公开(公告)号：US20240021538A1

公开(公告)日：2024-01-18

申请号：US18356839

申请日：2023-07-21

申请人： QUALCOMM Incorporated

发明人： Jay Scott Salmon ,  Anirudh Bhat

IPC分类号： H01L23/552 ,  H01L21/48 ,  H01L21/56 ,  H01L23/14 ,  H01L23/367 ,  H01L23/498 ,  H01L23/66 ,  H01L23/00 ,  H01L25/065

CPC分类号： H01L23/552 ,  H01L21/4857 ,  H01L21/486 ,  H01L21/4871 ,  H01L21/565 ,  H01L23/14 ,  H01L23/3675 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49838 ,  H01L23/66 ,  H01L24/16 ,  H01L25/0655 ,  H01L2223/6605 ,  H01L2224/16237 ,  H01L2924/16195 ,  H01L2924/16251 ,  H01L2924/1632 ,  H01L2924/3025

摘要： Multi-component modules (MCMs), including configurable electromagnetic interference (EMI) shield structures and related methods, are disclosed. An EMI shield enclosing an IC or another electrical component in an MCM can protect other components within the MCM from EMI generated by the enclosed component. The EMI shield also protects the enclosed component from the EMI generated by other electrical components. An EMI shield with sidewall structures, in which vertical conductors supported by a wall medium electrically couple a lid of the EMI shield to a ground layer in a substrate, provides configurable EMI protection in an MCM. The EMI shield may also be employed to increase heat dissipation. The sidewall structures of the EMI shield are disposed on one or more sides of an electrical component and are configurable to provide a desired level of EMI isolation.

公开(公告)号：US11791270B2

公开(公告)日：2023-10-17

申请号：US17315859

申请日：2021-05-10

申请人： International Business Machines Corporation

发明人： Kamal K Sikka ,  Maryse Cournoyer ,  Pascale Gagnon ,  Charles C. Bureau ,  Catherine Dufort ,  Dale Curtis McHerron ,  Vijayeshwar Das Khanna ,  Marc A. Bergendahl ,  Dishit Paresh Parekh ,  Ravi K. Bonam ,  Hiroyuki Mori ,  Yang Liu ,  Paul S. Andry ,  Isabel De Sousa

IPC分类号： H01L23/538 ,  H01L21/48 ,  H01L23/13 ,  H01L25/065 ,  H01L23/00

CPC分类号： H01L23/5381 ,  H01L21/4853 ,  H01L21/4867 ,  H01L23/13 ,  H01L23/5386 ,  H01L24/05 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/73 ,  H01L24/81 ,  H01L25/0655 ,  H01L2224/0401 ,  H01L2224/13147 ,  H01L2224/16237 ,  H01L2224/16257 ,  H01L2224/1703 ,  H01L2224/73204 ,  H01L2224/81203 ,  H01L2924/1616 ,  H01L2924/1632 ,  H01L2924/3512

摘要： A direct bonded heterogeneous integration (DBHi) device includes a substrate including a trench formed in a top surface of the substrate. The DBHi device further includes a first chip coupled to the substrate on a first side of the trench by a plurality of first interconnects. The DBHi device further includes a second chip coupled to the substrate on a second side of the trench by a plurality of second interconnects. The second side of the trench is arranged opposite the first side of the trench. The DBHi device further includes a bridge coupled to the first chip and to the second chip by a plurality of third interconnects such that the bridge is suspended in the trench. The DBHi device further includes a non-conductive paste material surrounding the plurality of third interconnects to further couple the bridge to the first chip and to the second chip.

公开(公告)号：US11721639B2

公开(公告)日：2023-08-08

申请号：US17336512

申请日：2021-06-02

申请人： QUALCOMM Incorporated

发明人： Jay Scott Salmon ,  Anirudh Bhat

IPC分类号： H01L23/552 ,  H01L21/48 ,  H01L21/56 ,  H01L23/14 ,  H01L23/367 ,  H01L23/498 ,  H01L23/66 ,  H01L23/00 ,  H01L25/065

CPC分类号： H01L23/552 ,  H01L21/486 ,  H01L21/4857 ,  H01L21/4871 ,  H01L21/565 ,  H01L23/14 ,  H01L23/3675 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49838 ,  H01L23/66 ,  H01L24/16 ,  H01L25/0655 ,  H01L2223/6605 ,  H01L2224/16237 ,  H01L2924/1632 ,  H01L2924/16195 ,  H01L2924/16251 ,  H01L2924/3025

摘要： Multi-component modules (MCMs) including configurable electromagnetic interference (EMI) shield structures, and related methods are disclosed. An EMI shield enclosing an IC or another electrical component in an MCM can protect other components within the MCM from EMI generated by the enclosed component. The EMI shield also protects the enclosed component from the EMI generated by other electrical components. An EMI shield with side-wall structures, in which vertical conductors supported by a wall medium electrically couple a lid of the EMI shield to a ground layer in a substrate, provides configurable EMI protection in an MCM. The EMI shield may also be employed to increase heat dissipation. The side-wall structures of the EMI shield are disposed on one or more sides of an electrical component and are configurable to provide a desired level of EMI isolation.

公开(公告)号：US20230148222A1

公开(公告)日：2023-05-11

申请号：US18050724

申请日：2022-10-28

申请人： Samsung Electronics Co., Ltd.

发明人： Boin Noh ,  Jeonghoon Ahn

IPC分类号： H01L23/498 ,  H01L23/00 ,  H01L25/065 ,  H01L21/48

CPC分类号： H01L23/49838 ,  H01L24/08 ,  H01L25/0655 ,  H01L21/486 ,  H01L21/4857 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49833 ,  H01L23/49894 ,  H01L2224/08225 ,  H01L2924/3511 ,  H01L2924/182 ,  H01L2924/1616 ,  H01L2924/16251 ,  H01L2924/1632

摘要： An interposer structure includes: an interposer substrate; an interposer through electrode penetrating through the interposer substrate in a vertical direction; a redistribution structure on the interposer substrate and including a redistribution pattern connected to the interposer through electrode and a redistribution insulating layer on side surfaces of the redistribution pattern on the interposer substrate; a conductive post on the redistribution structure and connected to the redistribution pattern; and an interposer insulating layer on side surfaces of the conductive post on the redistribution structure.

公开(公告)号：US20190145713A1

公开(公告)日：2019-05-16

申请号：US16247352

申请日：2019-01-14

申请人： Micron Technology, Inc.

发明人： Steven K. Groothuis ,  Jian Li

IPC分类号： F28D15/04 ,  H01L23/427 ,  H01L23/367 ,  F28D15/02

CPC分类号： F28D15/043 ,  F28D15/0233 ,  F28D15/0266 ,  F28D15/046 ,  H01L23/3675 ,  H01L23/427 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/32 ,  H01L24/73 ,  H01L25/0657 ,  H01L25/18 ,  H01L25/50 ,  H01L2224/13025 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/16146 ,  H01L2224/16227 ,  H01L2224/17181 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06589 ,  H01L2924/1431 ,  H01L2924/1434 ,  H01L2924/1436 ,  H01L2924/1437 ,  H01L2924/1438 ,  H01L2924/16235 ,  H01L2924/16251 ,  H01L2924/1632 ,  H01L2924/014 ,  H01L2924/00014

摘要： Semiconductor device assemblies having stacked semiconductor dies and thermal transfer devices that include vapor chambers are disclosed herein. In one embodiment, a semiconductor device assembly includes a first semiconductor die, a second semiconductor die on a base region of the first die, and a thermal transfer device attached to a peripheral region of the first die and extending over the second die. The thermal transfer device includes a conductive structure having an internal cavity and a working fluid at least partially filling the cavity. The conductive structure further includes first and second fluid conversion regions adjacent the cavity. The first fluid conversion region transfers heat from at least the peripheral region of the first die to a volume of the working fluid to vaporize the volume in the cavity, and the second fluid conversion region condenses the volume of the working fluid in the cavity after it has been vaporized.

公开(公告)号：US09887166B2

公开(公告)日：2018-02-06

申请号：US15165837

申请日：2016-05-26

申请人： Invensas Corporation

发明人： Rajesh Katkar ,  Laura Wills Mirkarimi ,  Arkalgud R. Sitaram ,  Charles G. Woychik

IPC分类号： H01L23/538 ,  H01L23/00 ,  H01L25/065 ,  H01L23/367 ,  H01L21/66 ,  H01L21/78 ,  H01L23/10 ,  H01L23/14 ,  H01L23/498 ,  H01L25/00 ,  H01L21/56 ,  H01L23/31 ,  H01L23/04 ,  H01L21/784 ,  H01L25/18

CPC分类号： H01L23/562 ,  H01L21/561 ,  H01L21/78 ,  H01L21/784 ,  H01L22/32 ,  H01L23/04 ,  H01L23/10 ,  H01L23/147 ,  H01L23/3121 ,  H01L23/3135 ,  H01L23/367 ,  H01L23/3675 ,  H01L23/49827 ,  H01L23/49838 ,  H01L24/05 ,  H01L24/06 ,  H01L24/09 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/17 ,  H01L24/32 ,  H01L24/73 ,  H01L24/83 ,  H01L24/92 ,  H01L24/94 ,  H01L24/97 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/0657 ,  H01L25/18 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/05568 ,  H01L2224/05569 ,  H01L2224/0603 ,  H01L2224/06181 ,  H01L2224/131 ,  H01L2224/1403 ,  H01L2224/14181 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16238 ,  H01L2224/17181 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/83192 ,  H01L2224/92125 ,  H01L2224/92225 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06548 ,  H01L2225/06586 ,  H01L2225/06589 ,  H01L2225/06596 ,  H01L2924/12042 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/1615 ,  H01L2924/16152 ,  H01L2924/16153 ,  H01L2924/16176 ,  H01L2924/16235 ,  H01L2924/16251 ,  H01L2924/1632 ,  H01L2924/164 ,  H01L2924/167 ,  H01L2924/16788 ,  H01L2924/1679 ,  H01L2924/181 ,  H01L2924/351 ,  H01L2924/3511 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2924/014 ,  H01L2924/00 ,  H01L2924/00012

摘要： An assembly with modules (110, 1310) containing integrated circuits and attached to a wiring substrate (120) is reinforced by one or more reinforcement frames (410) attached to the wiring substrate. The modules are located in openings (e.g. cavities and/or through-holes 414) in the reinforcement frame. Other features are also provided.

公开(公告)号：US20160276294A1

公开(公告)日：2016-09-22

申请号：US15165837

申请日：2016-05-26

申请人： Invensas Corporation

发明人： Rajesh KATKAR ,  Laura Wills MIRKARIMI ,  Arkalgud SITARAM ,  Charles G. WOYCHIK

IPC分类号： H01L23/00 ,  H01L21/66 ,  H01L23/367 ,  H01L25/065 ,  H01L25/00

CPC分类号： H01L23/562 ,  H01L21/561 ,  H01L21/78 ,  H01L21/784 ,  H01L22/32 ,  H01L23/04 ,  H01L23/10 ,  H01L23/147 ,  H01L23/3121 ,  H01L23/3135 ,  H01L23/367 ,  H01L23/3675 ,  H01L23/49827 ,  H01L23/49838 ,  H01L24/05 ,  H01L24/06 ,  H01L24/09 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/17 ,  H01L24/32 ,  H01L24/73 ,  H01L24/83 ,  H01L24/92 ,  H01L24/94 ,  H01L24/97 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/0657 ,  H01L25/18 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/05568 ,  H01L2224/05569 ,  H01L2224/0603 ,  H01L2224/06181 ,  H01L2224/131 ,  H01L2224/1403 ,  H01L2224/14181 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16238 ,  H01L2224/17181 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/83192 ,  H01L2224/92125 ,  H01L2224/92225 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06548 ,  H01L2225/06586 ,  H01L2225/06589 ,  H01L2225/06596 ,  H01L2924/12042 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/1615 ,  H01L2924/16152 ,  H01L2924/16153 ,  H01L2924/16176 ,  H01L2924/16235 ,  H01L2924/16251 ,  H01L2924/1632 ,  H01L2924/164 ,  H01L2924/167 ,  H01L2924/16788 ,  H01L2924/1679 ,  H01L2924/181 ,  H01L2924/351 ,  H01L2924/3511 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2924/014 ,  H01L2924/00 ,  H01L2924/00012

摘要： An assembly with modules (110, 1310) containing integrated circuits and attached to a wiring substrate (120) is reinforced by one or more reinforcement frames (410) attached to the wiring substrate. The modules are located in openings (e.g. cavities and/or through-holes 414) in the reinforcement frame. Other features are also provided.

公开(公告)号：US09355997B2

公开(公告)日：2016-05-31

申请号：US14288064

申请日：2014-05-27

申请人： Invensas Corporation

发明人： Rajesh Katkar ,  Laura Wills Mirkarimi ,  Arkalgud Sitaram ,  Charles G. Woychik

IPC分类号： H01L25/065 ,  H01L23/367 ,  H01L21/66 ,  H01L21/78 ,  H01L23/10 ,  H01L23/14 ,  H01L23/498 ,  H01L25/00 ,  H01L21/56 ,  H01L23/31 ,  H01L23/00 ,  H01L23/04 ,  H01L21/784 ,  H01L25/18

CPC分类号： H01L23/562 ,  H01L21/561 ,  H01L21/78 ,  H01L21/784 ,  H01L22/32 ,  H01L23/04 ,  H01L23/10 ,  H01L23/147 ,  H01L23/3121 ,  H01L23/3135 ,  H01L23/367 ,  H01L23/3675 ,  H01L23/49827 ,  H01L23/49838 ,  H01L24/05 ,  H01L24/06 ,  H01L24/09 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/17 ,  H01L24/32 ,  H01L24/73 ,  H01L24/83 ,  H01L24/92 ,  H01L24/94 ,  H01L24/97 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/0657 ,  H01L25/18 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/05568 ,  H01L2224/05569 ,  H01L2224/0603 ,  H01L2224/06181 ,  H01L2224/131 ,  H01L2224/1403 ,  H01L2224/14181 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16238 ,  H01L2224/17181 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/83192 ,  H01L2224/92125 ,  H01L2224/92225 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06548 ,  H01L2225/06586 ,  H01L2225/06589 ,  H01L2225/06596 ,  H01L2924/12042 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/1615 ,  H01L2924/16152 ,  H01L2924/16153 ,  H01L2924/16176 ,  H01L2924/16235 ,  H01L2924/16251 ,  H01L2924/1632 ,  H01L2924/164 ,  H01L2924/167 ,  H01L2924/16788 ,  H01L2924/1679 ,  H01L2924/181 ,  H01L2924/351 ,  H01L2924/3511 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2924/014 ,  H01L2924/00 ,  H01L2924/00012

摘要： An assembly with modules (110, 1310) containing integrated circuits and attached to a wiring substrate (120) is reinforced by one or more reinforcement frames (410) attached to the wiring substrate. The modules are located in openings (e.g. cavities and/or through-holes 414) in the reinforcement frame. Other features are also provided.

摘要翻译： 包含集成电路并附接到布线基板（120）的模块（110,1310）的组件由附接到布线基板的一个或多个加强框架（410）加强。 模块位于加强框架中的开口（例如空腔和/或通孔414）中。 还提供其他功能。

公开(公告)号：US20150262972A1

公开(公告)日：2015-09-17

申请号：US14288064

申请日：2014-05-27

申请人： Invensas Corporation

发明人： Rajesh KATKAR ,  Laura Wills MIRKARIMI ,  Arkalgud SITARAM ,  Charles G. WOYCHIK

IPC分类号： H01L25/065 ,  H01L21/66 ,  H01L23/31 ,  H01L23/04 ,  H01L21/78 ,  H01L23/367 ,  H01L23/00

CPC分类号： H01L23/562 ,  H01L21/561 ,  H01L21/78 ,  H01L21/784 ,  H01L22/32 ,  H01L23/04 ,  H01L23/10 ,  H01L23/147 ,  H01L23/3121 ,  H01L23/3135 ,  H01L23/367 ,  H01L23/3675 ,  H01L23/49827 ,  H01L23/49838 ,  H01L24/05 ,  H01L24/06 ,  H01L24/09 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/17 ,  H01L24/32 ,  H01L24/73 ,  H01L24/83 ,  H01L24/92 ,  H01L24/94 ,  H01L24/97 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/0657 ,  H01L25/18 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/05568 ,  H01L2224/05569 ,  H01L2224/0603 ,  H01L2224/06181 ,  H01L2224/131 ,  H01L2224/1403 ,  H01L2224/14181 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16238 ,  H01L2224/17181 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/83192 ,  H01L2224/92125 ,  H01L2224/92225 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06548 ,  H01L2225/06586 ,  H01L2225/06589 ,  H01L2225/06596 ,  H01L2924/12042 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/1615 ,  H01L2924/16152 ,  H01L2924/16153 ,  H01L2924/16176 ,  H01L2924/16235 ,  H01L2924/16251 ,  H01L2924/1632 ,  H01L2924/164 ,  H01L2924/167 ,  H01L2924/16788 ,  H01L2924/1679 ,  H01L2924/181 ,  H01L2924/351 ,  H01L2924/3511 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2924/014 ,  H01L2924/00 ,  H01L2924/00012

摘要： An assembly with modules (110, 1310) containing integrated circuits and attached to a wiring substrate (120) is reinforced by one or more reinforcement frames (410) attached to the wiring substrate. The modules are located in openings (e.g. cavities and/or through-holes 414) in the reinforcement frame. Other features are also provided.

摘要翻译： 包含集成电路并附接到布线基板（120）的模块（110,1310）的组件由附接到布线基板的一个或多个加强框架（410）加强。 模块位于加强框架中的开口（例如空腔和/或通孔414）中。 还提供其他功能。

公开(公告)号：US08314485B2

公开(公告)日：2012-11-20

申请号：US12673098

申请日：2009-02-16

申请人： Kazuyuki Ono ,  Yoshio Tanaka ,  Kiyoshi Nakajima ,  Naoto Kuratani ,  Tomofumi Maekawa

发明人： Kazuyuki Ono ,  Yoshio Tanaka ,  Kiyoshi Nakajima ,  Naoto Kuratani ,  Tomofumi Maekawa

IPC分类号： H01L23/04

CPC分类号： H05K3/341 ,  H01L23/055 ,  H01L23/10 ,  H01L23/552 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/05554 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48235 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/10162 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/16152 ,  H01L2924/16251 ,  H01L2924/16315 ,  H01L2924/1632 ,  H01L2924/3025 ,  H05K3/3452 ,  H05K2201/099 ,  H05K2201/10371 ,  Y02P70/613 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： An electronic component has a board, a semiconductor element mounted on an upper surface of the board, a ground electrode formed in a region surrounding the semiconductor element on the upper surface of the board, a conductive cap that overlaps the board such that the semiconductor element is covered therewith, and a conductive joining member that joins a whole periphery of a lower surface of the conductive cap to the ground electrode. The conductive cap includes a pressing portion on the lower surface thereof The lower surface of the conductive cap and the ground electrode are joined by the conductive joining member on an outer peripheral side of the pressing portion.

摘要翻译： 电子部件具有基板，安装在基板的上表面的半导体元件，形成在基板上表面上的半导体元件周围的区域的接地电极，与基板重叠的导电盖，使得半导体元件 并且将导电盖的下表面的整个周边连接到接地电极的导电接合部件。 导电盖包括在其下表面上的按压部分。导电盖的下表面和接地电极通过导电接合部件在按压部分的外周侧上接合。