公开(公告)号：US09761505B2

公开(公告)日：2017-09-12

申请号：US14921067

申请日：2015-10-23

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Isabel De Sousa ,  Annique Lavoie ,  Eric Salvas ,  Michel Turgeon

IPC: H01L21/48 ,  H01L23/367 ,  H01L23/00 ,  H01L21/56 ,  H01L21/66 ,  H01L23/04 ,  H01L23/42 ,  H01L21/50 ,  H01L25/00 ,  H01L21/3105 ,  H01L21/52 ,  H01L21/321 ,  H01L21/324 ,  H01L23/373 ,  H01L23/50

CPC classification number: H01L23/3675 ,  H01L21/3105 ,  H01L21/321 ,  H01L21/324 ,  H01L21/481 ,  H01L21/4817 ,  H01L21/4882 ,  H01L21/50 ,  H01L21/52 ,  H01L21/563 ,  H01L21/565 ,  H01L22/10 ,  H01L22/12 ,  H01L22/20 ,  H01L23/04 ,  H01L23/367 ,  H01L23/3737 ,  H01L23/42 ,  H01L23/50 ,  H01L24/83 ,  H01L25/50 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/33181 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/83048 ,  H01L2224/83191 ,  H01L2224/832 ,  H01L2224/83201 ,  H01L2224/838 ,  H01L2224/83855 ,  H01L2224/83908 ,  H01L2224/83986 ,  H01L2924/06 ,  H01L2924/16251 ,  H01L2924/1659 ,  H01L2924/20102 ,  H01L2924/00 ,  H01L2924/00014

Abstract: A packaged assembly is disclosed, including thermal interface material dispensed on an organic package and methods of manufacturing. The method includes dispensing a thermal interface material (TIM) on an electronic assembly. The method further includes removing volatile species of the TIM, prior to lid placement on the electronic assembly. The method further includes placing the lid on the TIM, over the electronic assembly. The method further includes pressing the lid onto the electronic assembly.

公开(公告)号：US20220359401A1

公开(公告)日：2022-11-10

申请号：US17315859

申请日：2021-05-10

Applicant: International Business Machines Corporation

Inventor： Kamal K. Sikka ,  Maryse Cournoyer ,  Pascale Gagnon ,  Charles C. Bureau ,  Catherine Dufort ,  Dale Curtis McHerron ,  Vijayeshwar Das Khanna ,  Marc A. Bergendahl ,  Dishit Paresh Parekh ,  RAVI K. BONAM ,  HIROYUKI MORI ,  Yang Liu ,  Paul S. Andry ,  Isabel De Sousa

IPC: H01L23/538 ,  H01L23/00 ,  H01L25/065 ,  H01L23/13 ,  H01L21/48

Abstract: A direct bonded heterogeneous integration (DBHi) device includes a substrate including a trench formed in a top surface of the substrate. The DBHi device further includes a first chip coupled to the substrate on a first side of the trench by a plurality of first interconnects. The DBHi device further includes a second chip coupled to the substrate on a second side of the trench by a plurality of second interconnects. The second side of the trench is arranged opposite the first side of the trench. The DBHi device further includes a bridge coupled to the first chip and to the second chip by a plurality of third interconnects such that the bridge is suspended in the trench. The DBHi device further includes a non-conductive paste material surrounding the plurality of third interconnects to further couple the bridge to the first chip and to the second chip.

公开(公告)号：US11209598B2

公开(公告)日：2021-12-28

申请号：US16288946

申请日：2019-02-28

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Barnim Alexander Janta-Polczynski ,  Isabel De Sousa ,  Jean Audet ,  Maryse Cournoyer ,  Sylvain Pharand ,  Roxan Lemire ,  Louis-Marie Achard ,  Paul Francis Fortier

IPC: G02B6/30

Abstract: A photonic package is provided. The photonic package includes a base substrate defining an aperture, a top die and a photonic integrated circuit (PIC) die. The top die includes a body with first and second top die sections. The first top die section is connectable with the base substrate. The PIC die includes body with first and second PIC die sections. The PIC die is disposable in the aperture such that the second PIC die section is connectable with the second top die section and the first PIC die section extends beyond the second top die section and is exposed for connection to a waveguide assembly.

公开(公告)号：US20200279840A1

公开(公告)日：2020-09-03

申请号：US16288946

申请日：2019-02-28

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： BARNIM ALEXANDER JANTA-POLCZYNSKI ,  Isabel De Sousa ,  Jean Audet ,  Maryse Cournoyer ,  Sylvain Pharand ,  Roxan Lemire ,  Louis-Marie Achard ,  Paul Francis Fortier

IPC: H01L25/18 ,  G02B6/26 ,  H01L23/13 ,  H01L23/538 ,  H01L25/00 ,  H01L21/48

Abstract: A photonic package is provided. The photonic package includes a base substrate defining an aperture, a top die and a photonic integrated circuit (PIC) die. The top die includes a body with first and second top die sections. The first top die section is connectable with the base substrate. The PIC die includes body with first and second PIC die sections. The PIC die is disposable in the aperture such that the second PIC die section is connectable with the second top die section and the first PIC die section extends beyond the second top die section and is exposed for connection to a waveguide assembly.

公开(公告)号：US20180190565A1

公开(公告)日：2018-07-05

申请号：US15907802

申请日：2018-02-28

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Isabel De Sousa ,  Annique Lavoie ,  Eric Salvas ,  Michel Turgeon

IPC: H01L23/367 ,  H01L25/00 ,  H01L21/48 ,  H01L23/42 ,  H01L21/50 ,  H01L21/56 ,  H01L21/321 ,  H01L21/66 ,  H01L21/52

CPC classification number: H01L23/3675 ,  H01L21/3105 ,  H01L21/321 ,  H01L21/324 ,  H01L21/481 ,  H01L21/4817 ,  H01L21/4882 ,  H01L21/50 ,  H01L21/52 ,  H01L21/563 ,  H01L21/565 ,  H01L22/10 ,  H01L22/12 ,  H01L22/20 ,  H01L23/04 ,  H01L23/367 ,  H01L23/3737 ,  H01L23/42 ,  H01L23/50 ,  H01L24/83 ,  H01L25/50 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/33181 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/83048 ,  H01L2224/83191 ,  H01L2224/832 ,  H01L2224/83201 ,  H01L2224/838 ,  H01L2224/83855 ,  H01L2224/83908 ,  H01L2224/83986 ,  H01L2924/06 ,  H01L2924/16251 ,  H01L2924/1659 ,  H01L2924/20102 ,  H01L2924/00 ,  H01L2924/00014

Abstract: A packaged assembly is disclosed, including thermal interface material dispensed on an organic package and methods of manufacturing. The method includes dispensing a thermal interface material (TIM) on an electronic assembly. The method further includes removing volatile species of the TIM, prior to lid placement on the electronic assembly. The method further includes placing the lid on the TIM, over the electronic assembly. The method further includes pressing the lid onto the electronic assembly.

公开(公告)号：US09881848B2

公开(公告)日：2018-01-30

申请号：US14921072

申请日：2015-10-23

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Isabel De Sousa ,  Annique Lavoie ,  Eric Salvas ,  Michel Turgeon

IPC: H01L21/00 ,  H01L23/367 ,  H01L23/00 ,  H01L21/56 ,  H01L21/66 ,  H01L23/04 ,  H01L23/42 ,  H01L21/48 ,  H01L21/50 ,  H01L25/00 ,  H01L21/3105 ,  H01L21/52 ,  H01L21/321 ,  H01L21/324 ,  H01L23/373 ,  H01L23/50

CPC classification number: H01L23/3675 ,  H01L21/3105 ,  H01L21/321 ,  H01L21/324 ,  H01L21/481 ,  H01L21/4817 ,  H01L21/4882 ,  H01L21/50 ,  H01L21/52 ,  H01L21/563 ,  H01L21/565 ,  H01L22/10 ,  H01L22/12 ,  H01L22/20 ,  H01L23/04 ,  H01L23/367 ,  H01L23/3737 ,  H01L23/42 ,  H01L23/50 ,  H01L24/83 ,  H01L25/50 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/33181 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/83048 ,  H01L2224/83191 ,  H01L2224/832 ,  H01L2224/83201 ,  H01L2224/838 ,  H01L2224/83855 ,  H01L2224/83908 ,  H01L2224/83986 ,  H01L2924/06 ,  H01L2924/16251 ,  H01L2924/1659 ,  H01L2924/20102 ,  H01L2924/00 ,  H01L2924/00014

Abstract: A packaged assembly is disclosed, including thermal interface material dispensed on an organic package and methods of manufacturing. The method includes dispensing a thermal interface material (TIM) on an electronic assembly. The method further includes removing volatile species of the TIM, prior to lid placement on the electronic assembly. The method further includes placing the lid on the TIM, over the electronic assembly. The method further includes pressing the lid onto the electronic assembly.

公开(公告)号：US09257308B2

公开(公告)日：2016-02-09

申请号：US14836461

申请日：2015-08-26

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Isabel De Sousa ,  Annique Lavoie ,  Eric Salvas ,  Michel Turgeon

IPC: H01L21/00 ,  H01L21/48 ,  H01L25/00

CPC classification number: H01L23/3675 ,  H01L21/3105 ,  H01L21/321 ,  H01L21/324 ,  H01L21/481 ,  H01L21/4817 ,  H01L21/4882 ,  H01L21/50 ,  H01L21/52 ,  H01L21/563 ,  H01L21/565 ,  H01L22/10 ,  H01L22/12 ,  H01L22/20 ,  H01L23/04 ,  H01L23/367 ,  H01L23/3737 ,  H01L23/42 ,  H01L23/50 ,  H01L24/83 ,  H01L25/50 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/33181 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/83048 ,  H01L2224/83191 ,  H01L2224/832 ,  H01L2224/83201 ,  H01L2224/838 ,  H01L2224/83855 ,  H01L2224/83908 ,  H01L2224/83986 ,  H01L2924/06 ,  H01L2924/16251 ,  H01L2924/1659 ,  H01L2924/20102 ,  H01L2924/00 ,  H01L2924/00014

Abstract: A packaged assembly is disclosed, including thermal interface material dispensed on an organic package and methods of manufacturing. The method includes dispensing a thermal interface material (TIM) on an electronic assembly. The method further includes removing volatile species of the TIM, prior to lid placement on the electronic assembly. The method further includes placing the lid on the TIM, over the electronic assembly. The method further includes pressing the lid onto the electronic assembly.

公开(公告)号：US11791270B2

公开(公告)日：2023-10-17

申请号：US17315859

申请日：2021-05-10

Applicant: International Business Machines Corporation

Inventor： Kamal K Sikka ,  Maryse Cournoyer ,  Pascale Gagnon ,  Charles C. Bureau ,  Catherine Dufort ,  Dale Curtis McHerron ,  Vijayeshwar Das Khanna ,  Marc A. Bergendahl ,  Dishit Paresh Parekh ,  Ravi K. Bonam ,  Hiroyuki Mori ,  Yang Liu ,  Paul S. Andry ,  Isabel De Sousa

IPC: H01L23/538 ,  H01L21/48 ,  H01L23/13 ,  H01L25/065 ,  H01L23/00

CPC classification number: H01L23/5381 ,  H01L21/4853 ,  H01L21/4867 ,  H01L23/13 ,  H01L23/5386 ,  H01L24/05 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/73 ,  H01L24/81 ,  H01L25/0655 ,  H01L2224/0401 ,  H01L2224/13147 ,  H01L2224/16237 ,  H01L2224/16257 ,  H01L2224/1703 ,  H01L2224/73204 ,  H01L2224/81203 ,  H01L2924/1616 ,  H01L2924/1632 ,  H01L2924/3512

Abstract: A direct bonded heterogeneous integration (DBHi) device includes a substrate including a trench formed in a top surface of the substrate. The DBHi device further includes a first chip coupled to the substrate on a first side of the trench by a plurality of first interconnects. The DBHi device further includes a second chip coupled to the substrate on a second side of the trench by a plurality of second interconnects. The second side of the trench is arranged opposite the first side of the trench. The DBHi device further includes a bridge coupled to the first chip and to the second chip by a plurality of third interconnects such that the bridge is suspended in the trench. The DBHi device further includes a non-conductive paste material surrounding the plurality of third interconnects to further couple the bridge to the first chip and to the second chip.

公开(公告)号：US10896862B2

公开(公告)日：2021-01-19

申请号：US15907802

申请日：2018-02-28

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Isabel De Sousa ,  Annique Lavoie ,  Eric Salvas ,  Michel Turgeon

IPC: H01L23/367 ,  H01L23/00 ,  H01L21/56 ,  H01L21/66 ,  H01L23/04 ,  H01L23/42 ,  H01L21/50 ,  H01L21/48 ,  H01L25/00 ,  H01L21/3105 ,  H01L21/52 ,  H01L21/321 ,  H01L21/324 ,  H01L23/373 ,  H01L23/50

Abstract: A packaged assembly is disclosed, including thermal interface material dispensed on an organic package and methods of manufacturing. The method includes dispensing a thermal interface material (TIM) on an electronic assembly. The method further includes removing volatile species of the TIM, prior to lid placement on the electronic assembly. The method further includes placing the lid on the TIM, over the electronic assembly. The method further includes pressing the lid onto the electronic assembly.

公开(公告)号：US09941184B2

公开(公告)日：2018-04-10

申请号：US15791815

申请日：2017-10-24

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Isabel De Sousa ,  Annique Lavoie ,  Eric Salvas ,  Michel Turgeon

IPC: H01L21/00 ,  H01L23/367 ,  H01L23/00 ,  H01L21/66 ,  H01L21/56 ,  H01L23/04 ,  H01L21/48 ,  H01L23/42 ,  H01L25/00 ,  H01L21/50 ,  H01L21/324 ,  H01L21/321 ,  H01L21/52 ,  H01L21/3105 ,  H01L23/50 ,  H01L23/373

CPC classification number: H01L23/3675 ,  H01L21/3105 ,  H01L21/321 ,  H01L21/324 ,  H01L21/481 ,  H01L21/4817 ,  H01L21/4882 ,  H01L21/50 ,  H01L21/52 ,  H01L21/563 ,  H01L21/565 ,  H01L22/10 ,  H01L22/12 ,  H01L22/20 ,  H01L23/04 ,  H01L23/367 ,  H01L23/3737 ,  H01L23/42 ,  H01L23/50 ,  H01L24/83 ,  H01L25/50 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/33181 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/83048 ,  H01L2224/83191 ,  H01L2224/832 ,  H01L2224/83201 ,  H01L2224/838 ,  H01L2224/83855 ,  H01L2224/83908 ,  H01L2224/83986 ,  H01L2924/06 ,  H01L2924/16251 ,  H01L2924/1659 ,  H01L2924/20102 ,  H01L2924/00 ,  H01L2924/00014

Abstract: A packaged assembly is disclosed, including thermal interface material dispensed on an organic package and methods of manufacturing. The method includes dispensing a thermal interface material (TIM) on an electronic assembly. The method further includes removing volatile species of the TIM, prior to lid placement on the electronic assembly. The method further includes placing the lid on the TIM, over the electronic assembly. The method further includes pressing the lid onto the electronic assembly.