公开(公告)号：US09325056B2

公开(公告)日：2016-04-26

申请号：US13609388

申请日：2012-09-11

申请人： Noriaki Kaneda ,  Nagesh Basavanhally ,  Yves Baeyens ,  Young-Kai Chen ,  Shahriar Shahramian

发明人： Noriaki Kaneda ,  Nagesh Basavanhally ,  Yves Baeyens ,  Young-Kai Chen ,  Shahriar Shahramian

IPC分类号： H01Q1/38 ,  H01L21/98 ,  H01Q1/22 ,  H01Q9/04 ,  H01Q23/00 ,  H01L23/00 ,  H01L23/66

CPC分类号： H01Q1/2283 ,  H01L23/66 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L2223/6677 ,  H01L2224/13101 ,  H01L2224/16225 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/351 ,  H01Q9/0435 ,  H01Q23/00 ,  H01L2924/014 ,  H01L2924/00014 ,  H01L2924/00

摘要： An apparatus includes a dielectric slab having first and opposing second major surfaces. A planar antenna element is located on the first major surface. A via formed through the dielectric slab is conductively connected to the antenna element. A plurality of solder bump pads is located on the second major surface and is configured to attach the dielectric slab to an integrated circuit.

摘要翻译： 一种装置包括具有第一和相对的第二主表面的电介质板。 平面天线元件位于第一主表面上。 通过电介质板形成的通孔与天线元件导电连接。 多个焊料凸点焊盘位于第二主表面上，并被构造成将电介质板连接到集成电路。

公开(公告)号：US20060097252A1

公开(公告)日：2006-05-11

申请号：US11312061

申请日：2005-12-20

申请人： Nagesh Basavanhally ,  Raymond Cirelli ,  Omar Lopez

发明人： Nagesh Basavanhally ,  Raymond Cirelli ,  Omar Lopez

IPC分类号： H01L29/06

CPC分类号： H01L24/12 ,  B81B7/0006 ,  B82Y10/00 ,  H01L24/16 ,  H01L24/90 ,  H01L2224/13078 ,  H01L2224/13099 ,  H01L2224/1319 ,  H01L2224/16105 ,  H01L2224/81193 ,  H01L2224/81194 ,  H01L2224/81345 ,  H01L2224/81385 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01055 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/1461 ,  H01L2924/19043 ,  H01L2924/00

摘要： The present invention provides an interconnect. The interconnect comprises a pliable surface having a plurality of nanostructures disposed thereon, the pliable surface configured to allow the plurality of nanostructures to at least partially conform to a surface when the nanostructures come into contact therewith.

公开(公告)号：US20080001306A1

公开(公告)日：2008-01-03

申请号：US11852413

申请日：2007-09-10

申请人： Nagesh Basavanhally ,  Raymond Cirelli ,  Omar Lopez

发明人： Nagesh Basavanhally ,  Raymond Cirelli ,  Omar Lopez

IPC分类号： H01L23/48

CPC分类号： H01L24/12 ,  B81B7/0006 ,  B82Y10/00 ,  H01L24/16 ,  H01L24/90 ,  H01L2224/13078 ,  H01L2224/13099 ,  H01L2224/1319 ,  H01L2224/16105 ,  H01L2224/81193 ,  H01L2224/81194 ,  H01L2224/81345 ,  H01L2224/81385 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01055 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/1461 ,  H01L2924/19043 ,  H01L2924/00

摘要： A method and apparatus for forming an electrically and/or thermally conducting interconnection is disclosed wherein a first surface and a second surface are contacted with each other via a plurality of nanostructures disposed on at least one of the surfaces. In one embodiment, a first plurality of areas of nanostructures is disposed on a component in an electronics package such as, illustratively, a microprocessor. The first plurality of areas is then brought into contact with a corresponding second plurality of areas of nanostructures on a substrate, thus creating a strong friction bond. In another illustrative embodiment, a plurality of nanostructures is disposed on a component, such as a microprocessor, which is then brought into contact with a substrate. Intermolecular forces result in an attraction between the molecules of the nanostructures and the molecules of the substrate, thus creating a bond between the nanostructures and the substrate.

摘要翻译： 公开了一种用于形成电和/或导热互连的方法和装置，其中通过设置在至少一个表面上的多个纳米结构使第一表面和第二表面彼此接触。 在一个实施例中，纳米结构的第一多个区域被布置在例如微处理器的电子封装中的部件上。 然后使第一多个区域与衬底上相应的第二多个纳米结构区域接触，从而产生强烈的摩擦接合。 在另一示例性实施例中，多个纳米结构设置在诸如微处理器的部件上，然后与基底接触。 分子间力导致纳米结构的分子和基底的分子之间的吸引力，从而在纳米结构和基底之间形成结合。

公开(公告)号：US20140070999A1

公开(公告)日：2014-03-13

申请号：US13609388

申请日：2012-09-11

申请人： Noriaki Kaneda ,  Nagesh Basavanhally ,  Yves Baeyens ,  Young-Kai Chen ,  Shahriar Shahramian

发明人： Noriaki Kaneda ,  Nagesh Basavanhally ,  Yves Baeyens ,  Young-Kai Chen ,  Shahriar Shahramian

IPC分类号： H01Q1/38 ,  H01L21/98

CPC分类号： H01Q1/2283 ,  H01L23/66 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L2223/6677 ,  H01L2224/13101 ,  H01L2224/16225 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/351 ,  H01Q9/0435 ,  H01Q23/00 ,  H01L2924/014 ,  H01L2924/00014 ,  H01L2924/00

摘要： An apparatus includes a dielectric slab having first and opposing second major surfaces. A planar antenna element is located on the first major surface. A via formed through the dielectric slab is conductively connected to the antenna element. A plurality of solder bump pads is located on the second major surface and is configured to attach the dielectric slab to an integrated circuit.

摘要翻译： 一种装置包括具有第一和相对的第二主表面的电介质板。 平面天线元件位于第一主表面上。 通过电介质板形成的通孔与天线元件导电连接。 多个焊料凸点焊盘位于第二主表面上，并被构造成将电介质板连接到集成电路。

公开(公告)号：US20140061921A1

公开(公告)日：2014-03-06

申请号：US13604080

申请日：2012-09-05

申请人： Nagesh Basavanhally

发明人： Nagesh Basavanhally

IPC分类号： H01L21/28 ,  H01L23/48

CPC分类号： H01L24/81 ,  G02B6/4202 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/0401 ,  H01L2224/05568 ,  H01L2224/05666 ,  H01L2224/05671 ,  H01L2224/1145 ,  H01L2224/11462 ,  H01L2224/1147 ,  H01L2224/11831 ,  H01L2224/13005 ,  H01L2224/13084 ,  H01L2224/13144 ,  H01L2224/13166 ,  H01L2224/13169 ,  H01L2224/13171 ,  H01L2224/13244 ,  H01L2224/13395 ,  H01L2224/16145 ,  H01L2224/16238 ,  H01L2224/16245 ,  H01L2224/81193 ,  H01L2224/81208 ,  H01L2224/81444 ,  H01L2224/8183 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/206 ,  H01L2924/01047

摘要： A method of manufacturing comprising providing a semiconductor layer having metal adhesion layer on a planar surface of the semiconductor layer and an alloy layer on the metal adhesion layer, the alloy layer comprising an alloy of gold and a non-gold metal. The method comprises removing a portion of the non-gold metal from the alloy layer to form a porous gold layer. The method comprises applying pressure between the porous gold layer and a metal layer to form a bond between the semiconductor layer and the metal layer.

摘要翻译： 一种制造方法，包括在所述半导体层的平面表面上提供具有金属粘合层的半导体层和在所述金属粘附层上的合金层，所述合金层包含金和非金属金属的合金。 该方法包括从合金层去除一部分非金属金属以形成多孔金层。 该方法包括在多孔金层和金属层之间施加压力以在半导体层和金属层之间形成结合。

公开(公告)号：US20050135742A1

公开(公告)日：2005-06-23

申请号：US10743922

申请日：2003-12-23

申请人： Nagesh Basavanhally ,  David Ramsey ,  Hong Tang

发明人： Nagesh Basavanhally ,  David Ramsey ,  Hong Tang

IPC分类号： G02B6/36 ,  G02B6/35 ,  G02B6/38 ,  G02B6/42 ,  G02B6/43 ,  G02B6/32 ,  G02B6/26

CPC分类号： G02B6/4292 ,  G02B6/3502 ,  G02B6/3512 ,  G02B6/3598 ,  G02B6/3897 ,  G02B6/43

摘要： A coupler assembly for an optical backplane system having a backplane and two or more circuit packs connected to that backplane. Each circuit pack has an optical transceiver and the backplane has an optical pipe (e.g., an array of waveguides) adapted to guide optical signals between the transceivers of different circuit packs. A coupler assembly is provided for each transceiver to couple light between that transceiver and the optical pipe. Advantageously, the coupler assembly has a movable optical element that can accommodate possible misalignment between the backplane and the circuit pack. In one embodiment, the movable optical element is an array of MEMS mirrors, each mirror adapted to direct light between an optical transmitter or receiver and the corresponding waveguide of the optical pipe. In another embodiment, the movable optical element is an array of flexible optical fibers, each coupled between an optical transmitter or receiver and the corresponding waveguide of the optical pipe and having an angled surface adapted to couple light between said fiber and waveguide.

摘要翻译： 一种用于光背板系统的耦合器组件，其具有连接到该背板的背板和两个或更多个电路板。 每个电路板具有光收发器，并且背板具有适于引导不同电路板的收发器之间的光信号的光管（例如，波导阵列）。 为每个收发器提供耦合器组件以在该收发器和光学管之间耦合光。 有利地，耦合器组件具有可容纳背板和电路板之间可能的未对准的可移动光学元件。 在一个实施例中，可移动光学元件是MEMS反射镜的阵列，每个反射镜适于在光学发射器或接收器与光学管道的相应波导管之间引导光。 在另一个实施例中，可移动光学元件是柔性光纤阵列，每个光纤连接在光发射器或接收器与光学管道的对应波导之间，并且具有适于在所述光纤和波导之间耦合光的倾斜表面。

公开(公告)号：US20100288525A1

公开(公告)日：2010-11-18

申请号：US12464461

申请日：2009-05-12

申请人： Nagesh Basavanhally ,  Christopher DW. Jones

发明人： Nagesh Basavanhally ,  Christopher DW. Jones

IPC分类号： H05K5/06 ,  B32B37/06 ,  B29C65/24

CPC分类号： H01L24/97 ,  H01L23/055 ,  H01L23/10 ,  H01L23/49811 ,  H01L23/49827 ,  H01L23/49833 ,  H01L24/48 ,  H01L24/85 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/4823 ,  H01L2224/48235 ,  H01L2224/48472 ,  H01L2224/85 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01007 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01031 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/15788 ,  H01L2924/16195 ,  H01L2924/19107 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/85399 ,  H01L2224/05599

摘要： An apparatus that comprises an electronic device package 102. The package includes an electronic device 105 on a first planar substrate 110, and, a second planar substrate 112 bonded to the first planar substrate so as to form an interior chamber 115 housing the electronic device. The package includes a plurality of electrically conductive pins 120, each of the pins passing through a hole 125 in one of the first and second planar substrates. A first end 130 of each pin is located in the interior chamber and is electrically coupled to the electronic device. A second end 132 of each pin is located on an exterior side 135 of the one of the first and second substrates. An inorganic sealant 140 surrounds at least one of the first end or the second end for each of the pins.

摘要翻译： 一种包括电子装置封装102的装置。封装包括在第一平面基板110上的电子装置105，以及结合到第一平面基板的第二平面基板112，以便形成容纳电子装置的内部室115。 封装包括多个导电引脚120，每个引脚穿过第一和第二平面基板之一中的孔125。 每个销的第一端130位于内部室中并且电耦合到电子设备。 每个销的第二端132位于第一和第二基板之一的外侧135上。 无机密封剂140围绕每个销的第一端或第二端中的至少一个。

公开(公告)号：US20050224975A1

公开(公告)日：2005-10-13

申请号：US10816527

申请日：2004-04-01

申请人： Nagesh Basavanhally ,  Raymond Cirelli ,  Omar Lopez

发明人： Nagesh Basavanhally ,  Raymond Cirelli ,  Omar Lopez

IPC分类号： B82B1/00 ,  B81B7/00 ,  B82B3/00 ,  H01L21/60 ,  H01L21/768 ,  H01L23/373 ,  H01L23/485 ,  H01L23/49 ,  H01L29/788

CPC分类号： H01L24/12 ,  B81B7/0006 ,  B82Y10/00 ,  H01L24/16 ,  H01L24/90 ,  H01L2224/13078 ,  H01L2224/13099 ,  H01L2224/1319 ,  H01L2224/16105 ,  H01L2224/81193 ,  H01L2224/81194 ,  H01L2224/81345 ,  H01L2224/81385 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01055 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/1461 ,  H01L2924/19043 ,  H01L2924/00

摘要： A method and apparatus for forming an electrically and/or thermally conducting interconnection is disclosed wherein a first surface and a second surface are contacted with each other via a plurality of nanostructures disposed on at least one of the surfaces. In one embodiment, a first plurality of areas of nanostructures is disposed on a component in an electronics package such as, illustratively, a microprocessor. The first plurality of areas is then brought into contact with a corresponding second plurality of areas of nanostructures on a substrate, thus creating a strong friction bond. In another illustrative embodiment, a plurality of nanostructures is disposed on a component, such as a microprocessor, which is then brought into contact with a substrate. Intermolecular forces result in an attraction between the molecules of the nanostructures and the molecules of the substrate, thus creating a bond between the nanostructures and the substrate.

摘要翻译： 公开了一种用于形成电和/或导热互连的方法和装置，其中通过设置在至少一个表面上的多个纳米结构使第一表面和第二表面彼此接触。 在一个实施例中，纳米结构的第一多个区域被布置在例如微处理器的电子封装中的部件上。 然后使第一多个区域与衬底上相应的第二多个纳米结构区域接触，从而产生强烈的摩擦接合。 在另一示例性实施例中，多个纳米结构设置在诸如微处理器的部件上，然后与基底接触。 分子间力导致纳米结构的分子和基底的分子之间的吸引力，从而在纳米结构和基底之间形成结合。

公开(公告)号：US20070079922A1

公开(公告)日：2007-04-12

申请号：US11245761

申请日：2005-10-07

申请人： Nagesh Basavanhally ,  Dan Marom

发明人： Nagesh Basavanhally ,  Dan Marom

IPC分类号： B32B37/00

CPC分类号： G02B3/0056 ,  G02B3/0006 ,  G02B3/14 ,  G02B26/0825

摘要： The invention includes a method and apparatus for controlling curvatures of light directing devices. The apparatus includes a first substrate portion having formed therein a plurality of cavities, and a substantially flexible membrane disposed over the cavities for forming a respective plurality of light directing mechanisms, the light directing mechanisms disposed over the cavities. The respective curvatures of the light directing mechanisms are set using a pressure difference across each of the membrane portions disposed over the cavities. The respective curvatures of the light directing mechanisms may be controllably adjusted during operation of the light directing mechanisms.

摘要翻译： 本发明包括一种用于控制光导装置的曲率的方法和装置。 该装置包括在其中形成有多个空腔的第一基板部分和设置在空腔上的基本上柔性的膜，用于形成相应的多个光引导机构，所述光引导机构设置在空腔上方。 光引导机构的相应曲率是通过设置在空腔上的每个膜部分之间的压力差来设定的。 光导向机构的各自的曲率可以在光导引机构的操作期间被可控地调节。

公开(公告)号：US20070077002A1

公开(公告)日：2007-04-05

申请号：US11239940

申请日：2005-09-30

申请人： Nagesh Basavanhally ,  Dan Marom

发明人： Nagesh Basavanhally ,  Dan Marom

IPC分类号： G02B6/26

CPC分类号： G02B6/3546 ,  G02B6/3512 ,  G02B6/356

摘要： The invention includes an apparatus for receiving an optical signal from an optical input means and directing the optical signal to one of a plurality of optical outputs means. The apparatus includes a solid signal propagating material having a refractive index greater than the refractive index of air. The solid signal propagating material includes a first transparent surface optically cooperating with the optical input and output means, a second transparent surface optically cooperating with a first light directing mechanism, and a reflective surface optically cooperating with the first light directing mechanism. A first reflecting component of the light directing mechanism directs a received optical signal to a second reflecting component of the light directing mechanism via the reflective surface of the signal propagating material. The second reflecting component of the light directing mechanism directs the respective incident optical signal to the selected one of the plurality of optical outputs means.

摘要翻译： 本发明包括一种用于从光输入装置接收光信号并将光信号引导到多个光输出装置之一的装置。 该装置包括具有大于空气折射率的折射率的固体信号传播材料。 固体信号传播材料包括与光学输入和输出装置光学协作的第一透明表面，与第一光引导机构光学协作的第二透明表面和与第一光引导机构光学协作的反射表面。 光引导机构的第一反射部件经由信号传播材料的反射表面将接收到的光信号引导到光引导机构的第二反射部件。 导光机构的第二反射部件将相应的入射光信号引导到多个光输出装置中的所选择的一个。