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247 条记录 (耗时 0.02 秒)

    Optical module
    1.
    发明授权
    Optical module 有权

    公开(公告)号：US09910233B2

    公开(公告)日：2018-03-06

    申请号：US14943353

    申请日：2015-11-17

    申请人： Hitachi Metals, Ltd.

    发明人： Kenichi Tamura

    IPC分类号： G02B6/43 ,  G02B6/42

    CPC分类号： G02B6/43 ,  G02B6/4206 ,  G02B6/4214 ,  G02B6/4215 ,  G02B6/4249 ,  G02B6/4265

    摘要： An optical module is composed of a plurality of optical elements to emit or receive light rays having wavelengths different from each other, and a plurality of optical members arranged in correspondence with the plurality of optical elements respectively. The plurality of optical members each of which includes a mirror section to transmit a predetermined transmission band wavelength light ray while reflecting a predetermined reflection band wavelength light ray, and a lens section located opposite the corresponding optical element. The plurality of optical members are positioned and disposed in such a manner that the respective lens sections thereof collimate or converge the light rays to be emitted or received by the plurality of optical elements respectively, while the respective mirror sections thereof multiplex or demultiplex the light rays to be emitted or received by the plurality of optical elements respectively.

    Hermetic sealing of optical module
    4.
    发明授权
    Hermetic sealing of optical module 有权

    公开(公告)号：US09612409B2

    公开(公告)日：2017-04-04

    申请号：US10663242

    申请日：2003-09-15

    申请人： Marc A. Finot ,  Rickie C. Lake

    发明人： Marc A. Finot ,  Rickie C. Lake

    IPC分类号： G02B6/42

    CPC分类号： G02B6/4201 ,  G02B6/4248 ,  G02B6/4251 ,  G02B6/4265 ,  G02B6/4267 ,  G02B6/4271

    摘要： A hermetically sealable package may be formed from a top portion and a bottom portion mated along a seam at or near a plane of an optical fiber. A completed pill assembly may be positioned directly into the enclosure base without requiring the fiber to be threaded through the feed through or “snout”. The top potion may then be mated with the bottom portion to form the package. A glass solder ring may be placed coaxial with the fiber in the feed through. The seam may be sealed by laser welding and the glass solder ring reflowed by laser heating, for example, with a same laser as used to weld the seam or by resistive or induction heating.

    Method to produce optical module having multiple signal lanes and optical module
    6.
    发明授权
    Method to produce optical module having multiple signal lanes and optical module 有权
    具有多个信号通道和光学模块的光学模块的制造方法

    公开(公告)号：US09490900B2

    公开(公告)日：2016-11-08

    申请号：US14707468

    申请日：2015-05-08

    申请人： Sumitomo Electric Industries, Ltd.

    发明人： Tomoya Saeki ,  Munetaka Kurokawa

    IPC分类号： H04B10/50 ,  H04J14/02 ,  G02B6/42

    CPC分类号： H04B10/503 ,  G02B6/4206 ,  G02B6/4214 ,  G02B6/4215 ,  G02B6/4244 ,  G02B6/425 ,  G02B6/4257 ,  G02B6/4265 ,  H04J14/02 ,  Y10T29/49897

    摘要： A method to produce an optical module, which includes more than one signal lanes each providing a semiconductor laser diode (LD), a first lens, and a second lens, is disclosed. The method first places the first lens in a position at which the optical beam output from the LD becomes a collimated beam, then, slightly shifts so as to be apart from the LD to convert the optical beam into a concentrated beam. The second lens is first placed in a position at which the optical beam from the first lens becomes a collimated beam, then, shifted so as to be apart from the first lens such that the optical output get through the coupling fiber becomes within a preset range.

    摘要翻译： 公开了一种产生光学模块的方法，该光学模块包括多于一个提供半导体激光二极管（LD）的信号通道，第一透镜和第二透镜。 该方法首先将第一透镜放置在从LD输出的光束成为准直光束的位置，然后稍微偏移以与LD分离，以将光束转换成集中的光束。 首先将第二透镜放置在来自第一透镜的光束成为准直光束的位置，然后移位以离开第一透镜，使得光输出通过耦合光纤变成预设范围 。

    Optical module
    8.
    发明授权
    Optical module 有权
    光模块

    公开(公告)号：US09335495B2

    公开(公告)日：2016-05-10

    申请号：US14085866

    申请日：2013-11-21

    申请人： Mitsubishi Electric Corporation

    发明人： Tatsuo Hatta ,  Hiromitsu Itamoto

    IPC分类号： G02F1/035 ,  G02B6/42

    CPC分类号： G02B6/4208 ,  G02B6/4206 ,  G02B6/4249 ,  G02B6/4265 ,  G02B6/4286

    摘要： An optical modulator includes: laser diodes disposed in parallel with each other, each laser diode having a different lasing wavelength; optical waveguides disposed in parallel with each other with first ends facing the laser diodes; an optical isolator inserted between the laser diodes and the optical waveguides and attenuating return light reflected from the optical waveguides toward the laser diodes; a lens focusing light emitted from the laser diodes onto the optical waveguides through the optical isolator; an optical switch selecting one of the light beams exiting from the optical waveguides; and an optical modulator modulating the light beam selected by and output from the optical switch.

    摘要翻译： 光调制器包括：彼此平行设置的激光二极管，每个激光二极管具有不同的激光波长; 光波导彼此平行设置，第一端面对激光二极管; 插入在激光二极管和光波导之间的光隔离器，并且将从光波导反射的返回光衰减到激光二极管; 将从激光二极管发射的光聚焦到通过光隔离器的光波导上的透镜; 选择从光波导出射的光束中的一个的光学开关; 以及调制由光开关选择和输出的光束的光调制器。

    Light-receiving package for flat-plate mounting, and optical module
    9.
    发明授权
    Light-receiving package for flat-plate mounting, and optical module 有权
    用于平板安装的光接收封装和光模块

    公开(公告)号：US09182559B2

    公开(公告)日：2015-11-10

    申请号：US14370673

    申请日：2012-12-04

    申请人： NTT ELECTRONICS CORPORATION ,  NIPPON TELEGRAPH AND TELEPHONE CORPORATION

    发明人： Yuji Mitsuhashi ,  Toshiki Nishizawa ,  Ikuo Ogawa ,  Ryoichi Kasahara

    IPC分类号： G02B6/00 ,  G02B6/42 ,  G02B6/12 ,  G02B6/13 ,  H01L31/0203

    CPC分类号： G02B6/4295 ,  G02B6/12 ,  G02B6/13 ,  G02B6/4203 ,  G02B6/4265 ,  G02B6/4286 ,  G02B2006/12138 ,  H01L31/0203

    摘要： A light-receiving package for flat-plate mounting which can make monitor reception sensitivity of an optical signal constant without increasing the size of a module. The light-receiving package for flat-plate mounting is provided with a first subassembly in which a photo diode is fixed to a front surface of a retaining holder, a back surface of the retaining holder is a flat surface capable of moving parallel on a plane parallel to a light-receiving surface of the photo diode and a second subassembly which has a rectangular U-shaped concave holder for retaining the retaining holder, and a flat-plate base disposed on a substrate and in which a surface of the flat-plate base that is mounted on the substrate is a flat surface capable of moving parallel to a substrate surface, the rectangular U-shaped concave holder and the flat-plate base are fixed, at least one of surfaces of the concave holder having a rectangular U-shape being a flat surface is a flat surface capable of moving parallel to the back surface of the retaining holder.

    摘要翻译： 用于平板安装的光接收封装，其可以使光信号的监视器接收灵敏度恒定，而不增加模块的尺寸。 用于平板安装的光接收封装设置有第一子组件，其中光电二极管固定到保持器的前表面，保持器的后表面是能够在平面上平行移动的平坦表面 平行于光电二极管的光接收表面的第二子组件和具有用于保持保持架的矩形U形凹形支架的第二子组件，以及设置在基板上的平板底座，其中平板的表面 安装在基板上的基座是能够平行于基板表面移动的平坦表面，矩形U形凹形支架和平板基座固定，凹形支架的至少一个表面具有矩形U形凹槽， 作为平坦表面的形状是能够平行于保持夹的后表面移动的平面。

    PACKAGE FOR HOUSING SEMICONDUCTOR ELEMENT AND SEMICONDUCTOR DEVICE
    10.
    发明申请
    PACKAGE FOR HOUSING SEMICONDUCTOR ELEMENT AND SEMICONDUCTOR DEVICE 有权
    外壳半导体元件和半导体器件的封装

    公开(公告)号：US20150181728A1

    公开(公告)日：2015-06-25

    申请号：US14409324

    申请日：2013-06-24

    申请人： KYOCERA Corporation

    发明人： Nobuyuki Tanaka ,  Shigenori Takaya

    IPC分类号： H05K5/02 ,  H05K5/00

    CPC分类号： H05K5/02 ,  G02B6/4201 ,  G02B6/4265 ,  G02B6/4274 ,  H01L23/053 ,  H01L23/057 ,  H01L23/10 ,  H01L23/562 ,  H01L2924/0002 ,  H01S5/02216 ,  H05K5/0091 ,  H05K5/0095 ,  H05K5/0247 ,  H01L2924/00

    摘要： A package for housing a semiconductor element includes a base body including a bottom plate section and a frame-shaped side wall section; and an input/output terminal provided so as to pass through the side wall section, the input/output terminal having a plate section on which line conductors are formed, and a vertical wall section which is fixed to the plate section so as to continue to the side wall section and so that the line conductors are sandwiched between the plate section and the vertical wall section and both ends of the line conductors are exposed from the vertical wall section. The vertical wall section has a thick section in a center portion of a side surface of the vertical wall section in a direction along the side wall section, the thick section having thick wall thickness, a lower end of the thick section being fixed to the plate section.

    摘要翻译： 用于容纳半导体元件的封装包括：底体，其包括底板部和框状侧壁部; 以及设置成穿过侧壁部分的输入/输出端子，所述输入/输出端子具有其上形成有线导体的板部分，以及垂直壁部分，其固定到所述板部分，以便继续 侧壁部分，并且使线路导体夹在板部分和垂直壁部分之间，并且线路导体的两端从垂直壁部分露出。 垂直壁部分在垂直壁部分的侧面的沿着侧壁部分的方向的中心部分具有厚的部分，厚壁部分具有厚壁厚度，厚部分的下端固定到板材 部分。