公开(公告)号：US20140202246A1

公开(公告)日：2014-07-24

申请号：US14240503

申请日：2012-08-24

申请人： Thomas Fischer ,  Stefan Günthner ,  Dietmar Huber ,  Jakob Schillinger

发明人： Thomas Fischer ,  Stefan Günthner ,  Dietmar Huber ,  Jakob Schillinger

IPC分类号： G01P15/08

CPC分类号： G01P1/023 ,  B81C1/0023 ,  H01L23/49575 ,  H01L24/16 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/13101 ,  H01L2224/13147 ,  H01L2224/16245 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2924/00014 ,  H01L2924/1461 ,  H01L2924/181 ,  H05K3/284 ,  H05K2201/10674 ,  H05K2201/10924 ,  H01L2224/48227 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2924/00012

摘要： A sensor having at least one sensor element (1), at least one signal processing element (2), and a housing (7) which has at least one fastening means. An electrical interface is provided for electrically connecting the sensor. The sensor has an electrically and mechanically connecting carrier means (4) on which the at least one sensor element (1) and the signal processing element (2) are arranged and are electrically connected to the carrier means. The carrier means (4) is also at least electrically connected to the electrical interface.

摘要翻译： 具有至少一个传感器元件（1），至少一个信号处理元件（2）和具有至少一个紧固装置的壳体（7）的传感器。 提供用于电连接传感器的电接口。 传感器具有电气和机械连接的载体装置（4），其上安置有至少一个传感器元件（1）和信号处理元件（2）并且电连接到载体装置。 载体装置（4）至少电连接到电接口。

公开(公告)号：US20140175499A1

公开(公告)日：2014-06-26

申请号：US14011686

申请日：2013-08-27

申请人： Hon Hai Precision Industry Co., Ltd.

发明人： CHIH-CHEN LAI

IPC分类号： H01L33/62

CPC分类号： H01L33/62 ,  H01L24/13 ,  H01L24/14 ,  H01L24/17 ,  H01L24/29 ,  H01L2224/13101 ,  H01L2224/14051 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/12041 ,  H01L2933/0066 ,  H01L2924/00012 ,  H01L2924/014 ,  H01L2924/00014

摘要： An LED includes an LED chip, a substrate, a first electrode and a second electrode formed on the LED chip, and a first solder layer and a second solder layer formed on a top face of the substrate. The first solder layer is soldered on the first electrode and sandwiched between the LED chip and the substrate. The second solder layer is soldered on the second electrode and sandwiched between the LED chip and the substrate. A projection of the first solder layer on the top face of the substrate exceeds a periphery of a projection of the LED chip on the top face of the substrate. A projection of the second solder layer on the top face of the substrate exceeds the periphery of the projection of the LED chip on the top face of the substrate.

摘要翻译： LED包括LED芯片，基板，形成在LED芯片上的第一电极和第二电极，以及形成在基板顶面上的第一焊料层和第二焊料层。 第一焊料层焊接在第一电极上并夹在LED芯片和衬底之间。 第二焊料层焊接在第二电极上并夹在LED芯片和衬底之间。 第一焊料层在衬底的顶面上的突起超过衬底顶面上的LED芯片的突起的周边。 衬底顶面上的第二焊料层的突出部超过衬底顶面上的LED芯片的突起的周边。

公开(公告)号：US08754508B2

公开(公告)日：2014-06-17

申请号：US13598196

申请日：2012-08-29

申请人： Hsien-Wei Chen ,  Hung-Jui Kuo

发明人： Hsien-Wei Chen ,  Hung-Jui Kuo

IPC分类号： H01L29/06

CPC分类号： H01L23/3192 ,  H01L23/3114 ,  H01L23/525 ,  H01L23/53223 ,  H01L23/53238 ,  H01L23/53266 ,  H01L23/5329 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/11334 ,  H01L2224/1146 ,  H01L2224/11462 ,  H01L2224/1147 ,  H01L2224/13101 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13166 ,  H01L2224/13181 ,  H01L2924/014 ,  H01L2924/00014

摘要： A semiconductor device includes a recess in a polymer layer between two adjacent metal lines and over passivation layer or anti-electromigration layers on redistribution metal lines to increase the resistance to electromigration.

摘要翻译： 半导体器件包括位于两个相邻金属线之间的聚合物层中的凹槽，以及在再分布金属线上的钝化层或抗电迁移层上，以增加对电迁移的抵抗力。

公开(公告)号：US08709875B2

公开(公告)日：2014-04-29

申请号：US13549518

申请日：2012-07-16

申请人： Jinzhong Yao ,  Zhigang Bai ,  Xuesong Xu

发明人： Jinzhong Yao ,  Zhigang Bai ,  Xuesong Xu

IPC分类号： H01L21/48

CPC分类号： H01L23/49537 ,  H01L21/561 ,  H01L21/565 ,  H01L23/3107 ,  H01L23/4334 ,  H01L23/49551 ,  H01L23/49568 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/13101 ,  H01L2224/1329 ,  H01L2224/16245 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/73207 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2224/92242 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/0781 ,  H01L2924/12042 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13062 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/0665 ,  H01L2924/014 ,  H01L2924/00012

摘要： A method of packaging a power semiconductor die includes providing a first lead frame of a dual gauge lead frame. The first lead frame includes a thick die pad. A tape is attached to a first side of the thick die pad and the power die is attached to a second side of the thick die pad. A second lead frame of the dual gauge lead frame is provided. The second lead frame has thin lead fingers. One end of the lead fingers is attached to an active surface of the power die such that the lead fingers are electrically connected to bonding pads of the power die. A molding compound is then dispensed onto a top surface of the dual gauge lead frame such that the molding compound covers the power die and the lead fingers.

摘要翻译： 封装功率半导体管芯的方法包括提供双量规引线框架的第一引线框架。 第一引线框架包括厚的芯片焊盘。 磁带附着到厚芯片焊盘的第一侧，并且功率管芯附接到厚芯片焊盘的第二侧。 提供了双量规引线框架的第二引线框架。 第二引线框架具有薄的引线指。 引线指的一端连接到功率管芯的有源表面，使得引线指电连接到功率管芯的焊盘。 然后将模塑料分配到双量规引线框架的顶表面上，使得模制化合物覆盖电源模具和引线指。

公开(公告)号：US20140110826A1

公开(公告)日：2014-04-24

申请号：US13966506

申请日：2013-08-14

申请人： NXP B.V.

发明人： Hartmut BUENNING ,  Christian Zenz

IPC分类号： H01L29/06 ,  H01L21/78

CPC分类号： H01L21/78 ,  H01L21/561 ,  H01L23/3114 ,  H01L24/13 ,  H01L24/73 ,  H01L24/81 ,  H01L2224/13101 ,  H01L2224/73253 ,  H01L2924/014 ,  H01L2924/00014

摘要： Consistent with an example embodiment, there is a semiconductor device, having a topside surface and an underside surface, the semiconductor device comprises an active device of an area defined on the topside surface, the topside surface having a first area. A protective material is on to the underside surface of the semiconductor device, the protective material has an area greater than the first area. A laminating film attaches the protective material to the underside surface. The protective material serves to protect the semiconductor device from mechanical damage during handling and assembly onto a product's printed circuit board.

摘要翻译： 与示例实施例一致，存在具有顶侧表面和下表面的半导体器件，该半导体器件包括限定在顶侧表面上的区域的有源器件，顶侧表面具有第一区域。 保护材料在半导体器件的下表面上，保护材料具有大于第一区域的面积。 层压膜将保护材料附接到下表面。 保护材料用于在处理和组装到产品的印刷电路板上时保护半导体器件免受机械损坏。

公开(公告)号：US20140077351A1

公开(公告)日：2014-03-20

申请号：US14058955

申请日：2013-10-21

申请人： Tessera, Inc.

发明人： Belgacem Haba

IPC分类号： H01L23/52 ,  H01L21/50

CPC分类号： H01L24/17 ,  B82Y40/00 ,  H01L21/4853 ,  H01L21/50 ,  H01L23/49811 ,  H01L23/52 ,  H01L24/05 ,  H01L24/06 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/73 ,  H01L24/81 ,  H01L24/92 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/0557 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/06181 ,  H01L2224/116 ,  H01L2224/1182 ,  H01L2224/11821 ,  H01L2224/13101 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13644 ,  H01L2224/13794 ,  H01L2224/13911 ,  H01L2224/13944 ,  H01L2224/13947 ,  H01L2224/16057 ,  H01L2224/16113 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16238 ,  H01L2224/29111 ,  H01L2224/73104 ,  H01L2224/81026 ,  H01L2224/81099 ,  H01L2224/81143 ,  H01L2224/81192 ,  H01L2224/81193 ,  H01L2224/81444 ,  H01L2224/81447 ,  H01L2224/81801 ,  H01L2224/9211 ,  H01L2224/94 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2225/06565 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15321 ,  H01L2924/20102 ,  H01L2924/20103 ,  H01L2924/20104 ,  H01L2924/20105 ,  Y10S977/773 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2224/05552

摘要： A method of making an assembly includes the steps of applying metallic nanoparticles to exposed surfaces of conductive elements of either of or both of a first component and a second component, juxtaposing the conductive elements of the first component with the conductive elements of the second component with the metallic nanoparticles disposed therebetween, and elevating a temperature at least at interfaces of the juxtaposed conductive elements to a joining temperature at which the metallic nanoparticles cause metallurgical joints to form between the juxtaposed conductive elements. The conductive elements of either of or both of the first component and the second component can include substantially rigid posts having top surfaces projecting a height above the surface of the respective component and edge surfaces extending at substantial angles away from the top surfaces thereof.

摘要翻译： 制造组件的方法包括以下步骤：将金属纳米颗粒施加到第一部件和第二部件中的任一个或两者的导电元件的暴露表面上，将第一部件的导电元件与第二部件的导电元件并置， 置于其间的金属纳米颗粒，并且至少在并置的导电元件的界面处将温度升高到金属纳米粒子在并置的导电元件之间形成冶金接头的接合温度。 第一部件和第二部件中的任一个或两者的导电元件可以包括基本上刚性的支柱，其具有突出在相应部件的表面上方的高度的顶表面，并且远离其顶表面以基本角度延伸的边缘表面。

公开(公告)号：US20140070999A1

公开(公告)日：2014-03-13

申请号：US13609388

申请日：2012-09-11

申请人： Noriaki Kaneda ,  Nagesh Basavanhally ,  Yves Baeyens ,  Young-Kai Chen ,  Shahriar Shahramian

发明人： Noriaki Kaneda ,  Nagesh Basavanhally ,  Yves Baeyens ,  Young-Kai Chen ,  Shahriar Shahramian

IPC分类号： H01Q1/38 ,  H01L21/98

CPC分类号： H01Q1/2283 ,  H01L23/66 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L2223/6677 ,  H01L2224/13101 ,  H01L2224/16225 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/351 ,  H01Q9/0435 ,  H01Q23/00 ,  H01L2924/014 ,  H01L2924/00014 ,  H01L2924/00

摘要： An apparatus includes a dielectric slab having first and opposing second major surfaces. A planar antenna element is located on the first major surface. A via formed through the dielectric slab is conductively connected to the antenna element. A plurality of solder bump pads is located on the second major surface and is configured to attach the dielectric slab to an integrated circuit.

摘要翻译： 一种装置包括具有第一和相对的第二主表面的电介质板。 平面天线元件位于第一主表面上。 通过电介质板形成的通孔与天线元件导电连接。 多个焊料凸点焊盘位于第二主表面上，并被构造成将电介质板连接到集成电路。

公开(公告)号：US20140009593A1

公开(公告)日：2014-01-09

申请号：US14020160

申请日：2013-09-06

申请人： FUJIKURA LTD.

发明人： Takeshi SEGI ,  Yusuke MATSUDA ,  Katsuya YAMAGAMI ,  Kenichi NAKATATE

IPC分类号： A61B1/005 ,  A61B1/00

CPC分类号： A61B1/005 ,  A61B1/0011 ,  A61B1/04 ,  A61B1/051 ,  G02B23/2484 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/1134 ,  H01L2224/1146 ,  H01L2224/13101 ,  H01L2224/16225 ,  H04N5/2257 ,  H04N2005/2255 ,  Y10T29/49128 ,  Y10T29/532 ,  H01L2924/014

摘要： An imaging module of the invention includes: an electrical cable; a solid-state image sensing device; and a flexible wiring substrate including: a device-mounted portion onto which the solid-state image sensing device is mounted; two extended portions which bend at both sides of the device-mounted portion and extend from the device-mounted portion so as to come close to each other with increasing distance from the device-mounted portion; two connection end portions extending from the two extended portions along the direction of the axis of the front end of the electrical cable on an opposite side of the device-mounted portion; and terminals which are provided on the two connection end portions and connected to the electrical cable, the flexible wiring substrate electrically connecting the solid-state image sensing device and the electrical cable.

摘要翻译： 本发明的成像模块包括：电缆; 固态图像感测装置; 以及柔性布线基板，包括：安装有固体摄像装置的装置安装部; 两个延伸部分，其在装置安装部分的两侧弯曲并且从装置安装部分延伸以便随着距装置安装部分的距离增加而彼此靠近; 两个连接端部分在两个延伸部分之间沿着电缆前端的轴线方向在装置安装部分的相对侧上延伸; 以及设置在两个连接端部并连接到电缆的端子，柔性布线基板电连接固态图像感测装置和电缆。

公开(公告)号：US20130153645A1

公开(公告)日：2013-06-20

申请号：US13680825

申请日：2012-11-19

申请人： Princeton Lightwave, Inc.

发明人： Mark Andrew Owens ,  Sabbir Sajjad Rangwala ,  Bora Muammer Onat ,  Domenick Salvemini

IPC分类号： H01L23/00

CPC分类号： H01L24/81 ,  H01L24/13 ,  H01L24/75 ,  H01L25/50 ,  H01L27/14634 ,  H01L27/14636 ,  H01L2224/13101 ,  H01L2224/13109 ,  H01L2224/75101 ,  H01L2224/75251 ,  H01L2224/75272 ,  H01L2224/75753 ,  H01L2224/81065 ,  H01L2224/81121 ,  H01L2224/81815 ,  H01L2224/83193 ,  H01L2225/06513 ,  H01L2924/01322 ,  H01L2924/01001 ,  H01L2924/014 ,  H01L2924/00014 ,  H01L2924/00

摘要： A method for aligning a first substrate relative to a second substrate by enabling reflow of low-melting-temperature solder bumps is disclosed. Reflow of the solder bumps induces a force that moves one substrate relative to the other to improve alignment accuracy between bond pads located on each substrate. The method further enables reduction of surface oxide on the solder bumps that would otherwise inhibit reliable solder joint formation.

摘要翻译： 公开了一种通过使低熔点焊料凸块进行回流来对准第一衬底相对于第二衬底的方法。 焊料凸起的回流引起使一个衬底相对于另一衬底的力，以提高位于每个衬底上的焊盘之间的对准精度。 该方法还能够减少焊料凸块上的表面氧化物，否则将抑制可靠的焊点形成。

公开(公告)号：US20130099374A1

公开(公告)日：2013-04-25

申请号：US13589259

申请日：2012-08-20

申请人： Kwon Whan HAN

发明人： Kwon Whan HAN

IPC分类号： H01L23/498 ,  H01L21/48 ,  H05K1/02

CPC分类号： H01L23/49816 ,  H01L21/4846 ,  H01L21/4853 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L25/0657 ,  H01L2224/0401 ,  H01L2224/05548 ,  H01L2224/05567 ,  H01L2224/1146 ,  H01L2224/1147 ,  H01L2224/13019 ,  H01L2224/13021 ,  H01L2224/13022 ,  H01L2224/13025 ,  H01L2224/13082 ,  H01L2224/13101 ,  H01L2224/13147 ,  H01L2224/1403 ,  H01L2224/14051 ,  H01L2224/14181 ,  H01L2224/16146 ,  H01L2224/16237 ,  H01L2224/2919 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/81192 ,  H01L2224/81193 ,  H01L2224/81203 ,  H01L2224/81801 ,  H01L2224/83192 ,  H01L2224/9211 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2924/00014 ,  H01L2924/01322 ,  H01L2924/07802 ,  H05K1/02 ,  H05K3/4007 ,  Y10T29/49 ,  H01L2924/014 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2224/05552

摘要： A package of an electronic device, a system including the same and a method for fabricating the same are provided. The package of the electronic device includes a substrate, a step difference layer and a connecting bump. The substrate allows a connecting contact part to be exposed on a surface thereof. The step difference layer covers the substrate so as to leave the connecting contact part exposed. The connecting bump is connected to the connecting contact part so that one end part of the connecting bump is extended on the step difference layer, and has a sloped upper surface formed by a step difference formed by the step difference layer.

摘要翻译： 提供一种电子设备的封装，包括该封装的系统及其制造方法。 电子装置的封装包括基板，台阶差分层和连接凸块。 基板允许连接接触部分在其表面上露出。 台阶差层覆盖基板，以使连接接触部分露出。 连接凸块连接到连接接触部分，使得连接凸起的一个端部在台阶差层上延伸，并且具有由台阶差层形成的台阶差形成的倾斜的上表面。