SIGNAL DISTRIBUTION IN INTEGRATED CIRCUIT USING OPTICAL THROUGH SILICON VIA
    10.
    发明申请
    SIGNAL DISTRIBUTION IN INTEGRATED CIRCUIT USING OPTICAL THROUGH SILICON VIA 有权
    使用光学的集成电路中的信号分配通过硅

    公开(公告)号:US20160118528A1

    公开(公告)日:2016-04-28

    申请号:US14524569

    申请日:2014-10-27

    IPC分类号: H01L31/167 H01L31/0232

    摘要: An optical through silicon via is formed in a silicon substrate of an integrated circuit. A photo detector is formed within the integrated circuit and is optically coupled to a first side of the optical through silicon via. A light generating source optically coupled to a second side of the optical through silicon via is provided. The photo detector is configured to receive a light, generated by the light generating source, propagating through the optical through silicon via. The light, generated by the light generating source, is controlled by a signal generated by a signal generating source.

    摘要翻译: 在集成电路的硅衬底中形成光通孔硅。 光电检测器形成在集成电路内,并且光学耦合到光通过硅通孔的第一侧。 提供光学耦合到光通过硅通孔的第二侧的发光源。 光检测器被配置为接收由光产生源产生的光,通过光通过硅通孔传播。 由光产生源产生的光由信号发生源产生的信号控制。