公开(公告)号：US11895769B2

公开(公告)日：2024-02-06

申请号：US17480429

申请日：2021-09-21

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Kazuya Okamoto ,  Takashi Haga ,  Masayoshi Takagi ,  Kazushige Sato

IPC: H05K1/02 ,  H01R12/52 ,  H01R13/52

CPC classification number: H05K1/0213 ,  H01R12/52 ,  H01R13/5219 ,  H05K2203/1147

Abstract: A module according to the present disclosure includes a circuit board, an electronic component on one of two principal surfaces of the circuit board, a connection conductor on the principal surface of the circuit board, and sealing resin on the principal surface of the circuit board. The electronic component and the connection conductor are covered with the sealing resin. The connection conductor includes a plate-shaped conductor and terminal sections. The plate-shaped conductor is disposed upright on the principal surface of the circuit board. The terminal sections extend from the plate-shaped conductor and away from the principal surface of the circuit board and are arranged side by side. Tip portions of the terminal sections are exposed at a surface of the sealing resin.

公开(公告)号：US20230413427A1

公开(公告)日：2023-12-21

申请号：US18458457

申请日：2023-08-30

Applicant: Samsung Electronics Co., Ltd.

Inventor： Seongki JEONG ,  Jingook KIM ,  Chijoon KIM ,  Seungwhee CHOI

IPC: H05K1/02 ,  H05K1/18 ,  H05K3/40 ,  H05K5/00 ,  G06F1/16

CPC classification number: H05K1/028 ,  H05K1/181 ,  H05K3/4038 ,  H05K5/0026 ,  G06F1/1652 ,  H05K2201/05 ,  H05K2201/10128 ,  H05K2203/1147 ,  H05K2201/0137

Abstract: An electronic device is provided. The electronic device includes a hinge, a first housing having at least a portion coupled to a first side of the hinge and including a first substrate assembly, a second housing having at least a portion coupled to a second side of the hinge, including a second substrate assembly, and configured to be foldable and unfoldable, a flexible display supported on the first and second housing and configured to be foldable and unfoldable, an FPCB electrically connecting the first and second substrate assembly, a through hole formed in the first housing forming a path through which the at least one FPCB passes, a first sealing member disposed so as to compress a first side surface of the at least one FPCB disposed in the through hole, and a second sealing member presses the second side surface of the FPCB disposed in the through hole.

公开(公告)号：US11729899B2

公开(公告)日：2023-08-15

申请号：US17137968

申请日：2020-12-30

Applicant: Skyworks Solutions, Inc.

Inventor： Cesar Verdugo Muñoz ,  Jorge Luis Pineda ,  Edgar Antonio Martinez ,  Daniel Murillo ,  Adrian Flores Baca

IPC: H05K1/02 ,  H05K3/34 ,  H05K9/00 ,  G01R1/18

CPC classification number: H05K1/0225 ,  G01R1/18 ,  H05K3/34 ,  H05K3/3447 ,  H05K9/0069 ,  H05K2203/1147 ,  Y10T29/49002 ,  Y10T29/49117

Abstract: A shield enclosure includes a housing with a peripheral wall that defines a cavity, and a cover removably coupleable to the housing to at least partially seal the cavity. The cavity is sized to receive a printed circuit board therein. The housing shields the printed circuit board from electromagnetic interference and noise during noise figure testing of a radiofrequency component on the printed circuit board.

公开(公告)号：US11710645B2

公开(公告)日：2023-07-25

申请号：US16772643

申请日：2018-12-13

Applicant: NAGASE CHEMTEX CORPORATION

Inventor： Eiichi Nomura ,  Yutaka Miyamoto ,  Takayuki Hashimoto

IPC: H01L21/56 ,  H05K3/46 ,  H01L23/12 ,  H01L23/31 ,  H03H3/08 ,  H03H9/25 ,  H05K1/14

CPC classification number: H01L21/56 ,  H01L23/12 ,  H01L23/31 ,  H03H3/08 ,  H03H9/25 ,  H05K1/144 ,  H05K3/4632 ,  H05K2203/068 ,  H05K2203/1147

Abstract: A manufacturing method of a mounting structure includes: a step of preparing a mounting member including a first circuit member and a plurality of second circuit members placed on the first circuit member; a disposing step of disposing a thermosetting sheet and a thermoplastic sheet on the mounting member, with the thermosetting sheet interposed between the thermoplastic sheet and the first circuit member; a first sealing step of pressing a stack of the thermosetting sheet and the thermoplastic sheet against the first circuit member, and heating the stack, to seal the second circuit members and to cure the thermosetting sheet into a cured layer; and a removal step of removing the thermoplastic sheet from the cured layer. At least one of the second circuit members is a hollow member having a space from the first circuit member, and in the first sealing step, the second circuit members are sealed so as to maintain the space.

公开(公告)号：US20170265311A1

公开(公告)日：2017-09-14

申请号：US15456528

申请日：2017-03-12

Applicant: YARIV PINTO ,  Eli Asulin ,  Dotan Avera ,  Jankiel Kimelblat

Inventor： YARIV PINTO ,  Eli Asulin ,  Dotan Avera ,  Jankiel Kimelblat

IPC: H05K3/40 ,  H05K3/12 ,  H05K3/00

CPC classification number: H05K3/4053 ,  H05K3/007 ,  H05K3/125 ,  H05K3/1283 ,  H05K2203/0191 ,  H05K2203/0763 ,  H05K2203/107 ,  H05K2203/1105 ,  H05K2203/1126 ,  H05K2203/1147 ,  H05K2203/122

Abstract: A method for selective processing of a panel, the method may include receiving a panel that has a bottom side and a top side and comprises a first group of drilled holes and a second group of drilled holes; at least partially sealing a bottom of any through hole of the first group; filling, by a selective filing process, any drilled hole of the first group that has a top opening to provide at least partially filled drilled holes of the first group without filling the second group of drilled holes; and plugging, by a selective plugging process, a top of any drilled hole of the first group.

公开(公告)号：US20160330834A1

公开(公告)日：2016-11-10

申请号：US15211809

申请日：2016-07-15

Applicant: International Business Machines Corporation

Inventor： Bruce J. Chamberlin ,  Joseph Kuczynski ,  Paula M. Nixa

IPC: H05K1/03 ,  H05K1/11 ,  H05K3/42 ,  C03B37/075 ,  C03B37/022

CPC classification number: H05K1/0366 ,  C03B37/022 ,  C03B37/0756 ,  C09D139/04 ,  C09D143/04 ,  C09D183/04 ,  H05K1/024 ,  H05K1/115 ,  H05K3/42 ,  H05K3/429 ,  H05K2201/029 ,  H05K2201/09545 ,  H05K2203/1147

Abstract: An enhanced substrate for use in printed circuit boards (PCBs) includes low-Dk-core glass fibers having low dielectric constant (Dk) cores. In some embodiments, the low-Dk-core glass fibers are filled with a low Dk fluid, such as a gas (e.g., air, nitrogen and/or a noble gas) or a liquid. After via holes are drilled or otherwise formed in the substrate, silane is applied to the ends of hollow glass fibers exposed in the via holes to seal the low Dk fluid within the cores of the hollow glass fibers. In some embodiments, the low-Dk-core glass fibers are filled with a solid (e.g., a low Dk resin). For example, a hollow glass fiber may be provided, and then filled with a low Dk resin in a liquid state. The low Dk resin within the hollow glass fiber is then cured to a solid state.

公开(公告)号：US09456496B2

公开(公告)日：2016-09-27

申请号：US14620880

申请日：2015-02-12

Applicant: International Business Machines Corporation

Inventor： Bruce J. Chamberlin ,  Joseph Kuczynski ,  Paula M. Nixa

IPC: H05K1/03 ,  C09D143/04 ,  C09D139/04 ,  C09D183/00 ,  H05K1/11 ,  H05K3/42 ,  H05K3/46

CPC classification number: H05K1/0366 ,  C03B37/022 ,  C03B37/0756 ,  C09D139/04 ,  C09D143/04 ,  C09D183/04 ,  H05K1/024 ,  H05K1/115 ,  H05K3/42 ,  H05K3/429 ,  H05K2201/029 ,  H05K2201/09545 ,  H05K2203/1147

Abstract: An enhanced substrate for use in printed circuit boards (PCBs) includes low-Dk-core glass fibers having low dielectric constant (Dk) cores. In some embodiments, the low-Dk-core glass fibers are filled with a low Dk fluid, such as a gas (e.g., air, nitrogen and/or a noble gas) or a liquid. After via holes are drilled or otherwise formed in the substrate, silane is applied to the ends of hollow glass fibers exposed in the via holes to seal the low Dk fluid within the cores of the hollow glass fibers. In some embodiments, the low-Dk-core glass fibers are filled with a solid (e.g., a low Dk resin). For example, a hollow glass fiber may be provided, and then filled with a low Dk resin in a liquid state. The low Dk resin within the hollow glass fiber is then cured to a solid state.

Abstract translation: 用于印刷电路板（PCB）的增强型基板包括具有低介电常数（Dk）芯的低Dk芯玻璃纤维。 在一些实施例中，低Dk芯玻璃纤维填充有低Dk流体，例如气体（例如空气，氮气和/或惰性气体）或液体。 在基板中钻孔或以其他方式形成通孔之后，将硅烷施加到暴露在通孔中的中空玻璃纤维的端部，以密封中空玻璃纤维的芯内的低Dk流体。 在一些实施方案中，低-Dk芯玻璃纤维用固体（例如低Dk树脂）填充。 例如，可以设置中空玻璃纤维，然后以液态填充低Dk树脂。 然后将中空玻璃纤维内的低Dk树脂固化成固态。

公开(公告)号：US20160186352A1

公开(公告)日：2016-06-30

申请号：US13984096

申请日：2012-02-07

Applicant: Pavel SHASHKOV ,  Gennady KHOMUTOV ,  Aleksey YEROKHIN ,  Sergey USOV

Inventor： Pavel SHASHKOV ,  Gennady KHOMUTOV ,  Aleksey YEROKHIN ,  Sergey USOV

IPC: C25D5/18 ,  C25D21/12 ,  C25D11/30 ,  C25D11/26 ,  C25D15/00 ,  C25D11/04

CPC classification number: C25D5/18 ,  C25D11/00 ,  C25D11/005 ,  C25D11/02 ,  C25D11/024 ,  C25D11/026 ,  C25D11/04 ,  C25D11/06 ,  C25D11/26 ,  C25D11/30 ,  C25D11/32 ,  C25D13/02 ,  C25D15/00 ,  C25D21/12 ,  H01L23/142 ,  H01L23/3677 ,  H01L23/3735 ,  H01L2224/48227 ,  H01L2224/49109 ,  H01L2924/01327 ,  H01L2924/09701 ,  H01L2924/1305 ,  H01L2924/13055 ,  H05K1/021 ,  H05K1/053 ,  H05K1/115 ,  H05K1/18 ,  H05K2201/0116 ,  H05K2203/0315 ,  H05K2203/1147 ,  Y10T428/1317 ,  Y10T428/24917 ,  Y10T428/249969 ,  H01L2924/00

Abstract: A method of forming a non-metallic coating on a metallic substrate involves the steps of positioning the metallic substrate in an electrolysis chamber and applying a sequence of voltage pulses of alternating polarity to electrically bias the substrate with respect to an electrode. Positive voltage pulses anodically bias the substrate with respect to the electrode and negative voltage pulses cathodically bias the substrate with respect to the electrode. The amplitude of the positive voltage pulses is potentiostatically controlled, wheras the amplitude of the negative voltage pulses is galvanostatically controlled.

Abstract translation: 在金属基材上形成非金属涂层的方法包括以下步骤：将金属基材定位在电解室中，并且施加一系列交替极性的电压脉冲以相对于电极使基板电偏置。 正电压脉冲相对于电极阳极偏置衬底，负电压脉冲相对于电极阴极偏置衬底。 正电压脉冲的幅度被电位控制，从而恒定地控制负电压脉冲的幅度。

公开(公告)号：US20160073497A1

公开(公告)日：2016-03-10

申请号：US14943747

申请日：2015-11-17

Applicant: BYD COMPANY LIMITED

Inventor： Qiang XU ,  Xinping LIN

IPC: H05K1/05 ,  H05K3/18 ,  H05K3/44

CPC classification number: H05K1/053 ,  C23C18/1608 ,  C23C18/1612 ,  C23C18/1868 ,  C23C18/1879 ,  C23C18/40 ,  C25D11/08 ,  C25D11/10 ,  C25D11/16 ,  C25D11/246 ,  H05K3/185 ,  H05K3/44 ,  H05K2201/0116 ,  H05K2203/0315 ,  H05K2203/107 ,  H05K2203/1147

Abstract: Embodiments of the present disclosure are directed to a circuit board. The circuit board comprises: an aluminum-based substrate; an alumina layer formed on at least one surface of the aluminum-based substrate; and a circuit layer formed on the alumina layer. The alumina layer comprises alumina and an element selected from a group consisting of chromium, nickel, a rare earth metal, and a combination thereof.

Abstract translation: 本公开的实施例涉及电路板。 电路板包括：铝基底板; 形成在所述铝基基板的至少一个表面上的氧化铝层; 以及形成在氧化铝层上的电路层。 氧化铝层包括氧化铝和选自铬，镍，稀土金属及其组合的元素。

公开(公告)号：US20140268605A1

公开(公告)日：2014-09-18

申请号：US13943833

申请日：2013-07-17

Applicant: Lockheed Martin Corporation

Inventor： Tom Rovere ,  James K. Lake ,  Rick Micha ,  Paul Coyne

IPC: H05K1/18 ,  F16J15/02 ,  H05K3/30

CPC classification number: H05K3/301 ,  H01L2224/16225 ,  H05K3/3436 ,  H05K2201/2018 ,  H05K2201/2036 ,  H05K2203/1147 ,  Y10T29/4913

Abstract: An assembly and method for mounting an electronic package to a printed circuit board (PCB) in which a gasket is shaped to fit tightly around and under a perimeter edge of an electronic package.

Abstract translation: 一种用于将电子封装安装到印刷电路板（PCB）的组件和方法，其中垫圈被成形为紧密地配合在电子封装的周边边缘周围。