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公开(公告)号:US11967801B2
公开(公告)日:2024-04-23
申请号:US17048498
申请日:2019-03-28
申请人: NanoPro AB
发明人: Ahmad Abedin , Mikael Östling
CPC分类号: H01S5/3027 , H01S5/2086 , H01S5/3223
摘要: A structure having first and second layers is disposed on a substrate. The second layer is disposed on the first layer, is compressively strained, and comprises the alloy including germanium and tin. The structure comprises first and second members spaced a distance from each other along a direction, a strip located between the first and second members and extending along an axis intersecting the direction, and arms connecting the first and second members to a first end of the strip. The first and second members, the strip and the arms comprise respective portions of the first and second layers. A portion of the first layer at the strip and arms is removed such that the strip and arms become suspended and the arms remain anchored to the first layer via the first and second members. Tensile strain is induced in the alloy via the arms. The alloy may perform lasing.
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公开(公告)号:US20230216278A1
公开(公告)日:2023-07-06
申请号:US17569055
申请日:2022-01-05
申请人: Modulight Oy
发明人: Riina Ulkuniemi , Ville Vilokkinen , Petri Melanen
CPC分类号: H01S5/2272 , H01S5/2224 , H01S5/2275 , H01S5/2086
摘要: A method for fabricating a semiconductor device on a semiconductor substrate, wherein the semiconductor device is adapted to provide target lasing properties, the method includes creating, a mask layer over the semiconductor substrate, the mask layer having at least one opening to expose a region of the semiconductor substrate, etching using a first etching process the exposed region, utilizing inductively coupled plasma with preselected first set of parameters to obtain a baseline mesa profile, the baseline mesa profile having a baseline mesa angle, re-etching using a second etching process the etched region, utilizing inductively coupled plasma with preselected second set of parameters, to alter the baseline mesa profile to obtain a requisite mesa profile having a requisite mesa angle defined by the target lasing properties and the requisite mesa angle being different from the baseline mesa angle, removing the mask layer and defining a p-n junction for the semiconductor substrate.
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3.
公开(公告)号:US20190221710A1
公开(公告)日:2019-07-18
申请号:US16241431
申请日:2019-01-07
IPC分类号: H01L33/14 , H01S5/187 , H01L33/00 , H01L33/10 , H01L33/58 , H01S5/183 , H01S5/00 , H01S5/20 , H01S3/00 , H01S5/343 , H01S5/042
CPC分类号: H01L33/145 , H01L33/0075 , H01L33/0095 , H01L33/105 , H01L33/58 , H01S3/005 , H01S5/00 , H01S5/021 , H01S5/0422 , H01S5/0425 , H01S5/183 , H01S5/18308 , H01S5/18341 , H01S5/187 , H01S5/2068 , H01S5/2086 , H01S5/34333
摘要: There is herein described a process for providing improved device performance and fabrication techniques for semiconductors. More particularly, the present invention relates to a process for forming features, such as pixels, on GaN semiconductors using a p-GaN modification and annealing process. The process also relates to a plasma and thermal anneal process which results in a p-GaN modified layer where the annealing simultaneously enables the formation of conductive p-GaN and modified p-GaN regions that behave in an n-like manner and block vertical current flow. The process also extends to Resonant-Cavity Light Emitting Diodes (RCLEDs), pixels with a variety of sizes and electrically insulating planar layer for electrical tracks and bond pads.
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4.
公开(公告)号:US20180034243A1
公开(公告)日:2018-02-01
申请号:US15728922
申请日:2017-10-10
CPC分类号: H01S5/4018 , H01L2224/24 , H01L2224/24137 , H01L2224/32225 , H01L2224/73267 , H01L2224/82 , H01L2224/92244 , H01S5/0216 , H01S5/02276 , H01S5/026 , H01S5/028 , H01S5/0422 , H01S5/0425 , H01S5/2086 , H01S5/4031 , H01S2301/176
摘要: A monolithic diode laser arrangement contains a plurality of individual emitters which are arranged adjacent to one another on a common supporting substrate and which in each case have contact windows for electrical contact which are arranged on the respective individual emitters on a front face opposite the supporting substrate. A method for producing such a diode laser arrangement and a laser device having such a diode laser arrangement are further described.
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5.
公开(公告)号:US20170324217A1
公开(公告)日:2017-11-09
申请号:US15513376
申请日:2015-09-25
申请人: THALES
发明人: Mathieu CARRAS , Grégory MAISONS , Bouzid SIMOZRAG
CPC分类号: H01S5/1231 , G02B5/1866 , G02B6/122 , H01S5/0425 , H01S5/2086 , H01S5/2202 , H01S5/2214 , H01S5/2216 , H01S5/2275 , H01S5/2277 , H01S5/3013 , H01S5/3402 , H01S2301/176
摘要: A reproducible method for producing a resonant structure of a distributed-feedback semiconductor laser exhibiting a narrow waveguide of the order of some ten micrometers, the production of the diffraction grating being carried out subsequent to the step of producing the strip is provided. In a last step, a diffraction grating is engraved as a function of a desired precise wavelength.
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公开(公告)号:US20170222400A1
公开(公告)日:2017-08-03
申请号:US15450400
申请日:2017-03-06
发明人: Geoff W. TAYLOR
IPC分类号: H01S5/10 , G02B6/134 , G02B6/13 , H01S5/042 , H01S5/062 , H01L31/18 , H01S5/30 , H01L31/0352 , H01L31/0304 , H01L31/112 , H01L31/11 , H01L31/0232 , G02B6/293 , H01S5/20
CPC分类号: H01S5/1071 , G02B6/131 , G02B6/1347 , G02B6/29338 , H01L21/8252 , H01L27/0605 , H01L27/085 , H01L27/1443 , H01L29/083 , H01L29/1066 , H01L29/15 , H01L29/36 , H01L29/66401 , H01L29/74 , H01L29/7783 , H01L31/02327 , H01L31/03046 , H01L31/035209 , H01L31/035236 , H01L31/1105 , H01L31/1113 , H01L31/1129 , H01L31/1844 , H01L33/06 , H01L33/105 , H01S5/0228 , H01S5/0421 , H01S5/0424 , H01S5/0425 , H01S5/06203 , H01S5/06226 , H01S5/0625 , H01S5/1028 , H01S5/1032 , H01S5/1042 , H01S5/1075 , H01S5/125 , H01S5/183 , H01S5/187 , H01S5/2027 , H01S5/2063 , H01S5/2086 , H01S5/222 , H01S5/3054 , H01S5/309 , H01S5/34313
摘要: A semiconductor device includes an n-type ohmic contact layer, cathode and anode electrodes, p-type and n-type modulation doped quantum well (QW) structures, and first and second ion implant regions. The anode electrode is formed on the first ion implant region that contacts the p-type modulation doped QW structure and the cathode electrode is formed by patterning the first and second ion implant regions and the n-type ohmic contact layer. The semiconductor device is configured to operate as at least one of a diode laser and a diode detector. As the diode laser, the semiconductor device emits photons. As the diode detector, the semiconductor device receives an input optical light and generates a photocurrent.
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公开(公告)号:US20170040771A1
公开(公告)日:2017-02-09
申请号:US15216834
申请日:2016-07-22
申请人: Ryoichiro SUZUKI
发明人: Ryoichiro SUZUKI
CPC分类号: H01S5/068 , H01S5/0042 , H01S5/183 , H01S5/18313 , H01S5/18358 , H01S5/18361 , H01S5/18377 , H01S5/187 , H01S5/2086 , H01S5/34313 , H01S5/34386 , H01S2301/163 , H01S2301/176 , H03L7/26
摘要: A surface emitting laser element includes a lower Bragg reflection mirror; an upper Bragg reflection mirror; and a resonator region formed between the lower Bragg reflection mirror and the upper Bragg reflection mirror, and including an active layer. A wavelength adjustment region is formed in the lower Bragg reflection mirror or the upper Bragg reflection mirror, and includes a second phase adjustment layer, a wavelength adjustment layer and a first phase adjustment layer, arranged in this order from a side where the resonator region is formed. An optical thickness of the wavelength adjustment region is approximately (2N+1)×λ/4, and the wavelength adjustment layer is formed at a position where an optical distance from an end of the wavelength adjustment region on the side of the resonator region is approximately M×λ/2, where λ is a wavelength of emitted light, M and N are positive integers, and M is N or less.
摘要翻译: 表面发射激光元件包括下布拉格反射镜; 上布拉格反射镜; 以及形成在下布拉格反射镜和上布拉格反射镜之间并且包括有源层的谐振器区域。 波长调整区域形成在下布拉格反射镜或上布拉格反射镜中,并且包括第二相位调整层,波长调整层和第一相位调整层,其从谐振器区域为 形成。 波长调整区域的光学厚度大致为(2N + 1)×λ/ 4,波长调整层形成在从谐振器区域侧的波长调整区域的端部的光学距离为 大约M×λ/ 2,其中λ是发射光的波长,M和N是正整数,M是N或更小。
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8.
公开(公告)号:US20160049770A1
公开(公告)日:2016-02-18
申请号:US14824933
申请日:2015-08-12
CPC分类号: H01S5/3402 , H01S5/0425 , H01S5/1003 , H01S5/1231 , H01S5/1237 , H01S5/125 , H01S5/187 , H01S5/2086 , H01S5/22 , H01S5/2205 , H01S5/3214 , H01S5/3401
摘要: Single-mode, distributed feedback interband cascade lasers (ICLs) using distributed-feedback gratings (e.g., lateral Bragg gratings) and methods of fabricating such ICLs are provided. The ICLs incorporate distributed-feedback gratings that are formed above the laser active region and adjacent the ridge waveguide (RWG) of the ICL. The ICLs may incorporate a double-ridge system comprising an optical confinement structure (e.g., a RWG) disposed above the laser active region that comprises the first ridge of the double ridge system, a DFB grating (e.g., lateral Bragg grating) disposed above the laser active region and adjacent the optical confinement structure, and an electric confinement structure that passes at least partially through the laser active region and that defines the boundary of the second ridge comprises and the termination of the DFB grating.
摘要翻译: 提供了使用分布式反馈光栅(例如横向布拉格光栅)的单模,分布式反馈带间级联激光器(ICL)和制造这种ICL的方法。 ICL包含形成在激光有源区域上方并与ICL的脊波导(RWG)相邻的分布式反馈光栅。 ICL可以包括双脊系统,该双脊系统包括设置在激光有源区域之上的光限制结构(例如,RWG),其包括双脊系统的第一脊,DFB光栅(例如,横向布拉格光栅) 激光有源区并且邻近光限制结构,并且至少部分地穿过激光有源区并且限定第二脊的边界的电限制结构包括DFB光栅的终止和终止。
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公开(公告)号:US09231361B2
公开(公告)日:2016-01-05
申请号:US14266248
申请日:2014-04-30
发明人: Hongmin Chen , Xuejin Yan , Rongsheng Miao , Xiao Shen , Zongrong Liu
IPC分类号: H01L21/00 , H01S3/042 , H01L21/311 , H01S5/026 , H01S5/042 , H01S5/06 , H01S5/0625 , H01S5/125 , H01S5/50 , G02B6/12
CPC分类号: H01S5/0612 , G02B2006/12176 , H01L21/311 , H01S3/042 , H01S5/02453 , H01S5/02461 , H01S5/0261 , H01S5/0425 , H01S5/06256 , H01S5/125 , H01S5/2086 , H01S5/209 , H01S5/2275 , H01S5/5045
摘要: A monolithically integrated thermal tunable laser comprising a layered substrate comprising an upper surface and a lower surface, and a thermal tuning assembly comprising a heating element positioned on the upper surface, a waveguide layer positioned between the upper surface and the lower surface, and a thermal insulation layer positioned between the waveguide layer and the lower surface, wherein the thermal insulation layer is at least partially etched out of an Indium Phosphide (InP) sacrificial layer, and wherein the thermal insulation layer is positioned between Indium Gallium Arsenide (InGaAs) etch stop layers.
摘要翻译: 一种单片集成的热可调激光器,包括包括上表面和下表面的分层衬底,以及包括位于上表面上的加热元件的热调节组件,位于上表面和下表面之间的波导层,以及热 绝缘层位于所述波导层和所述下表面之间,其中所述绝热层至少部分地从磷化铟(InP)牺牲层蚀刻出去,并且其中所述绝热层位于砷化镓(InGaAs)蚀刻停止点之间 层。
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10.
公开(公告)号:US09025633B2
公开(公告)日:2015-05-05
申请号:US13963620
申请日:2013-08-09
IPC分类号: H01S5/00 , H01S5/20 , H01S5/22 , H01S5/042 , B82Y20/00 , H01S5/022 , H01S5/024 , H01S5/028 , H01S5/16 , H01S5/343 , H01S5/02
CPC分类号: H01S5/20 , B82Y20/00 , H01S5/0202 , H01S5/02284 , H01S5/02415 , H01S5/02438 , H01S5/02476 , H01S5/028 , H01S5/0425 , H01S5/16 , H01S5/2086 , H01S5/22 , H01S5/222 , H01S5/34313 , H01S2301/176
摘要: An optical device includes a ridge semiconductor laser element formed on a substrate, a first insulating film coating a lateral wall portion of a ridge structure of the ridge semiconductor laser element, and a second insulating film coating the ridge structure from above the first insulating film in an end portion region of the ridge structure. The second insulating film has a density lower than a density of the first insulating film.
摘要翻译: 光学装置包括形成在基板上的脊状半导体激光元件,涂覆脊状半导体激光元件的脊部结构的侧壁部的第一绝缘膜,以及从第一绝缘膜的上方涂覆脊状结构的第二绝缘膜 脊结构的端部区域。 第二绝缘膜的密度低于第一绝缘膜的密度。
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