- 专利标题： Interconnect including a pliable surface and use thereof
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申请号： US11312061申请日： 2005-12-20
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公开(公告)号： US20060097252A1公开(公告)日： 2006-05-11
- 发明人: Nagesh Basavanhally , Raymond Cirelli , Omar Lopez
- 申请人： Nagesh Basavanhally , Raymond Cirelli , Omar Lopez
- 申请人地址： US NJ Murray Hill
- 专利权人： Lucent Technologies Inc.
- 当前专利权人： Lucent Technologies Inc.
- 当前专利权人地址： US NJ Murray Hill
- 主分类号： H01L29/06
- IPC分类号： H01L29/06
摘要：
The present invention provides an interconnect. The interconnect comprises a pliable surface having a plurality of nanostructures disposed thereon, the pliable surface configured to allow the plurality of nanostructures to at least partially conform to a surface when the nanostructures come into contact therewith.
公开/授权文献
- US07560817B2 Interconnect including a pliable surface and use thereof 公开/授权日：2009-07-14
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