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    Microlens array assembling process
    4.
    发明授权
    Microlens array assembling process 有权

    公开(公告)号：US10754070B2

    公开(公告)日：2020-08-25

    申请号：US16210630

    申请日：2018-12-05

    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

    Inventor： Koji Masuda ,  Alexander Janta-Polczynski ,  Patrick Jacques ,  Vincent Langlois ,  Paul Francis Fortier

    IPC: G02B6/42 ,  G02B6/38 ,  G02B3/00 ,  G02B6/125

    Abstract: An optical device includes: a substrate including plural waveguide cores; and an optical component provided on the substrate, the optical component including plural lenses, each of the plural lenses transmitting light passing through one of the corresponding plural waveguide cores on the substrate. The substrate and the optical component are each provided with a positioning structure. The positioning structure includes plural protrusions and plural recesses provided on the substrate and the optical component. Each of the plural recesses accommodates a corresponding one of the plural protrusions, and an outer surface of each of the plural protrusions contacts a positioning surface of a corresponding one of the plural recesses. The positioning surface is a part of an inner surface of each of the plural recesses having accommodated the corresponding one of the plural protrusions to position the plural lenses relative to the substrate.

    Nanofiller in an optical interface
    5.
    发明授权
    Nanofiller in an optical interface 有权

    公开(公告)号：US10338325B1

    公开(公告)日：2019-07-02

    申请号：US15995559

    申请日：2018-06-01

    Applicant: International Business Machines Corporation

    Inventor： Barnim Alexander Janta-Polczynski ,  Tymon Barwicz ,  Elaine Cyr ,  Nicolas Boyer ,  Marie-Claude Paquet ,  Richard D. Langlois ,  Paul Francis Fortier

    IPC: G02B6/42 ,  G02B6/02

    Abstract: Systems and methods for nanofiller in an optical interface are provided. One system includes a fiber-optic interface for one or more optical fibers that includes a body including one or more grooves defined therein. At least one groove in the one or more grooves is configured to receive a corresponding optical fiber of the one or more optical fibers. The at least one groove of the one or more grooves is further configured to receive an adhesive to attach the body to a portion of the corresponding optical fiber. Further, fiber-optic interface includes a suspended structure associated with the at least one groove configured to couple light between the suspended structure and the corresponding optical fiber. Also, the adhesive comprises nanofiller configured to support an alignment of the suspended structure with the corresponding optical fiber within the at least one groove.

    PLUGGABLE LGA SOCKET FOR HIGH DENSITY INTERCONNECTS
    7.
    发明申请
    PLUGGABLE LGA SOCKET FOR HIGH DENSITY INTERCONNECTS 有权
    用于高密度互连的可插拔LGA插座

    公开(公告)号：US20160118731A1

    公开(公告)日：2016-04-28

    申请号：US14520530

    申请日：2014-10-22

    Applicant: International Business Machines Corporation

    Inventor： Alan F. Benner ,  Benjamin Vito Fasano ,  Paul Francis Fortier ,  Hilton T. Toy

    IPC: H01R12/70 ,  H01R12/71 ,  H01R43/20 ,  H01R24/76

    CPC classification number: H01R12/7076 ,  H01R4/5083 ,  H01R12/523 ,  H01R12/716 ,  H01R12/772 ,  H01R12/774 ,  H01R12/79

    Abstract: In some embodiments, an apparatus includes a land grid array connector positioned above an electrical package. The apparatus also includes a channel housing positioned above the land grid array. The apparatus includes an electrical-to-optical transceiver positioned in an opening of a socket of the channel housing, wherein a tapered opening is formed above the electrical-to-optical transceiver in the channel housing after the electrical-to-optical transceiver is positioned in the opening of the socket of the channel housing. A gap of the tapered opening decreases progressively starting from the opening of the socket. A conductive wedge positioned in the gap of the tapered opening.

    Abstract translation: 在一些实施例中，一种装置包括位于电气封装之上的焊盘格栅阵列连接器。 该装置还包括位于焊盘格栅阵列上方的通道外壳。 该设备包括定位在通道外壳的插座的开口中的电光收发器，其中在电对光收发器被定位之后，在通道外壳中的电 - 光收发器之上形成锥形开口 在通道外壳的插座的开口处。 锥形开口的间隙从插座的开口开始逐渐减小。 位于锥形开口的间隙中的导电楔。

    Pluggable LGA socket for high density interconnects
    9.
    发明授权
    Pluggable LGA socket for high density interconnects 有权

    公开(公告)号：US10128590B2

    公开(公告)日：2018-11-13

    申请号：US14833379

    申请日：2015-08-24

    Applicant: International Business Machines Corporation

    Inventor： Alan F. Benner ,  Benjamin Vito Fasano ,  Paul Francis Fortier ,  Hilton T. Toy

    IPC: H01R12/70 ,  H01R12/77 ,  H01R12/79 ,  H01R12/52 ,  H01R12/71 ,  H01R4/50

    Abstract: Embodiments provide for a method for pluggable Land Grid Array (LGA) socket for high density interconnects. A method includes inserting an electrical-to-optical transceiver into an opening of a channel housing that is positioned above a land grid array connector located on an electrical package. After the electrical-to-optical transceiver is inserted into the channel housing, a tapered opening remains between an upper portion of the channel housing above the electrical-to-optical transceiver, wherein a gap of the tapered opening decreases progressively starting from the opening. The method includes inserting a conductive wedge into the gap of the tapered opening prior to communications through the electrical-to-optical transceiver between a component on the electrical package and a component external to the electrical package.

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