公开(公告)号：US20110048790A1

公开(公告)日：2011-03-03

申请号：US12547226

申请日：2009-08-25

Applicant: Richard Stephen Graf ,  Thomas Edward Lombardi ,  Sudipta Kumar Ray ,  David Justin West

Inventor： Richard Stephen Graf ,  Thomas Edward Lombardi ,  Sudipta Kumar Ray ,  David Justin West

IPC: H05K1/11 ,  H05K3/42

CPC classification number: H05K3/403 ,  H05K3/0052 ,  H05K3/42 ,  H05K2201/10159 ,  Y10T29/49165

Abstract: An electrically insulating substrate is provided. The electrically insulating substrate includes a set of areas to be formed into a set of printed circuit boards. Each of the set of areas is separated from others of the set of areas by a dicing channel. A set of signal wiring conductors is fabricated onto the set of areas of the electrically insulating substrate so that at least one of the set of signal wiring conductors terminates proximate to the dicing channel. A set of plated through holes is fabricated through at least one of the set of areas such that at least one of the set of plated through holes connects to at least one of the set of signal wiring conductors. The electrically insulating substrate is singulated along a set of singulation lines to form the set of printed circuit boards. The singulation lines intersect with the plated through holes, so that a portion of the plated through holes is exposed along the peripheral edge of the resulting printed circuit boards.

Abstract translation: 提供电绝缘基板。 电绝缘基板包括一组要形成一组印刷电路板的区域。 通过切割通道将该组区域中的每一个区域与该组区域中的其他区域分离。 一组信号布线导体制造在电绝缘基板的一组区域上，使得该组信号布线导体中的至少一个终止于切割通道附近。 通过所述一组区域中的至少一个制造一组电镀通孔，使得该组电镀通孔中的至少一个连接到该组信号布线导体中的至少一个。 电绝缘基板沿着一组单线划分成一组印刷电路板。 分割线与电镀通孔相交，使得电镀通孔的一部分沿着所得印刷电路板的周边边缘露出。

公开(公告)号：US06395991B1

公开(公告)日：2002-05-28

申请号：US08688073

申请日：1996-07-29

Applicant: Robert Charles Dockerty ,  Ronald Maurice Fraga ,  Ciro Neal Ramirez ,  Sudipta Kumar Ray ,  Gordon Jay Robbins

Inventor： Robert Charles Dockerty ,  Ronald Maurice Fraga ,  Ciro Neal Ramirez ,  Sudipta Kumar Ray ,  Gordon Jay Robbins

IPC: H05K103

CPC classification number: H01L23/49811 ,  H01L2224/16 ,  H05K3/3436 ,  H05K2201/094 ,  H05K2201/10992 ,  H05K2203/0415 ,  H05K2203/0465 ,  Y02P70/613

Abstract: Structure and method for reinforcing a solder column grid array attachment of a ceramic or the like substrate to a printed circuit board, the reinforcement providing support for a heat sink which is bonded or affixed by pressure to a structural element of the substrate. In one form, the invention involves the concurrent formation of materially larger solder columns along the perimeter of the substrate in conjunction with the array of thin electrically interconnecting solder columns on the substrate. The reinforcing and electrical signal columns are thereafter aligned and attached by solder reflow to a corresponding pattern of pads on the printed circuit board. The heat sink is thermally connected to a structural element of the substrate by bonding or mechanical compression. Stresses in the solder columns caused by heat sink compressive forces or vibration induced flexing are materially decreased without adding complex or unique manufacturing operations.

Abstract translation: 用于将陶瓷等衬底的焊料柱网格阵列附着加强到印刷电路板的结构和方法，所述加强件为散热器提供支撑，所述散热器通过压力结合或固定到所述衬底的结构元件。 在一种形式中，本发明涉及沿着衬底的周边同时形成物理上较大的焊料柱，同时与衬底上的薄的电互连焊料柱的阵列结合。 然后，加强和电信号柱通过焊料回流对准和附接到印刷电路板上的相应的焊盘图案。 散热器通过结合或机械压缩与衬底的结构元件热连接。 由于散热器的压缩力或振动引起的弯曲引起的焊料柱的应力大幅减少，无需增加复杂或独特的制造操作。

公开(公告)号：US5796169A

公开(公告)日：1998-08-18

申请号：US752418

申请日：1996-11-19

Applicant: Robert Charles Dockerty ,  Ronald Maurice Fraga ,  Ciro Neal Ramirez ,  Sudipta Kumar Ray ,  Charles Levern Reynolds, Jr. ,  Gordon Jay Robbins

Inventor： Robert Charles Dockerty ,  Ronald Maurice Fraga ,  Ciro Neal Ramirez ,  Sudipta Kumar Ray ,  Charles Levern Reynolds, Jr. ,  Gordon Jay Robbins

IPC: H01L21/60 ,  H01L23/498 ,  H05K1/11 ,  H05K3/34 ,  H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC classification number: H05K3/3436 ,  H01L23/49816 ,  H01L23/49838 ,  H01L24/81 ,  H01L2224/0401 ,  H01L2224/05552 ,  H01L2224/0603 ,  H01L2224/06051 ,  H01L2224/13012 ,  H01L2224/1403 ,  H01L2224/14051 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2224/81136 ,  H01L2224/81801 ,  H01L2924/00013 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/3011 ,  H05K1/111 ,  H05K2201/094 ,  H05K2201/09781 ,  H05K2201/10992 ,  H05K2203/041 ,  Y02P70/613

Abstract: Supporting structure for a ball grid array surface mounted integrated circuit device composed of support solder formed at selective corner locations on the ball grid array surface of the integrated circuit device. In one form, L-shaped patterns of high melting temperature solder are formed along the axes defined by the ball grid array and are characterized in that cross sections of the L-shaped pattern match that of the solder balls along one axis, and represent a continuum of solder between solder ball locations along the other axis. Support solder can be added where necessary to provide both structural reinforcement and thermal conduction. Control of the cross section of the support solder ensures that surface tension effects of the molten low temperature reflow solder used to connect the integrated circuit device does not materially change the final relative spacing between the integrated circuit device balls and the underlying printed circuit board contacts.

Abstract translation: 支持结构的球栅阵列表面安装的集成电路器件由支撑焊料组成，形成在集成电路器件的球栅阵列表面上的选择性拐角处。 在一种形式中，沿着由球栅阵列限定的轴线形成高熔点焊料的L形图案，其特征在于，L形图案的横截面与沿着一个轴的焊球的横截面相符，并且表示 沿着另一个轴线的焊球位置之间的连续的焊料。 可以在必要时添加支撑焊料以提供结构增强和热传导。 控制支撑焊料的横截面确保用于连接集成电路器件的熔融低温回流焊料的表面张力效应不会实质上改变集成电路器件球和底层印刷电路板触点之间的最终相对间隔。

公开(公告)号：US09433105B2

公开(公告)日：2016-08-30

申请号：US12547226

申请日：2009-08-25

Applicant: Richard Stephen Graf ,  Thomas Edward Lombardi ,  Sudipta Kumar Ray ,  David Justin West

Inventor： Richard Stephen Graf ,  Thomas Edward Lombardi ,  Sudipta Kumar Ray ,  David Justin West

IPC: H05K3/42 ,  H05K3/40 ,  H05K3/00

CPC classification number: H05K3/403 ,  H05K3/0052 ,  H05K3/42 ,  H05K2201/10159 ,  Y10T29/49165

Abstract: An electrically insulating substrate is provided. The electrically insulating substrate includes a set of areas to be formed into a set of printed circuit boards. Each of the set of areas is separated from others of the set of areas by a dicing channel. A set of signal wiring conductors is fabricated onto the set of areas of the electrically insulating substrate so that at least one of the set of signal wiring conductors terminates proximate to the dicing channel. A set of plated through holes is fabricated through at least one of the set of areas such that at least one of the set of plated through holes connects to at least one of the set of signal wiring conductors. The electrically insulating substrate is singulated along a set of singulation lines to form the set of printed circuit boards. The singulation lines intersect with the plated through holes, so that a portion of the plated through holes is exposed along the peripheral edge of the resulting printed circuit boards.

Abstract translation: 提供电绝缘基板。 电绝缘基板包括一组要形成一组印刷电路板的区域。 通过切割通道将该组区域中的每一个区域与该组区域中的其他区域分离。 一组信号布线导体制造在电绝缘基板的一组区域上，使得该组信号布线导体中的至少一个终止于切割通道附近。 通过所述一组区域中的至少一个制造一组电镀通孔，使得该组电镀通孔中的至少一个连接到该组信号布线导体中的至少一个。 电绝缘基板沿着一组单线划分成一组印刷电路板。 分割线与电镀通孔相交，使得电镀通孔的一部分沿着所得印刷电路板的周边边缘露出。

公开(公告)号：US6015955A

公开(公告)日：2000-01-18

申请号：US879718

申请日：1997-06-20

Applicant: Mukta Shaji Farooq ,  Raymond Alan Jackson ,  Sudipta Kumar Ray

Inventor： Mukta Shaji Farooq ,  Raymond Alan Jackson ,  Sudipta Kumar Ray

IPC: G01R1/04 ,  H01L21/60 ,  H01L23/498 ,  H01L23/64 ,  H05K7/02

CPC classification number: G01R1/0408 ,  H01L23/49816 ,  H01L23/642 ,  H01L24/75 ,  H01L24/85 ,  H01L2224/16 ,  H01L2224/16145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/75 ,  H01L2224/85 ,  H01L2224/92247 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/1532 ,  H01L2924/15787 ,  H01L2924/16195 ,  H01L2924/19041 ,  H01L2924/19104 ,  H01L2924/30105 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49146

Abstract: A device and method for enabling the reworkability of an integrated circuit. The device includes a wirebond chip having a bottom surface and a carrier substrate having a first surface and a second surface. The first surface and second surface of the carrier substrate are electrically connected through a series of vias. A bonding agent is used to mechanically attach the wirebond chip to the carrier substrate in addition to wirebonds for electrically connecting the wirebond chip to the substrate. The substrate is attached to a multi-chip module (MCM) by ball grid array (BGA) or controlled collapse chip connection (C4) attaching process.

Abstract translation: 一种用于实现集成电路的可再加工性的装置和方法。 该器件包括具有底表面的引线键合芯片和具有第一表面和第二表面的载体衬底。 载体基板的第一表面和第二表面通过一系列通孔电连接。 除了用于将引线芯片电连接到基板的引线之外，还使用粘合剂将引线键合芯片机械地附接到载体基板。 基板通过球栅阵列（BGA）或受控的崩溃芯片连接（C4）连接工艺连接到多芯片模块（MCM）。

公开(公告)号：US06559527B2

公开(公告)日：2003-05-06

申请号：US09753819

申请日：2001-01-03

Applicant: Peter Jeffrey Brofman ,  Shaji Farooq ,  John U. Knickerbocker ,  Scott Ira Langenthal ,  Sudipta Kumar Ray ,  Kathleen Ann Stalter

Inventor： Peter Jeffrey Brofman ,  Shaji Farooq ,  John U. Knickerbocker ,  Scott Ira Langenthal ,  Sudipta Kumar Ray ,  Kathleen Ann Stalter

IPC: H01L2302

CPC classification number: H01L24/81 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/0401 ,  H01L2224/05666 ,  H01L2224/05671 ,  H01L2224/0603 ,  H01L2224/06505 ,  H01L2224/10135 ,  H01L2224/11002 ,  H01L2224/11472 ,  H01L2224/1184 ,  H01L2224/13017 ,  H01L2224/13019 ,  H01L2224/13082 ,  H01L2224/13111 ,  H01L2224/13116 ,  H01L2224/14 ,  H01L2224/1403 ,  H01L2224/14051 ,  H01L2224/141 ,  H01L2224/14505 ,  H01L2224/16058 ,  H01L2224/16238 ,  H01L2224/81136 ,  H01L2224/81139 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/351 ,  H05K3/303 ,  H05K3/3436 ,  H05K3/3457 ,  H05K3/3473 ,  H05K2201/10992 ,  H05K2201/2036 ,  H05K2203/0113 ,  H05K2203/0465 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2924/01083 ,  H01L2924/013 ,  H01L2924/00013 ,  H01L2924/00014

Abstract: A method of forming non-spherically shaped solder interconnects, preferably conical, for attachment of electronic components in an electronic module. Preferably, the solder interconnects of the present invention are cone shaped and comprise of depositing a first solder followed by a second solder having a lower reflow temperature than the first solder. Warm placement of the electronic component at a somewhat elevated temperature than room temperature but less than the solder reflow temperature reduces the force required during placement of a semiconductor chip to a substrate. After warm placement, reflow of the module occurs at the lower reflow temperature of the second solder. The conical shape of the solder interconnects are formed by a heated coining die which may also coin a portion of the interconnects with flat surfaces for stand-offs. The ability of the cone shaped solder interconnects to meet the opposing surface of a chip or substrate at different heights accommodates the camber typically associated with chip and substrate surfaces.

Abstract translation: 形成用于将电子部件附接到电子模块中的非球形焊料互连（优选为圆锥形）的方法。 优选地，本发明的焊料互连件是锥形的，并且包括沉积第一焊料，接着是具有比第一焊料低的回流温度的第二焊料。 电子部件在比室温略高的温度但低于焊料回流温度的温度放置降低了将半导体芯片放置到衬底期间所需的力。 在温热放置之后，模块的回流在第二焊料的较低回流温度下发生。 焊接互连的圆锥形由加热的压印模具形成，其也可以将一部分互连件用平坦表面硬化以用于支架。 锥形焊料互连件在不同高度处与芯片或基板的相对表面相遇的能力适应通常与芯片和基板表面相关联的外倾。

公开(公告)号：US06502999B1

公开(公告)日：2003-01-07

申请号：US09946053

申请日：2001-09-04

Applicant: Mitchell Simmons Cohen ,  David Peter Gaio ,  William K. Hogan ,  Steven Paul Ostrander ,  Sudipta Kumar Ray ,  Jeannine Madelyn Trewhella

Inventor： Mitchell Simmons Cohen ,  David Peter Gaio ,  William K. Hogan ,  Steven Paul Ostrander ,  Sudipta Kumar Ray ,  Jeannine Madelyn Trewhella

IPC: G02B636

CPC classification number: G02B6/4246 ,  G02B6/4206 ,  G02B6/4245 ,  G02B6/4251 ,  G02B6/4257 ,  G02B6/4267 ,  G02B6/4269 ,  G02B6/4274

Abstract: An opto-electronic module is housed in a hermetically sealed housing which is fabricated on a base member of solderable material to which a side wall structure is soldered. A cover is similarly provided that either is soldered to the top open end of the housing at the edge of the housing wall structure or is a cup-shaped member that slides over the wall structure and is soldered at the juxtaposed faces of the walls of the cover and the wall structure. Overlapping slots co-align to form a passage through which optical fibers may pass through the walls. The hermetic seal of the housing prevents the internal contamination of the module by water vapor, particulate matter or other contaminants.

Abstract translation: 光电模块容纳在气密密封的壳体中，该壳体被制造在可焊接材料的基底构件上，侧壁结构被焊接到该基底构件上。 类似地提供了一种盖子，其在壳体壁结构的边缘被焊接到壳体的顶部开口端，或者是在壁结构上滑动并且在壁结构的壁的并置面上被焊接的杯状构件 盖和墙结构。 重叠槽共同对准以形成光纤通过该通道的通道。 外壳的气密密封可防止模块被水蒸汽，颗粒物或其他污染物污染。

公开(公告)号：US06259155B1

公开(公告)日：2001-07-10

申请号：US09290311

申请日：1999-04-12

Applicant: Mario John Interrante ,  Raymond Alan Jackson ,  Sudipta Kumar Ray ,  Paul A. Zucco ,  Scott R. Dwyer

Inventor： Mario John Interrante ,  Raymond Alan Jackson ,  Sudipta Kumar Ray ,  Paul A. Zucco ,  Scott R. Dwyer

IPC: H01L2348

CPC classification number: H05K3/3436 ,  H01L23/49811 ,  H01L23/49894 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2924/01046 ,  H01L2924/01322 ,  H01L2924/12044 ,  H01L2924/15312 ,  H01L2924/16152 ,  H05K2201/10977 ,  H05K2203/0415 ,  H05K2203/176 ,  Y02P70/613

Abstract: A ceramic column grid array package suitable for mounting application specific integrated circuits or microprocessor chips onto a printed circuit board employing polymer reinforced columns on the substrate module is described. The polymer enhancement is formed by coating a thin conformal film of a polymer, such as, a polyimide onto the substrate module after the formation of the ceramic column grids to mechanically enhance the column to substrate attachment of the column to the substrate prior to mounting on a printed circuit card. Upon curing of the polymer film at a temperature below the melting point of the solder bond attaching the column grid to the substrate, the columns will be mechanically reinforced in their attachment to the substrate. Upon removal of the substrate module from a printed circuit card during rework, the columns of the grid array will remain with the substrate module, leaving no columns on the printed circuit card.

Abstract translation: 描述了一种适用于将专用集成电路或微处理器芯片安装在使用基板模块上的聚合物增强柱的印刷电路板上的陶瓷柱栅格阵列封装。 在形成陶瓷柱网格之后，通过在形成陶瓷柱网格之后，将诸如聚酰亚胺等聚合物的薄的共形膜涂覆在基板组件上，以在安装到基板之前机械地增强柱与基板的连接，从而形成聚合物增强。 印刷电路卡。 当聚合物膜在低于焊接粘合点的温度下固化时，将柱格栅连接到基底上，柱将被附着到基底上机械地增强。 在返工过程中从打印电路卡移除基板模块后，网格阵列将保留在基板模块上，在印刷电路板上不留列。

公开(公告)号：US06226863B1

公开(公告)日：2001-05-08

申请号：US09366980

申请日：1999-08-04

Applicant: Mukta Shaji Farooq ,  Raymond Alan Jackson ,  Sudipta Kumar Ray

Inventor： Mukta Shaji Farooq ,  Raymond Alan Jackson ,  Sudipta Kumar Ray

IPC: H05K334

CPC classification number: G01R1/0408 ,  H01L23/49816 ,  H01L23/642 ,  H01L24/48 ,  H01L24/49 ,  H01L24/75 ,  H01L24/85 ,  H01L2224/16 ,  H01L2224/16145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/75 ,  H01L2224/85 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/1532 ,  H01L2924/15787 ,  H01L2924/16195 ,  H01L2924/19041 ,  H01L2924/19104 ,  H01L2924/30105 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49146 ,  H01L2224/78 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/0401

Abstract: A device and method for enabling the reworkability of an integrated circuit comprising a wirebond chip having a bottom surface and a carrier substrate having a first surface and a second surface. The first surface and second surface of the carrier substrate are electrically connected through a series of vias. A bonding agent is used to mechanically attach the wirebond chip to the carrier substrate in addition to wirebonds for electrically connecting the wirebond chip to the substrate. The substrate is attached to a multi-chip module (MCM) by ball grid array (BGA) or controlled collapse chip connection (C4) attaching process.

Abstract translation: 一种能够实现包括具有底表面的引线键合芯片和具有第一表面和第二表面的载体基板的集成电路的可再加工性的装置和方法。 载体基板的第一表面和第二表面通过一系列通孔电连接。 除了用于将引线芯片电连接到基板的引线之外，还使用粘合剂将引线键合芯片机械地附接到载体基板。 基板通过球栅阵列（BGA）或受控的崩溃芯片连接（C4）连接工艺连接到多芯片模块（MCM）。

公开(公告)号：US06184062B2

公开(公告)日：2001-02-06

申请号：US09233383

申请日：1999-01-19

Applicant: Peter Jeffrey Brofman ,  Shaji Farooq ,  John U. Knickerbocker ,  Scott Ira Langenthal ,  Sudipta Kumar Ray ,  Kathleen Ann Stalter

Inventor： Peter Jeffrey Brofman ,  Shaji Farooq ,  John U. Knickerbocker ,  Scott Ira Langenthal ,  Sudipta Kumar Ray ,  Kathleen Ann Stalter

IPC: H01L2144

CPC classification number: H01L24/81 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/0401 ,  H01L2224/05666 ,  H01L2224/05671 ,  H01L2224/0603 ,  H01L2224/06505 ,  H01L2224/10135 ,  H01L2224/11002 ,  H01L2224/11472 ,  H01L2224/1184 ,  H01L2224/13017 ,  H01L2224/13019 ,  H01L2224/13082 ,  H01L2224/13111 ,  H01L2224/13116 ,  H01L2224/14 ,  H01L2224/1403 ,  H01L2224/14051 ,  H01L2224/141 ,  H01L2224/14505 ,  H01L2224/16058 ,  H01L2224/16238 ,  H01L2224/81136 ,  H01L2224/81139 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/351 ,  H05K3/303 ,  H05K3/3436 ,  H05K3/3457 ,  H05K3/3473 ,  H05K2201/10992 ,  H05K2201/2036 ,  H05K2203/0113 ,  H05K2203/0465 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2924/01083 ,  H01L2924/013 ,  H01L2924/00013 ,  H01L2924/00014

Abstract: A method of forming non-spherically shaped solder interconnects, preferably conical, for attachment of electronic components in an electronic module. Preferably, the solder interconnects of the present invention are cone shaped and comprise of depositing a first solder followed by a second solder having a lower reflow temperature than the first solder. Warm placement of the electronic component at a somewhat elevated temperature than room temperature but less than the solder reflow temperature reduces the force required during placement of a semiconductor chip to a substrate. After warm placement, reflow of the module occurs at the lower reflow temperature of the second solder. The conical shape of the solder interconnects are formed by a heated coining die which may also coin a portion of the interconnects with flat surfaces for stand-offs. The ability of the cone shaped solder interconnects to meet the opposing surface of a chip or substrate at different heights accommodates the camber typically associated with chip and substrate surfaces.

Abstract translation: 形成用于将电子部件附接到电子模块中的非球形焊料互连（优选为圆锥形）的方法。 优选地，本发明的焊料互连件是锥形的，并且包括沉积第一焊料，接着是具有比第一焊料低的回流温度的第二焊料。 电子部件在比室温略高的温度但低于焊料回流温度的温度放置降低了将半导体芯片放置到衬底期间所需的力。 在温热放置之后，模块的回流在第二焊料的较低回流温度下发生。 焊接互连的圆锥形由加热的压印模具形成，其也可以将一部分互连件用平坦表面硬化以用于支架。 锥形焊料互连件在不同高度处与芯片或基板的相对表面相遇的能力适应通常与芯片和基板表面相关联的外倾。