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公开(公告)号：US10706204B2
公开(公告)日：2020-07-07
申请号：US16149313
申请日：2018-10-02
Applicant: International Business Machines Corporation
Inventor： Jean Audet , Alain Ayotte , Franklin Baez , Anson Call , Deana Cosmadelis , Jason Lee Frankel , Kevin Grosselfinger , Roxan Lemire , Marek Andrzej Orlowski , Gilles Poitras , Paul Robert Walling
IPC: G06F30/398 , G06F30/392
Abstract: A method of performing automated surface-mount package design includes obtaining physical inputs that include names and locations of top and bottom pins, and obtaining electrical inputs that include electrical parameters such as impedance. The method also includes automatically performing analysis and processing of the physical inputs and the electrical inputs. A design file for manufacture of the surface-mount package is automatically generated based on the performing the analysis and the processing. The design file specifies a number and material of layers of the surface-mount package.
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公开(公告)号：US20200279840A1
公开(公告)日：2020-09-03
申请号：US16288946
申请日：2019-02-28
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor： BARNIM ALEXANDER JANTA-POLCZYNSKI , Isabel De Sousa , Jean Audet , Maryse Cournoyer , Sylvain Pharand , Roxan Lemire , Louis-Marie Achard , Paul Francis Fortier
Abstract: A photonic package is provided. The photonic package includes a base substrate defining an aperture, a top die and a photonic integrated circuit (PIC) die. The top die includes a body with first and second top die sections. The first top die section is connectable with the base substrate. The PIC die includes body with first and second PIC die sections. The PIC die is disposable in the aperture such that the second PIC die section is connectable with the second top die section and the first PIC die section extends beyond the second top die section and is exposed for connection to a waveguide assembly.
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公开(公告)号：US11209598B2
公开(公告)日：2021-12-28
申请号：US16288946
申请日：2019-02-28
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor： Barnim Alexander Janta-Polczynski , Isabel De Sousa , Jean Audet , Maryse Cournoyer , Sylvain Pharand , Roxan Lemire , Louis-Marie Achard , Paul Francis Fortier
IPC: G02B6/30
Abstract: A photonic package is provided. The photonic package includes a base substrate defining an aperture, a top die and a photonic integrated circuit (PIC) die. The top die includes a body with first and second top die sections. The first top die section is connectable with the base substrate. The PIC die includes body with first and second PIC die sections. The PIC die is disposable in the aperture such that the second PIC die section is connectable with the second top die section and the first PIC die section extends beyond the second top die section and is exposed for connection to a waveguide assembly.
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公开(公告)号：US20200104454A1
公开(公告)日：2020-04-02
申请号：US16149313
申请日：2018-10-02
Applicant: International Business Machines Corporation
Inventor： Jean Audet , Alain Ayotte , Franklin Baez , Anson Call , Deana Cosmadelis , Jason Lee Frankel , Kevin Grosselfinger , Roxan Lemire , Marek Andrzej Orlowski , Gilles Poitras , Paul Robert Walling
IPC: G06F17/50
Abstract: A method of performing automated surface-mount package design includes obtaining physical inputs that include names and locations of top and bottom pins, and obtaining electrical inputs that include electrical parameters such as impedance. The method also includes automatically performing analysis and processing of the physical inputs and the electrical inputs. A design file for manufacture of the surface-mount package is automatically generated based on the performing the analysis and the processing. The design file specifies a number and material of layers of the surface-mount package.
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