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109 条记录 (耗时 0.024 秒)

    HYBRID-INTEGRATED MULTI-CHIP MODULE
    93.
    发明申请
    HYBRID-INTEGRATED MULTI-CHIP MODULE 有权

    公开(公告)号：US20170199328A1

    公开(公告)日：2017-07-13

    申请号：US14994976

    申请日：2016-01-13

    申请人： Oracle International Corporation

    发明人： Ivan Shubin ,  Xuezhe Zheng ,  Jin Hyoung Lee ,  Ashok V. Krishnamoorthy

    IPC分类号： G02B6/122 ,  H01S5/022 ,  G02B6/42

    CPC分类号： G02B6/122 ,  G02B6/1228 ,  G02B6/4231 ,  G02B6/4274 ,  G02B6/428 ,  G02B2006/12121 ,  G02B2006/12147 ,  H01S5/0228

    摘要： A multi-chip module (MCM) is described. This MCM includes a driver integrated circuit that includes electrical circuits, a photonic chip, an interposer, and an optical gain chip. The photonic chip may be implemented using a silicon-on-insulator technology, and may include an optical waveguide that conveys an optical signal and traces that are electrically coupled to the driver integrated circuit. Moreover, the interposer may be electrically coupled to the traces. Furthermore, the optical gain chip may include a III/V compound semiconductor (and, more generally, a semiconductor other than silicon), and may include a second optical waveguide that conveys the optical signal and that is vertically aligned with the optical waveguide relative to a top surface of the interposer. Additionally, the optical gain chip may be electrically coupled to the interposer.

    Semiconductor laser assembly and packaging system
    96.
    发明授权
    Semiconductor laser assembly and packaging system 有权
    半导体激光器组装和封装系统

    公开(公告)号：US09537284B2

    公开(公告)日：2017-01-03

    申请号：US14325493

    申请日：2014-07-08

    申请人： SemiNex Corporation

    发明人： David M. Bean ,  John J. Callahan

    IPC分类号： H01L21/00 ,  H01S3/04 ,  H01S5/022 ,  H01S5/024 ,  H01S5/00 ,  H01S5/02

    CPC分类号： H01S5/02469 ,  H01L2224/49175 ,  H01S3/02 ,  H01S3/06704 ,  H01S5/005 ,  H01S5/02 ,  H01S5/02212 ,  H01S5/02268 ,  H01S5/02272 ,  H01S5/02276 ,  H01S5/0228 ,  H01S5/02288 ,  H01S5/02296 ,  Y10T29/49826

    摘要： A system for self-aligning assembly and packaging of semiconductor lasers allows reduction of time, cost and testing expenses for high power density systems. A laser package mounting system, such as a modified TO-can (transistor outline can), has modifications that increase heat transfer from the active laser to a heat exchanger or other heat sink. A prefabricated heat exchanger assembly mounts both a laser package and one or more lenses. Direct mounting of a fan assembly to the package further minimizes assembly steps. Components may be physically and optically aligned during assembly by clocking and other indexing means, so that the entire system is self-aligned and focused by the assembly process without requiring post-assembly adjustment. This system can lower costs and thereby enable the use of high powered semiconductor lasers in low cost, high volume production, such as consumer items.

    摘要翻译： 用于半自动对准组装和封装半导体激光器的系统允许减少高功率密度系统的时间，成本和测试费用。 诸如修改的TO-can（晶体管轮廓罐）的激光器封装安装系统具有增加从主动激光器到热交换器或其他散热器的热传递的修改。 预制热交换器组件安装激光器封装和一个或多个透镜。 将风扇组件直接安装到包装件上进一步最小化组装步骤。 组件可以通过计时和其它分度装置在组装期间被物理和光学对准，使得整个系统通过组装过程自对准和聚焦，而不需要后装配调整。 该系统可以降低成本，从而使得能够以低成本，大批量生产（例如消费品）使用高功率半导体激光器。

    INTEGRATED PARALLEL OPTICAL TRANSCEIVER
    97.
    发明申请
    INTEGRATED PARALLEL OPTICAL TRANSCEIVER 审中-公开
    集成平行光收发器

    公开(公告)号：US20160226591A1

    公开(公告)日：2016-08-04

    申请号：US14614052

    申请日：2015-02-04

    申请人： International Business Machines Corporation

    发明人： Amilcar Arvelo ,  Alan F. Benner ,  Michael J. Ellsworth ,  Eric J. McKeever ,  Thong N. Nguyen ,  Edward J. Seminaro

    IPC分类号： H04B10/40

    CPC分类号： H04B10/40 ,  G02B6/4246 ,  G02B6/425 ,  G02B6/4272 ,  G02B6/428 ,  G02B6/4286 ,  G02B6/4292 ,  G02B6/4295 ,  G02B6/4296 ,  G02B6/43 ,  H01S5/0228 ,  H01S5/02476 ,  H01S5/0261 ,  H01S5/423 ,  H04B10/503

    摘要： Aspects of the present invention include an optical transceiver for providing transmission and reception of optical signals. The optical transceiver includes a carrier having two opposing surfaces and one or more openings extending from a first of the two opposing surfaces to a second of the two opposing surfaces. The optical transceiver includes a laser driver chip coupled to the first surface. The optical transceiver includes a vertical cavity surface emitting laser (VCSEL) array chip coupled to the first surface. The optical transceiver includes a photodetector array chip coupled to the first surface. The optical transceiver includes a receiver amplifier chip coupled to the first surface. The optical transceiver includes an optical coupling element coupled to the second surface. The VCSEL array chip and the photodetector array chip are disposed such that optical signals can pass through the one or more openings in the carrier.

    摘要翻译： 本发明的方面包括用于提供光信号的发送和接收的光收发器。 光收发器包括具有两个相对表面的一个载体和从两个相对表面中的第一个延伸到两个相对表面中的第二个的一个或多个开口。 光收发器包括耦合到第一表面的激光驱动器芯片。 光收发器包括耦合到第一表面的垂直腔表面发射激光器（VCSEL）阵列芯片。 光收发器包括耦合到第一表面的光电检测器阵列芯片。 光收发器包括耦合到第一表面的接收放大器芯片。 光收发器包括耦合到第二表面的光耦合元件。 VCSEL阵列芯片和光检测器阵列芯片被布置成使得光信号可以穿过载体中的一个或多个开口。

    Laser to chip coupler
    98.
    发明授权
    Laser to chip coupler 有权
    激光到芯片耦合器

    公开(公告)号：US09316788B2

    公开(公告)日：2016-04-19

    申请号：US13879379

    申请日：2011-10-13

    申请人： Jeremy Witzens

    发明人： Jeremy Witzens

    IPC分类号： G02B6/125 ,  G02B6/28 ,  G02B6/30 ,  G02B6/42 ,  G02B6/13 ,  G02B6/12 ,  G02B6/34 ,  H01S5/022

    CPC分类号： G02B6/125 ,  G02B6/12007 ,  G02B6/13 ,  G02B6/2813 ,  G02B6/305 ,  G02B6/34 ,  G02B6/42 ,  G02B6/423 ,  H01S5/02252 ,  H01S5/0228 ,  Y10T29/49826

    摘要： A method and an apparatus for butt-coupling an input beam incoming from a photonic device of a second optical element to a primary photonic chip at an input interface of the primary photonic chip is disclosed. The primary photonic chip comprises a coupling apparatus. The light from the input beam is butt-coupled to the coupling apparatus. The coupling apparatus comprises a plurality of more than one single mode optical paths on the primary photonic chip. The single mode optical paths are strongly coupled to each other at the input interface of the primary photonic chip. Regions of strongly coupled single mode optical paths can correspond to one or both of distinct but highly coupled waveguides or waveguides fully merged into a multi-mode section.

    摘要翻译： 公开了一种用于将从第二光学元件的光子器件进入的输入光束对接到主光子芯片的输入接口处的主光子芯片的方法和装置。 主光子芯片包括耦合装置。 来自输入光束的光被对接耦合到耦合装置。 耦合装置在主光子芯片上包括多个多于一个的单模光路。 单模光路在主光子芯片的输入接口处彼此强耦合。 强耦合单模光路的区域可以对应于完全合并到多模式部分中的不同但高度耦合的波导或波导中的一个或两个。

    Laser light source device
    100.
    发明授权
    Laser light source device 有权
    激光光源装置

    公开(公告)号：US09182103B2

    公开(公告)日：2015-11-10

    申请号：US13680424

    申请日：2012-11-19

    申请人： STANLEY ELECTRIC CO., LTD.

    发明人： Teruo Koike ,  Ji-Hao Liang

    IPC分类号： F21V9/00 ,  H01S3/00 ,  B60Q1/00 ,  F21V13/04 ,  H01S5/00 ,  H01S5/022

    CPC分类号： F21V13/04 ,  H01S5/0092 ,  H01S5/02212 ,  H01S5/0228 ,  H01S5/02288

    摘要： In an exemplary embodiment, a laser light source device includes a laser light source that emits laser light from a laser emission aperture. The laser light source device also includes a condenser lens disposed in front of the laser light source in a laser emission direction to collect the laser light. The laser light source device also includes a fluorescent member disposed in front of the condenser lens in the laser emission direction to receive the laser light collected by the condenser lens and to emit light of a different wavelength from that of the laser light. The laser light source device also includes a light guide that forms a light path of laser light from the laser light source to the condenser lens.

    摘要翻译： 在示例性实施例中，激光源装置包括从激光发射孔发射激光的激光光源。 激光光源装置还包括在激光发射方向上设置在激光光源前方的聚光透镜以收集激光。 激光光源装置还包括在激光发射方向上设置在聚光透镜前方的荧光部件，以接收由聚光透镜收集的激光，并发射与激光不同的波长的光。 激光光源装置还包括形成从激光光源到聚光透镜的激光的光路的光导。