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公开(公告)号：US20190103723A1
公开(公告)日：2019-04-04
申请号：US16141542
申请日：2018-09-25
申请人： NICHIA CORPORATION
发明人： Soichiro MIURA , Kazuma KOZURU
CPC分类号： H01S5/4081 , H01S5/0071 , H01S5/02216 , H01S5/0222 , H01S5/02252 , H01S5/0228 , H01S5/02288 , H01S5/02292 , H01S5/02296 , H01S5/02469 , H01S5/32308 , H01S5/32325 , H01S5/32341 , H01S5/40 , H01S5/4012 , H01S5/4025 , H01S5/4031 , H01S5/4087 , H01S5/4093
摘要： A light emitting device includes first and second semiconductor laser elements and a collimate lens. The first semiconductor laser element irradiates a first light having a first peak wavelength in a visible range. The second semiconductor laser element, irradiates a second light having a second peak wavelength in the visible range, which is different from the first peak wavelength. The collimate lens is arranged on paths of the first and second lights. The collimate lens has a plurality of lens portions including a first lens portion through which the first light passes, and a second lens portion through which the second light passes. The second lens portion is connected to the first lens portion, and the first and second lens portions are different from each other in at least one of a shape of a light incident surface, a shape of a light extracting surface, and a height.
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公开(公告)号：US20180269649A1
公开(公告)日：2018-09-20
申请号：US15979694
申请日：2018-05-15
申请人： Vixar Inc.
发明人： William Hogan , Mary Brenner
CPC分类号： H01S5/0228 , H01L33/483 , H01L2224/48091 , H01S5/0042 , H01S5/005 , H01S5/02208 , H01S5/02236 , H01S5/02252 , H01S5/02272 , H01S5/02296 , H01S5/183 , H01S5/423 , Y10T156/10 , Y10T156/1052 , H01L2924/00014
摘要： An optical package having a patterned submount, an optoelectronic device mounted to the patterned submount, a spacer affixed on one side to the patterned submount, the spacer having a bore hole therethrough wherein the optoelectronic device is positioned, and an optical element affixed to the spacer on a side opposite the patterned submount and covering the spacer bore hole. The patterned submount may be a circuit board. The optoelectronic device may be a VCSEL. The spacer may be affixed to the circuit board, for example, using an epoxy preform or an adhesive laminate. The spacer may, for example, be manufactured from a sheet of stainless steel or from a circuit board. The optical element may be, for example, a diffuser, a concave lens, a convex lens, a holographic element, polarizers, or diffraction gratings. The optical element may be affixed to the spacer using an epoxy preform or an adhesive laminate.
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公开(公告)号：US20180152002A1
公开(公告)日：2018-05-31
申请号：US15578237
申请日：2016-05-25
发明人： Jens Ebbecke
CPC分类号： H01S5/1075 , H01S5/0217 , H01S5/0224 , H01S5/0228 , H01S5/3054 , H01S5/343
摘要： A semiconductor laser diode and a method for manufacturing a semiconductor laser diode are disclosed. In an embodiment, the semiconductor laser diode includes a semiconductor layer sequence having an active zone, wherein the semiconductor layer sequence has a cylindrical shape, wherein a cylinder axis of the semiconductor layer sequence is perpendicular to a layer plane of the semiconductor layer sequence, and wherein the semiconductor laser diode is configured to emit radiation perpendicularly to the cylinder axis of the semiconductor layer sequence.
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公开(公告)号：US20180011248A1
公开(公告)日：2018-01-11
申请号：US15633799
申请日：2017-06-27
发明人： Ido Bourstein , Sylvie Rockman
CPC分类号： G02B6/122 , G02B6/428 , G02B2006/12061 , H01S5/0224 , H01S5/02252 , H01S5/02272 , H01S5/0228 , H01S5/02469 , H01S5/0425 , H01S5/4025
摘要： An optoelectronic device includes an optoelectronic die, a laser die, and electrical interconnects. The optoelectronic device has a surface. A trench having first and second walls and a floor is formed in the surface, and an electrically conductive layer extends from the floor, via the first wall, to the surface. The laser die includes first and second electrodes and a laser output aperture. The laser die is mounted in the trench and is configured to emit a laser beam. The first electrode is coupled to the electrically conductive layer and the laser output aperture is mechanically aligned with a waveguide that extends from the second wall. The interconnects are formed on the second electrode of the laser die and on selected locations on the surface of the optoelectronic die. The interconnects are coupled to a substrate, and are configured to conduct electrical signals between the optoelectronic die and the substrate.
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公开(公告)号：US20180006427A1
公开(公告)日：2018-01-04
申请号：US15636869
申请日：2017-06-29
CPC分类号： H01S5/021 , H01S5/02252 , H01S5/02256 , H01S5/0228 , H01S5/02469 , H01S5/02476 , H01S5/026 , H01S5/042 , H01S5/183 , H01S5/3013 , H01S5/50
摘要： A semiconductor laser source includes a structured layer formed on a substrate made of silicon and having an upper face. The structured layer includes a passive optical component chosen from the group composed of an optical reflector and a waveguide. The component is encapsulated in silica or produced on a silica layer. At least one pad extends from a lower face of the structured layer, making direct contact with the substrate made of silicon, to an upper face flush with the upper face of the structured layer. The pad is produced entirely from silicon nitride, in order to form a thermal bridge through the structured layer. An optical amplifier is bonded directly above the passive optical component and partially to the upper face of the pad in order to dissipate the heat that it generates to the substrate made of silicon.
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公开(公告)号：US20180003362A1
公开(公告)日：2018-01-04
申请号：US15635609
申请日：2017-06-28
申请人： NICHIA CORPORATION
发明人： Tadaaki MIYATA
CPC分类号： F21V7/22 , F21V23/001 , F21Y2115/30 , G02B6/00 , H01S5/005 , H01S5/02216 , H01S5/02228 , H01S5/02276 , H01S5/0228 , H01S2301/176
摘要： A light source device includes a substrate having a principal surface, a light-transmitting member arranged over the principal surface of the substrate, and a laser light source arranged on the principal surface of the substrate at a portion in the bottom recess. The light-transmitting member has a lower surface that faces the principal surface of the substrate, an upper surface opposite to the lower surface, and a bottom recess opening downward. The laser light source is arranged on the principal surface of the substrate so that an optical axis of a laser beam emitted from the laser light source is substantially parallel to the principal surface of the substrate. At least a portion of the upper surface of the light-transmitting member is covered with an upper light reflection coat. At least a portion of the lower surface of the light-transmitting member is covered with a lower light reflection coat.
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公开(公告)号：US20170310082A1
公开(公告)日：2017-10-26
申请号：US15625396
申请日：2017-06-16
发明人： Meiyong Yu , Wei Xu , Song Yang
CPC分类号： H01S5/0608 , G02B6/3895 , G02B6/42 , G02B2006/4297 , H01S5/02248 , H01S5/02252 , H01S5/0228 , H01S5/02284 , H01S5/042 , H01S5/06825 , H04B10/504
摘要： An optical module for preventing laser beam leakage and a control method thereof are disclosed. The optical module including a current control circuit, a first transistor, a laser, and a laser control unit. The laser control unit is configured to: if it is detected that an optical fiber is inserted in the optical fiber interface, perform control to turn on the laser, or if it is detected that no optical fiber is inserted in the optical fiber interface, control the laser to remain in an off state. A laser beam is effectively prevented from causing human bodily injury when an optical fiber is not inserted in an optical fiber interface.
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公开(公告)号：US20170222400A1
公开(公告)日：2017-08-03
申请号：US15450400
申请日：2017-03-06
发明人： Geoff W. TAYLOR
IPC分类号： H01S5/10 , G02B6/134 , G02B6/13 , H01S5/042 , H01S5/062 , H01L31/18 , H01S5/30 , H01L31/0352 , H01L31/0304 , H01L31/112 , H01L31/11 , H01L31/0232 , G02B6/293 , H01S5/20
CPC分类号： H01S5/1071 , G02B6/131 , G02B6/1347 , G02B6/29338 , H01L21/8252 , H01L27/0605 , H01L27/085 , H01L27/1443 , H01L29/083 , H01L29/1066 , H01L29/15 , H01L29/36 , H01L29/66401 , H01L29/74 , H01L29/7783 , H01L31/02327 , H01L31/03046 , H01L31/035209 , H01L31/035236 , H01L31/1105 , H01L31/1113 , H01L31/1129 , H01L31/1844 , H01L33/06 , H01L33/105 , H01S5/0228 , H01S5/0421 , H01S5/0424 , H01S5/0425 , H01S5/06203 , H01S5/06226 , H01S5/0625 , H01S5/1028 , H01S5/1032 , H01S5/1042 , H01S5/1075 , H01S5/125 , H01S5/183 , H01S5/187 , H01S5/2027 , H01S5/2063 , H01S5/2086 , H01S5/222 , H01S5/3054 , H01S5/309 , H01S5/34313
摘要： A semiconductor device includes an n-type ohmic contact layer, cathode and anode electrodes, p-type and n-type modulation doped quantum well (QW) structures, and first and second ion implant regions. The anode electrode is formed on the first ion implant region that contacts the p-type modulation doped QW structure and the cathode electrode is formed by patterning the first and second ion implant regions and the n-type ohmic contact layer. The semiconductor device is configured to operate as at least one of a diode laser and a diode detector. As the diode laser, the semiconductor device emits photons. As the diode detector, the semiconductor device receives an input optical light and generates a photocurrent.
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公开(公告)号：US09647762B2
公开(公告)日：2017-05-09
申请号：US14844661
申请日：2015-09-03
发明人： Amilcar Arvelo , Alan F. Benner , Michael J. Ellsworth , Eric J. McKeever , Thong N. Nguyen , Edward J. Seminaro
IPC分类号： H04B10/00 , H04B10/40 , G02B6/42 , H01S5/022 , H01S5/024 , H01S5/026 , H01S5/42 , H04B10/50 , G02B6/43
CPC分类号： H04B10/40 , G02B6/4246 , G02B6/425 , G02B6/4272 , G02B6/428 , G02B6/4286 , G02B6/4292 , G02B6/4295 , G02B6/4296 , G02B6/43 , H01S5/0228 , H01S5/02476 , H01S5/0261 , H01S5/423 , H04B10/503
摘要： Aspects of the present invention include an optical transceiver for providing transmission and reception of optical signals. The optical transceiver includes a carrier having two opposing surfaces and one or more openings extending from a first of the two opposing surfaces to a second of the two opposing surfaces. The optical transceiver includes a laser driver chip coupled to the first surface. The optical transceiver includes a vertical cavity surface emitting laser (VCSEL) array chip coupled to the first surface. The optical transceiver includes a photodetector array chip coupled to the first surface. The optical transceiver includes a receiver amplifier chip coupled to the first surface. The optical transceiver includes an optical coupling element coupled to the second surface. The VCSEL array chip and the photodetector array chip are disposed such that optical signals can pass through the one or more openings in the carrier.
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公开(公告)号：US20160294155A1
公开(公告)日：2016-10-06
申请号：US14821453
申请日：2015-08-07
CPC分类号： H01S5/0228 , G02B6/12004 , G02B6/124 , G02B6/42 , G02B6/4208 , H01L2224/48091 , H01S5/021 , H01S5/026 , H01S5/0267 , H01S5/0268 , H01S5/18 , H01L2924/00014
摘要： An integrated circuit includes an optical source (such as a laser) with a lens, which is disposed on an isolator. This isolator is disposed on a semiconductor layer in a silicon-on-insulator (SOI) platform that includes an optical coupler and an optical waveguide. During operation, the optical source generates an optical signal that propagates toward the isolator so that the lens focuses the optical signal. Furthermore, the isolator reduces or eliminates back reflection of the optical signal toward the optical source, and the optical coupler couples the optical signal into the optical waveguide.
摘要翻译： 集成电路包括设置在隔离器上的具有透镜的光源（例如激光器）。 该隔离器设置在包括光耦合器和光波导的绝缘体上硅（SOI）平台中的半导体层上。 在操作期间，光源产生朝向隔离器传播的光信号，使得透镜对光信号进行聚焦。 此外，隔离器减小或消除光信号朝向光源的反射，并且光耦合器将光信号耦合到光波导中。
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