公开(公告)号：US20190123457A1

公开(公告)日：2019-04-25

申请号：US16167832

申请日：2018-10-23

申请人： ILLINOIS TOOL WORKS INC.

发明人： Edward F. Bulgajewski ,  Piotr Sliwa ,  John F. Healey

IPC分类号： H01R4/04 ,  H05K3/32 ,  H05K3/30 ,  H05B3/84 ,  H05K1/02

CPC分类号： H01R4/04 ,  H01R4/06 ,  H05B3/84 ,  H05B2203/016 ,  H05B2203/031 ,  H05K1/0209 ,  H05K1/0212 ,  H05K3/305 ,  H05K3/323

摘要： An adhesive connector for making an electrical connection to a conductor formed on a support surface is provided. The adhesive connector includes a substrate and a metal strip attached to a first surface of the substrate, wherein the metal strip is configured to engage a releasable electrical connector. The adhesive connector also includes a conductive strip attached to a second surface of the substrate and a conductive staple configured to secure the conductive strip, the substrate, and the metal strip together. The adhesive connector further includes an electrically-conducting adhesive that coats a first portion of the conductive strip, and is configured to provide electrical contact to a conductor formed on a support surface.

公开(公告)号：US20180203496A1

公开(公告)日：2018-07-19

申请号：US15800155

申请日：2017-11-01

申请人： International Business Machines Corporation

发明人： Eric J. Campbell ,  Sarah K. Czaplewski ,  Jennifer I. Porto

IPC分类号： G06F1/26 ,  G06F1/20 ,  H01L23/00 ,  H05K1/02 ,  H05K1/18 ,  H01L23/053 ,  H01L23/34 ,  H01L23/367

CPC分类号： G06F1/266 ,  G06F1/206 ,  H01L23/053 ,  H01L23/34 ,  H01L23/345 ,  H01L23/367 ,  H01L24/32 ,  H01L2224/32245 ,  H05K1/0212 ,  H05K1/0271 ,  H05K3/3436 ,  H05K2201/10151 ,  H05K2201/10734 ,  Y02P70/613

摘要： An approach to reduce thermal cycling fatigue associated with an identified component in an electrical system. The approach includes a controller determining power to the electrical system is turned off and initiating power from an external power source to one or more heating elements in a vicinity of the identified component. The approach includes a controller receiving a first temperature from one or more temperature sensors in the vicinity of the identified component and determining whether the first temperature is within a predetermined temperature range. Responsive to the controller determining that the first temperature is not within the predetermined temperature range, the approach includes the controller adjusting a power level of the one or more heating elements.

公开(公告)号：US09894748B2

公开(公告)日：2018-02-13

申请号：US15461541

申请日：2017-03-17

申请人： FUJITSU LIMITED

发明人： Yosuke Tsunoda ,  Akihiko Fujisaki ,  Jie Wei

IPC分类号： H04M1/00 ,  H05K1/02 ,  H04M1/02 ,  H05K7/20 ,  H05K9/00 ,  G06F1/20

CPC分类号： H05K1/0203 ,  G06F1/203 ,  H04M1/0202 ,  H05K1/0212 ,  H05K7/20336 ,  H05K7/2039 ,  H05K9/0024 ,  H05K2201/066

摘要： An electronic device includes a board having a first surface on which a heating element is mounted, a heat sink plate disposed to face the first surface of the board, and a heat pipe disposed between the board and the heat sink plate such that one end of the heat pipe is disposed at a position where the one end is in contact with the heating element, and the other end of the heat pipe is disposed to be in contact with the heat sink plate, wherein the heat sink plate has a stacking structure of a first heat sink plate of which a front surface faces the board, and a second heat sink plate disposed on a rear surface of the heat sink plate, and a through hole is formed at a position on the first heat sink plate.

公开(公告)号：US09869520B2

公开(公告)日：2018-01-16

申请号：US14340614

申请日：2014-07-25

申请人： Toyota Motor Engineering & Manufacturing North America, Inc.

发明人： Ercan Mehmet Dede ,  Tsuyoshi Nomura ,  Kenan Wang ,  Paul Donald Schmalenberg

IPC分类号： F28F13/14 ,  H01L23/373 ,  H05K1/02 ,  H05K7/20

CPC分类号： F28F13/14 ,  H01L23/373 ,  H01L23/3735 ,  H05K1/0203 ,  H05K1/0212 ,  H05K7/205

摘要： Heat transfer management apparatuses are disclosed. In one embodiment, a heat transfer management apparatus includes a composite lamina having an insulator substrate and a plurality of thermal conductor traces coupled to the insulator substrate, where the plurality of thermal conductor traces are arranged into a first enhanced thermal conduction region and a second enhanced thermal conduction region. The heat transfer management apparatus also includes a heat generating component mount coupled to the composite lamina and a temperature sensitive component mount coupled to the composite lamina and positioned distally from the heat generating component mount. At least one of the plurality of thermal conductor traces is in electrical continuity with the heat generating component mount and the temperature sensitive component mount, and at least one of the plurality of thermal conductor traces is electrically isolated from at least one of the heat generating component mount or the temperature sensitive component mount.

公开(公告)号：US20170150659A1

公开(公告)日：2017-05-25

申请号：US15009630

申请日：2016-01-28

申请人： PPG INDUSTRIES OHIO, INC.

发明人： Krishna K. Uprety ,  Alexander Bimanand ,  Khushroo H. Lakdawala

IPC分类号： H05K9/00 ,  H05K1/18

CPC分类号： H05K9/0094 ,  B64C1/1476 ,  C03C17/06 ,  C03C17/36 ,  C03C17/3673 ,  C03C17/3676 ,  C03C17/38 ,  C03C2217/94 ,  H01Q15/0013 ,  H01Q15/10 ,  H05K1/0212 ,  H05K1/0216 ,  H05K1/18

摘要： A transparency includes a transparent substrate and a plurality of electrically conductive lines on the transparent substrate, at least one of the electrically conductive lines intersecting at least one other electrically conductive line, and at least one of the electrically conductive lines having a width of no more than 50 μm to reduce distraction resulting from optical diffraction of light transmitted through or reflected by the transparency as compared to a transparency comprising electrically conductive lines having a width greater than 50 μm. A coated substrate includes: a substrate; a dielectric layer on the substrate; and a sensor including a conductive layer on the dielectric layer, where at least one layer selected from the dielectric layer and the conductive layer is formed by at least one method selected from lithography, inkjet printing, and aerosol jet printing.

公开(公告)号：US20170105279A1

公开(公告)日：2017-04-13

申请号：US14882395

申请日：2015-10-13

申请人： ASIA VITAL COMPONENTS CO., LTD.

发明人： Sheng-Huang Lin

IPC分类号： H05K1/02

CPC分类号： H05K1/0203 ,  H01L23/4006 ,  H01L23/4093 ,  H05K1/0201 ,  H05K1/0212 ,  H05K1/18 ,  H05K1/181 ,  H05K2201/066 ,  H05K2201/10598

摘要： A latch device for heat dissipation unit is applied to and mounted on a motherboard in tight contact with at least one heat source. The latch device includes a heat sink, a first elastic abutment member having a first protrusion block and a second elastic abutment member having a second protrusion block. A first latch member and a second latch member are disposed on two opposite sides of the heat sink. The first and second latch members are freely latchable with the corresponding first and second protrusion blocks or unlatchable from the corresponding first and second protrusion blocks. Accordingly, along with the latching or unlatching, the first and second elastic abutment members are elastically deformed into abutment against or out of abutment with the other face of the heat sink. Therefore, the heat sink can be easily and securely fixed on or detached from the motherboard.

公开(公告)号：US20170092630A1

公开(公告)日：2017-03-30

申请号：US15272568

申请日：2016-09-22

申请人： AT&S Austria Technologie & Systemtechnik Aktiengesellschaft

发明人： Gerald Weis ,  Christian Vockenberger ,  Roland Sekavcnik

IPC分类号： H01L25/16 ,  H05K1/02 ,  H05K1/11 ,  H05K7/20 ,  H01L23/467 ,  H01L25/07 ,  H01L23/00 ,  H05K1/18 ,  H01L23/538

CPC分类号： H01L25/16 ,  H01L23/3677 ,  H01L23/467 ,  H01L23/5383 ,  H01L23/5384 ,  H01L23/5389 ,  H01L24/17 ,  H01L24/19 ,  H01L24/20 ,  H01L25/074 ,  H01L25/105 ,  H01L2223/6677 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16227 ,  H01L2224/2518 ,  H01L2225/1035 ,  H01L2225/1047 ,  H01L2225/1094 ,  H01L2924/1033 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/1426 ,  H01L2924/1436 ,  H01L2924/153 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19102 ,  H01L2924/19105 ,  H05K1/0206 ,  H05K1/0209 ,  H05K1/0212 ,  H05K1/0298 ,  H05K1/115 ,  H05K1/181 ,  H05K1/185 ,  H05K7/20154 ,  H05K2201/10015 ,  H05K2201/10166 ,  Y02P70/611

摘要： In a connection system for electronic components (1) comprising a plurality of insulating layers (2) and conductive layers (3) and further comprising at least one embedded electronic component (4) embedded within at least one of the plurality of insulating layers (2) and conductive layers (3) the at least one embedded electronic component (4) is at least one first transistor having a bulk terminal thereof in thermal contact with a thermal duct (6) comprised of a plurality of vias (7) reaching through at least one of an insulating layer (2) and a conductive layer (3) of the connection system for electronic components (1) and emerging on a first outer surface (8) of the connection system for electronic components (1) under a first surface-mounted component (10).

公开(公告)号：US20170072399A1

公开(公告)日：2017-03-16

申请号：US15360691

申请日：2016-11-23

申请人： CALIFORNIA INSTITUTE OF TECHNOLOGY

发明人： Aditya RAJAGOPAL ,  Samson CHEN ,  Axel SCHERER ,  Christopher I. WALKER

IPC分类号： B01L7/00 ,  B01L3/00 ,  H05K1/02 ,  C12Q1/68

CPC分类号： B01L7/52 ,  B01L3/502707 ,  B01L2200/147 ,  B01L2300/0816 ,  B01L2300/0893 ,  B01L2300/12 ,  B01L2300/123 ,  B01L2300/1827 ,  B01L2300/1844 ,  C12Q1/686 ,  H05K1/0212 ,  H05K1/0272 ,  H05K1/028 ,  H05K3/46 ,  H05K3/4697 ,  Y10T29/49124

摘要： PC board fluidic devices for performing a Polymerase Chain Reaction (PCR) are disclosed. The devices comprise a printed circuit board and a PCR chamber. The PCR chamber is a fluidic chamber and is located in, or is part of, the PC board. The PC board can include a coil trace heating element with a temperature sensor and controller.

摘要翻译： 公开了用于进行聚合酶链式反应（PCR）的PC板流体装置。 这些装置包括印刷电路板和PCR室。 PCR室是流体室，位于PC板中，或者位于PC板的一部分。 PC板可以包括带有温度传感器和控制器的线圈跟踪加热元件。

公开(公告)号：US09545044B2

公开(公告)日：2017-01-10

申请号：US14566314

申请日：2014-12-10

申请人： FUJITSU LIMITED

发明人： Katsumi Takada ,  Kiyokazu Moriizumi ,  Masayuki Itoh

IPC分类号： H05K13/00 ,  H05K13/04 ,  H05K1/02 ,  H05K3/34 ,  H01L23/36 ,  H01L23/00 ,  H01L23/34 ,  H01L23/373 ,  H05K3/22

CPC分类号： H05K1/0212 ,  H01L23/345 ,  H01L23/3735 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/13111 ,  H01L2224/13116 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/16238 ,  H01L2224/29111 ,  H01L2224/29116 ,  H01L2224/29144 ,  H01L2224/32238 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48105 ,  H01L2224/48227 ,  H01L2224/81444 ,  H01L2224/83444 ,  H01L2924/0001 ,  H01L2924/01015 ,  H01L2924/01047 ,  H01L2924/12041 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/1579 ,  H01L2924/181 ,  H05K3/22 ,  H05K3/3494 ,  H05K2201/09263 ,  H05K2203/1115 ,  H05K2203/176 ,  H01L2924/00014 ,  H01L2924/0105 ,  H01L2924/01029 ,  H01L2924/00012 ,  H01L2224/29099 ,  H01L2924/00

摘要： An electronic component includes a wiring substrate having a first surface and a second surface, an electronic component body mounted on a first surface side of the wiring substrate, an external electrode formed on a second surface side of the wiring substrate which is opposite to the first surface side, the external electrode being electrically connected to the electronic component body, a heat generating member having a conductive property and having a higher resistivity than the external electrode, and a heat insulating layer disposed between the electronic component body and the heat generating member, the heat insulating layer having an insulating property and being formed of a material different from an other material of the wiring substrate.

摘要翻译： 电子部件包括具有第一表面和第二表面的布线基板，安装在布线基板的第一表面侧上的电子部件主体，形成在布线基板的与第一表面相对的第二表面侧上的外部电极 表面侧，外部电极电连接到电子部件主体，具有导电性能并且具有比外部电极更高的电阻率的发热部件，以及设置在电子部件主体和发热部件之间的绝热层， 所述绝热层具有绝缘性，并且由与所述布线基板的其它材料不同的材料形成。

公开(公告)号：US20160329301A1

公开(公告)日：2016-11-10

申请号：US15164179

申请日：2016-05-25

申请人： Invensas Corporation

发明人： Cyprian Emeka Uzoh ,  Arkalgud R. Sitaram

IPC分类号： H01L25/065 ,  H01L23/498 ,  C25F3/14 ,  H01L21/48 ,  H01L23/00 ,  C25F3/12 ,  H01L23/367 ,  H01L23/373

CPC分类号： H01L25/0655 ,  C25F3/12 ,  C25F3/14 ,  H01L21/4857 ,  H01L21/486 ,  H01L21/6835 ,  H01L23/367 ,  H01L23/3733 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/49866 ,  H01L24/17 ,  H01L2221/68345 ,  H01L2221/68381 ,  H01L2224/16225 ,  H01L2924/01022 ,  H01L2924/01028 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/15701 ,  H01L2924/15724 ,  H01L2924/15738 ,  H01L2924/15747 ,  H01L2924/15763 ,  H05K1/0212 ,  H05K1/115 ,  H05K3/07 ,  H05K2201/10378

摘要： A mask is formed over a first conductive portion of a conductive layer to expose a second conductive portion of the conductive layer. An electrolytic process is performed to remove conductive material from a first region and a second region of the second conductive portion. The second region is aligned with the mask relative to an electric field applied by the electrolytic process. The second region separates the first region of the second conductive portion from the first conductive portion. The electrolytic process is concentrated relative to the second region such that removal occurs at a relatively higher rate in the second region than in the first region.