Y10T156/1056 ,  Y10T156/1142 ,  Y10T29/49126 ,  Y10T29/49128

Abstract: Process for producing circuitized greensheets including multi-layer ceramic sub-laminates and composites comprising thin ceramic greensheets carrying and thin, fine line patterned conductive metal layers. The invention comprises releasably-supporting the thin greensheets on a temporary carrier support having an ablatable release layer, preferably over a patterned conductive layer, and filling the vias with conductive metal paste, whereby the thin greensheets are supported against warpage and distortion. The supported greensheets are formed as single layers, pairs and stacks thereof, as desired, and thereafter separated from the temporary support for use.

Abstract translation: 用于生产包括多层陶瓷亚层压板和复合材料的电路化滤纸的方法，该复合材料包括载有薄的陶瓷片材和薄的精细线图案化的导电金属层。 本发明包括在具有可消融脱模层的临时载体支撑件上可释放地支撑薄片，优选地在图案化的导电层之上，并且用导电金属浆料填充该通孔，从而支撑薄的薄片以防止翘曲和变形。 支撑的格子根据需要形成为单层，成对和堆叠，然后与临时支撑件分离使用。

公开(公告)号：US5338900A

公开(公告)日：1994-08-16

申请号：US996367

申请日：1992-12-23

Applicant: Mark S. Schneider ,  John Acocella ,  Lester W. Herron ,  Mark R. Kordus ,  Louis H. Wirtz

Inventor： Mark S. Schneider ,  John Acocella ,  Lester W. Herron ,  Mark R. Kordus ,  Louis H. Wirtz

IPC: H01L21/68 ,  H01L23/498 ,  H05K1/00

CPC classification number: H01L21/6835 ,  H01L23/49827 ,  H01L2221/68377 ,  H01L2924/0002 ,  H01L2924/09701

Abstract: The present invention relates generally to new structures for decals, and more particularly to electrically conductive decals filled with inorganic insulator material. Various methods and processes that are used to make these electrically conductive decals filled with inorganic dielectric material are disclosed.

Abstract translation: 本发明一般涉及用于贴花的新结构，更具体地说，涉及填充有无机绝缘体材料的导电贴花。 公开了用于制造充满无机介电材料的这些导电贴花的各种方法和工艺。