公开(公告)号：US09761505B2

公开(公告)日：2017-09-12

申请号：US14921067

申请日：2015-10-23

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Isabel De Sousa ,  Annique Lavoie ,  Eric Salvas ,  Michel Turgeon

IPC: H01L21/48 ,  H01L23/367 ,  H01L23/00 ,  H01L21/56 ,  H01L21/66 ,  H01L23/04 ,  H01L23/42 ,  H01L21/50 ,  H01L25/00 ,  H01L21/3105 ,  H01L21/52 ,  H01L21/321 ,  H01L21/324 ,  H01L23/373 ,  H01L23/50

CPC classification number: H01L23/3675 ,  H01L21/3105 ,  H01L21/321 ,  H01L21/324 ,  H01L21/481 ,  H01L21/4817 ,  H01L21/4882 ,  H01L21/50 ,  H01L21/52 ,  H01L21/563 ,  H01L21/565 ,  H01L22/10 ,  H01L22/12 ,  H01L22/20 ,  H01L23/04 ,  H01L23/367 ,  H01L23/3737 ,  H01L23/42 ,  H01L23/50 ,  H01L24/83 ,  H01L25/50 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/33181 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/83048 ,  H01L2224/83191 ,  H01L2224/832 ,  H01L2224/83201 ,  H01L2224/838 ,  H01L2224/83855 ,  H01L2224/83908 ,  H01L2224/83986 ,  H01L2924/06 ,  H01L2924/16251 ,  H01L2924/1659 ,  H01L2924/20102 ,  H01L2924/00 ,  H01L2924/00014

Abstract: A packaged assembly is disclosed, including thermal interface material dispensed on an organic package and methods of manufacturing. The method includes dispensing a thermal interface material (TIM) on an electronic assembly. The method further includes removing volatile species of the TIM, prior to lid placement on the electronic assembly. The method further includes placing the lid on the TIM, over the electronic assembly. The method further includes pressing the lid onto the electronic assembly.

公开(公告)号：US20140016283A1

公开(公告)日：2014-01-16

申请号：US14042752

申请日：2013-10-01

Applicant: International Business Machines Corporation

Inventor： Martin Beaumier ,  Alexandre Blander ,  Pascale Gagnon ,  Michael A. Gaynes ,  Eric Giguere ,  Eric Salvas ,  Luc Tousignant

IPC: H05K9/00

CPC classification number: H05K9/0009 ,  H01L23/055 ,  H01L23/10 ,  H01L23/552 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/10253 ,  H01L2924/15311 ,  H01L2924/16251 ,  Y10T29/49117 ,  H01L2924/00 ,  H01L2224/0401

Abstract: An apparatus for reducing EMI at the micro-electronic-component level includes a substrate having a ground conductor integrated therein. A micro-electronic component such as an integrated circuit is mounted to the substrate. An electrically conductive lid is mounted to the substrate, thereby forming a physical interface with the substrate. The electrically conductive lid substantially covers the micro-electronic component. A conductive link is provided to create an electrical connection between the electrically conductive lid and the ground conductor at the physical interface.

Abstract translation: 用于在微电子部件级降低EMI的装置包括具有集成在其中的接地导体的基板。 诸如集成电路的微电子部件安装到基板。 导电盖安装到基板上，从而与基板形成物理界面。 导电盖基本覆盖微电子部件。 提供导电链路以在物理接口处在导电盖和接地导体之间产生电连接。

公开(公告)号：US20180190565A1

公开(公告)日：2018-07-05

申请号：US15907802

申请日：2018-02-28

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Isabel De Sousa ,  Annique Lavoie ,  Eric Salvas ,  Michel Turgeon

IPC: H01L23/367 ,  H01L25/00 ,  H01L21/48 ,  H01L23/42 ,  H01L21/50 ,  H01L21/56 ,  H01L21/321 ,  H01L21/66 ,  H01L21/52

CPC classification number: H01L23/3675 ,  H01L21/3105 ,  H01L21/321 ,  H01L21/324 ,  H01L21/481 ,  H01L21/4817 ,  H01L21/4882 ,  H01L21/50 ,  H01L21/52 ,  H01L21/563 ,  H01L21/565 ,  H01L22/10 ,  H01L22/12 ,  H01L22/20 ,  H01L23/04 ,  H01L23/367 ,  H01L23/3737 ,  H01L23/42 ,  H01L23/50 ,  H01L24/83 ,  H01L25/50 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/33181 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/83048 ,  H01L2224/83191 ,  H01L2224/832 ,  H01L2224/83201 ,  H01L2224/838 ,  H01L2224/83855 ,  H01L2224/83908 ,  H01L2224/83986 ,  H01L2924/06 ,  H01L2924/16251 ,  H01L2924/1659 ,  H01L2924/20102 ,  H01L2924/00 ,  H01L2924/00014

Abstract: A packaged assembly is disclosed, including thermal interface material dispensed on an organic package and methods of manufacturing. The method includes dispensing a thermal interface material (TIM) on an electronic assembly. The method further includes removing volatile species of the TIM, prior to lid placement on the electronic assembly. The method further includes placing the lid on the TIM, over the electronic assembly. The method further includes pressing the lid onto the electronic assembly.

公开(公告)号：US09881848B2

公开(公告)日：2018-01-30

申请号：US14921072

申请日：2015-10-23

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Isabel De Sousa ,  Annique Lavoie ,  Eric Salvas ,  Michel Turgeon

IPC: H01L21/00 ,  H01L23/367 ,  H01L23/00 ,  H01L21/56 ,  H01L21/66 ,  H01L23/04 ,  H01L23/42 ,  H01L21/48 ,  H01L21/50 ,  H01L25/00 ,  H01L21/3105 ,  H01L21/52 ,  H01L21/321 ,  H01L21/324 ,  H01L23/373 ,  H01L23/50

CPC classification number: H01L23/3675 ,  H01L21/3105 ,  H01L21/321 ,  H01L21/324 ,  H01L21/481 ,  H01L21/4817 ,  H01L21/4882 ,  H01L21/50 ,  H01L21/52 ,  H01L21/563 ,  H01L21/565 ,  H01L22/10 ,  H01L22/12 ,  H01L22/20 ,  H01L23/04 ,  H01L23/367 ,  H01L23/3737 ,  H01L23/42 ,  H01L23/50 ,  H01L24/83 ,  H01L25/50 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/33181 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/83048 ,  H01L2224/83191 ,  H01L2224/832 ,  H01L2224/83201 ,  H01L2224/838 ,  H01L2224/83855 ,  H01L2224/83908 ,  H01L2224/83986 ,  H01L2924/06 ,  H01L2924/16251 ,  H01L2924/1659 ,  H01L2924/20102 ,  H01L2924/00 ,  H01L2924/00014

Abstract: A packaged assembly is disclosed, including thermal interface material dispensed on an organic package and methods of manufacturing. The method includes dispensing a thermal interface material (TIM) on an electronic assembly. The method further includes removing volatile species of the TIM, prior to lid placement on the electronic assembly. The method further includes placing the lid on the TIM, over the electronic assembly. The method further includes pressing the lid onto the electronic assembly.

公开(公告)号：US09257308B2

公开(公告)日：2016-02-09

申请号：US14836461

申请日：2015-08-26

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Isabel De Sousa ,  Annique Lavoie ,  Eric Salvas ,  Michel Turgeon

IPC: H01L21/00 ,  H01L21/48 ,  H01L25/00

CPC classification number: H01L23/3675 ,  H01L21/3105 ,  H01L21/321 ,  H01L21/324 ,  H01L21/481 ,  H01L21/4817 ,  H01L21/4882 ,  H01L21/50 ,  H01L21/52 ,  H01L21/563 ,  H01L21/565 ,  H01L22/10 ,  H01L22/12 ,  H01L22/20 ,  H01L23/04 ,  H01L23/367 ,  H01L23/3737 ,  H01L23/42 ,  H01L23/50 ,  H01L24/83 ,  H01L25/50 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/33181 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/83048 ,  H01L2224/83191 ,  H01L2224/832 ,  H01L2224/83201 ,  H01L2224/838 ,  H01L2224/83855 ,  H01L2224/83908 ,  H01L2224/83986 ,  H01L2924/06 ,  H01L2924/16251 ,  H01L2924/1659 ,  H01L2924/20102 ,  H01L2924/00 ,  H01L2924/00014

Abstract: A packaged assembly is disclosed, including thermal interface material dispensed on an organic package and methods of manufacturing. The method includes dispensing a thermal interface material (TIM) on an electronic assembly. The method further includes removing volatile species of the TIM, prior to lid placement on the electronic assembly. The method further includes placing the lid on the TIM, over the electronic assembly. The method further includes pressing the lid onto the electronic assembly.

公开(公告)号：US10896862B2

公开(公告)日：2021-01-19

申请号：US15907802

申请日：2018-02-28

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Isabel De Sousa ,  Annique Lavoie ,  Eric Salvas ,  Michel Turgeon

IPC: H01L23/367 ,  H01L23/00 ,  H01L21/56 ,  H01L21/66 ,  H01L23/04 ,  H01L23/42 ,  H01L21/50 ,  H01L21/48 ,  H01L25/00 ,  H01L21/3105 ,  H01L21/52 ,  H01L21/321 ,  H01L21/324 ,  H01L23/373 ,  H01L23/50

Abstract: A packaged assembly is disclosed, including thermal interface material dispensed on an organic package and methods of manufacturing. The method includes dispensing a thermal interface material (TIM) on an electronic assembly. The method further includes removing volatile species of the TIM, prior to lid placement on the electronic assembly. The method further includes placing the lid on the TIM, over the electronic assembly. The method further includes pressing the lid onto the electronic assembly.

公开(公告)号：US09941184B2

公开(公告)日：2018-04-10

申请号：US15791815

申请日：2017-10-24

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Isabel De Sousa ,  Annique Lavoie ,  Eric Salvas ,  Michel Turgeon

IPC: H01L21/00 ,  H01L23/367 ,  H01L23/00 ,  H01L21/66 ,  H01L21/56 ,  H01L23/04 ,  H01L21/48 ,  H01L23/42 ,  H01L25/00 ,  H01L21/50 ,  H01L21/324 ,  H01L21/321 ,  H01L21/52 ,  H01L21/3105 ,  H01L23/50 ,  H01L23/373

CPC classification number: H01L23/3675 ,  H01L21/3105 ,  H01L21/321 ,  H01L21/324 ,  H01L21/481 ,  H01L21/4817 ,  H01L21/4882 ,  H01L21/50 ,  H01L21/52 ,  H01L21/563 ,  H01L21/565 ,  H01L22/10 ,  H01L22/12 ,  H01L22/20 ,  H01L23/04 ,  H01L23/367 ,  H01L23/3737 ,  H01L23/42 ,  H01L23/50 ,  H01L24/83 ,  H01L25/50 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/33181 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/83048 ,  H01L2224/83191 ,  H01L2224/832 ,  H01L2224/83201 ,  H01L2224/838 ,  H01L2224/83855 ,  H01L2224/83908 ,  H01L2224/83986 ,  H01L2924/06 ,  H01L2924/16251 ,  H01L2924/1659 ,  H01L2924/20102 ,  H01L2924/00 ,  H01L2924/00014

Abstract: A packaged assembly is disclosed, including thermal interface material dispensed on an organic package and methods of manufacturing. The method includes dispensing a thermal interface material (TIM) on an electronic assembly. The method further includes removing volatile species of the TIM, prior to lid placement on the electronic assembly. The method further includes placing the lid on the TIM, over the electronic assembly. The method further includes pressing the lid onto the electronic assembly.

公开(公告)号：US09646913B2

公开(公告)日：2017-05-09

申请号：US14921026

申请日：2015-10-23

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Isabel De Sousa ,  Annique Lavoie ,  Eric Salvas ,  Michel Turgeon

IPC: H01L21/66 ,  H01L23/367 ,  H01L23/00 ,  H01L21/56 ,  H01L23/04 ,  H01L23/42 ,  H01L21/48 ,  H01L21/50 ,  H01L25/00 ,  H01L21/3105 ,  H01L21/52 ,  H01L21/321 ,  H01L21/324 ,  H01L23/373 ,  H01L23/50

CPC classification number: H01L23/3675 ,  H01L21/3105 ,  H01L21/321 ,  H01L21/324 ,  H01L21/481 ,  H01L21/4817 ,  H01L21/4882 ,  H01L21/50 ,  H01L21/52 ,  H01L21/563 ,  H01L21/565 ,  H01L22/10 ,  H01L22/12 ,  H01L22/20 ,  H01L23/04 ,  H01L23/367 ,  H01L23/3737 ,  H01L23/42 ,  H01L23/50 ,  H01L24/83 ,  H01L25/50 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/33181 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/83048 ,  H01L2224/83191 ,  H01L2224/832 ,  H01L2224/83201 ,  H01L2224/838 ,  H01L2224/83855 ,  H01L2224/83908 ,  H01L2224/83986 ,  H01L2924/06 ,  H01L2924/16251 ,  H01L2924/1659 ,  H01L2924/20102 ,  H01L2924/00 ,  H01L2924/00014

Abstract: A packaged assembly is disclosed, including thermal interface material dispensed on an organic package and methods of manufacturing. The method includes dispensing a thermal interface material (TIM) on an electronic assembly. The method further includes removing volatile species of the TIM, prior to lid placement on the electronic assembly. The method further includes placing the lid on the TIM, over the electronic assembly. The method further includes pressing the lid onto the electronic assembly.

公开(公告)号：US09576878B2

公开(公告)日：2017-02-21

申请号：US14921051

申请日：2015-10-23

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Isabel De Sousa ,  Annique Lavoie ,  Eric Salvas ,  Michel Turgeon

IPC: H01L21/00 ,  H01L23/367 ,  H01L23/00 ,  H01L21/56 ,  H01L21/66 ,  H01L23/04 ,  H01L23/42 ,  H01L21/48 ,  H01L21/50 ,  H01L25/00 ,  H01L21/3105 ,  H01L21/52 ,  H01L21/321 ,  H01L21/324 ,  H01L23/373 ,  H01L23/50

CPC classification number: H01L23/3675 ,  H01L21/3105 ,  H01L21/321 ,  H01L21/324 ,  H01L21/481 ,  H01L21/4817 ,  H01L21/4882 ,  H01L21/50 ,  H01L21/52 ,  H01L21/563 ,  H01L21/565 ,  H01L22/10 ,  H01L22/12 ,  H01L22/20 ,  H01L23/04 ,  H01L23/367 ,  H01L23/3737 ,  H01L23/42 ,  H01L23/50 ,  H01L24/83 ,  H01L25/50 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/33181 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/83048 ,  H01L2224/83191 ,  H01L2224/832 ,  H01L2224/83201 ,  H01L2224/838 ,  H01L2224/83855 ,  H01L2224/83908 ,  H01L2224/83986 ,  H01L2924/06 ,  H01L2924/16251 ,  H01L2924/1659 ,  H01L2924/20102 ,  H01L2924/00 ,  H01L2924/00014

Abstract: A packaged assembly is disclosed, including thermal interface material dispensed on an organic package and methods of manufacturing. The method includes dispensing a thermal interface material (TIM) on an electronic assembly. The method further includes removing volatile species of the TIM, prior to lid placement on the electronic assembly. The method further includes placing the lid on the TIM, over the electronic assembly. The method further includes pressing the lid onto the electronic assembly.

Abstract translation: 公开了一种封装的组件，包括分配在有机封装上的热界面材料和制造方法。 该方法包括在电子组件上分配热界面材料（TIM）。 该方法还包括在盖子放置在电子组件上之前去除TIM的挥发性物质。 该方法还包括将盖子放置在TIM上方的电子组件上。 该方法还包括将盖子按压到电子组件上。

公开(公告)号：US09257307B2

公开(公告)日：2016-02-09

申请号：US14836447

申请日：2015-08-26

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Isabel De Sousa ,  Annique Lavoie ,  Eric Salvas ,  Michel Turgeon

IPC: H01L21/00 ,  H01L21/48

CPC classification number: H01L23/3675 ,  H01L21/3105 ,  H01L21/321 ,  H01L21/324 ,  H01L21/481 ,  H01L21/4817 ,  H01L21/4882 ,  H01L21/50 ,  H01L21/52 ,  H01L21/563 ,  H01L21/565 ,  H01L22/10 ,  H01L22/12 ,  H01L22/20 ,  H01L23/04 ,  H01L23/367 ,  H01L23/3737 ,  H01L23/42 ,  H01L23/50 ,  H01L24/83 ,  H01L25/50 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/33181 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/83048 ,  H01L2224/83191 ,  H01L2224/832 ,  H01L2224/83201 ,  H01L2224/838 ,  H01L2224/83855 ,  H01L2224/83908 ,  H01L2224/83986 ,  H01L2924/06 ,  H01L2924/16251 ,  H01L2924/1659 ,  H01L2924/20102 ,  H01L2924/00 ,  H01L2924/00014

Abstract: A packaged assembly is disclosed, including thermal interface material dispensed on an organic package and methods of manufacturing. The method includes dispensing a thermal interface material (TIM) on an electronic assembly. The method further includes removing volatile species of the TIM, prior to lid placement on the electronic assembly. The method further includes placing the lid on the TIM, over the electronic assembly. The method further includes pressing the lid onto the electronic assembly.