公开(公告)号：US11710645B2

公开(公告)日：2023-07-25

申请号：US16772643

申请日：2018-12-13

Applicant: NAGASE CHEMTEX CORPORATION

Inventor： Eiichi Nomura ,  Yutaka Miyamoto ,  Takayuki Hashimoto

IPC: H01L21/56 ,  H05K3/46 ,  H01L23/12 ,  H01L23/31 ,  H03H3/08 ,  H03H9/25 ,  H05K1/14

CPC classification number: H01L21/56 ,  H01L23/12 ,  H01L23/31 ,  H03H3/08 ,  H03H9/25 ,  H05K1/144 ,  H05K3/4632 ,  H05K2203/068 ,  H05K2203/1147

Abstract: A manufacturing method of a mounting structure includes: a step of preparing a mounting member including a first circuit member and a plurality of second circuit members placed on the first circuit member; a disposing step of disposing a thermosetting sheet and a thermoplastic sheet on the mounting member, with the thermosetting sheet interposed between the thermoplastic sheet and the first circuit member; a first sealing step of pressing a stack of the thermosetting sheet and the thermoplastic sheet against the first circuit member, and heating the stack, to seal the second circuit members and to cure the thermosetting sheet into a cured layer; and a removal step of removing the thermoplastic sheet from the cured layer. At least one of the second circuit members is a hollow member having a space from the first circuit member, and in the first sealing step, the second circuit members are sealed so as to maintain the space.

公开(公告)号：US11315804B2

公开(公告)日：2022-04-26

申请号：US16772608

申请日：2018-12-13

Applicant: NAGASE CHEMTEX CORPORATION

Inventor： Eiichi Nomura ,  Yutaka Miyamoto ,  Takayuki Hashimoto

IPC: H01L21/56 ,  H01L23/12 ,  H01L23/31 ,  H03H3/08 ,  H03H9/25 ,  H05K1/14 ,  H05K3/46

Abstract: A manufacturing method of a mounting structure, the method including a step of preparing a mounting member including a first circuit member and a plurality of second circuit members placed on the first circuit member; a disposing step of disposing a thermosetting sheet and a thermoplastic sheet on the mounting member, with the thermosetting sheet interposed between the thermoplastic sheet and the first circuit member; a first sealing step of pressing a stack of the thermosetting sheet and the thermoplastic sheet against the first circuit member, and heating the stack, to seal the second circuit members and to cure the thermosetting sheet into a first cured layer; a removal step of removing the thermoplastic sheet from the first cured layer; and a coating film formation step of forming a coating film on the first cured layer, after the removal step. At least one of the second circuit members is a hollow member having a space from the first circuit member, and in the first sealing step, the second circuit members are sealed so as to maintain the space.