Invention Grant
- Patent Title: Thermal interface material on package
- Patent Title (中): 封装上的热界面材料
-
Application No.: US14921051Application Date: 2015-10-23
-
Publication No.: US09576878B2Publication Date: 2017-02-21
- Inventor: Isabel De Sousa , Annique Lavoie , Eric Salvas , Michel Turgeon
- Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Applicant Address: US NY Armonk
- Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee Address: US NY Armonk
- Agency: Roberts Mlotkowski Safran Cole & Calderon
- Agent Steven Meyers; Andrew M. Calderon
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L23/367 ; H01L23/00 ; H01L21/56 ; H01L21/66 ; H01L23/04 ; H01L23/42 ; H01L21/48 ; H01L21/50 ; H01L25/00 ; H01L21/3105 ; H01L21/52 ; H01L21/321 ; H01L21/324 ; H01L23/373 ; H01L23/50
Abstract:
A packaged assembly is disclosed, including thermal interface material dispensed on an organic package and methods of manufacturing. The method includes dispensing a thermal interface material (TIM) on an electronic assembly. The method further includes removing volatile species of the TIM, prior to lid placement on the electronic assembly. The method further includes placing the lid on the TIM, over the electronic assembly. The method further includes pressing the lid onto the electronic assembly.
Public/Granted literature
- US20160043015A1 THERMAL INTERFACE MATERIAL ON PACKAGE Public/Granted day:2016-02-11
Information query
IPC分类:
