公开(公告)号：US20240332908A1

公开(公告)日：2024-10-03

申请号：US18743489

申请日：2024-06-14

申请人： Lumentum Japan, Inc.

发明人： Atsushi NAKAMURA ,  Akira NAKANISHI ,  Shunya YAMAUCHI ,  Hayato TAKITA ,  Yoshihiro NAKAI ,  Hideaki ASAKURA

IPC分类号： H01S5/227 ,  G02B6/42 ,  H01S5/02345 ,  H01S5/0237 ,  H01S5/026 ,  H01S5/028 ,  H01S5/042 ,  H01S5/12 ,  H01S5/22 ,  H01S5/40 ,  H01S5/50

CPC分类号： H01S5/227 ,  H01S5/026 ,  H01S5/04256 ,  H01S5/12 ,  H01S5/4068 ,  H01S5/4075 ,  H01S5/4087 ,  H01S5/50 ,  G02B6/4281 ,  H01S5/02345 ,  H01S5/0237 ,  H01S5/0265 ,  H01S5/0287 ,  H01S5/0427 ,  H01S5/2224

摘要： An optical semiconductor device includes a semiconductor substrate; a plurality of mesa stripes, which are arranged side by side on the semiconductor substrate, and each of which includes an active layer and a diffraction grating, the diffraction grating extending up to a back end surface of each of the plurality of mesa stripes; a plurality of electrodes, each of which is electrically connected to an upper surface of a corresponding one of the plurality of mesa stripes, having a pad portion for wire bonding; a plurality of waveguides, each of which is optically connected to the active layer of a corresponding one of the plurality of mesa stripes; and a reflective film provided at back end surfaces of the plurality of mesa stripes, and wherein at least two mesa stripes, of the plurality of mesa stripes, are configured to be driven at the same time.

公开(公告)号：US20240319458A1

公开(公告)日：2024-09-26

申请号：US18736771

申请日：2024-06-07

申请人： CORNING INCORPORATED

发明人： Lars Martin Otfried Brusberg ,  Jin Su Kim ,  Aramais Robert Zakharian

IPC分类号： G02B6/42 ,  C03C3/04 ,  H05K1/02 ,  H05K1/03 ,  H05K3/00

CPC分类号： G02B6/4281 ,  C03C3/04 ,  H05K1/0274 ,  H05K1/0306 ,  H05K3/0011

摘要： Integrated circuit packages having electrical and optical connectivity and methods of making the same are disclosed herein. According to one embodiment, an integrated circuit package includes a glass substrate, an optical channel, and redistribution layers. The integrated circuit package further includes an integrated circuit chip positioned on the glass substrate and in optical communication with the optical channel and in electrical continuity with the redistribution layers.

公开(公告)号：US20240012214A1

公开(公告)日：2024-01-11

申请号：US18471352

申请日：2023-09-21

申请人： HUAWEI TECHNOLOGIES CO., LTD.

发明人： Libin DING ,  Hang YAN ,  Wenxue ZHU ,  Yang LIU ,  Xiang GUO ,  Wenliang LI

IPC分类号： G02B6/42

CPC分类号： G02B6/4278 ,  G02B6/4281

摘要： A service board includes a flexible board, at least one chip, and at least one optical cage layer. Each optical cage layer includes a plurality of optical cages. Each optical cage has an opening that faces a panel side and that is configured to connect to an optical module. The optical cage includes a housing and a plurality of signal pins. One end of the flexible board is electrically connected to tail ends of the plurality of signal pins, and another end of the flexible board is electrically connected to one chip, thereby shortening a connection path between the optical module and the chip, and reducing a link loss. Therefore, integration of the service board is improved, assembly is convenient, and a high-density connection and a simplified design of the service board are implemented, so that the service board is applicable to a high-density and high-speed transmission scenario.

公开(公告)号：US20230280548A1

公开(公告)日：2023-09-07

申请号：US18174969

申请日：2023-02-27

申请人： CommScope Technologies LLC ,  CommScope Asia Holdings B.V. ,  CommScope Connectivity Spain, S.L. ,  CommScope Connectivity UK Limited

发明人： David P. MURRAY ,  Ton BOLHAAR ,  Paul SCHNEIDER ,  Rafael MATEO ,  Luis COBACHO ,  Michael WENTWORTH ,  Steven J. BRANDT ,  Marcellus PJ BUIJS ,  Alexander DORRESTEIN ,  Jan Willem RIETVELD

IPC分类号： G02B6/38 ,  G02B6/44 ,  G02B6/36 ,  G02B6/42

CPC分类号： G02B6/3897 ,  G02B6/4453 ,  G02B6/4471 ,  G02B6/3608 ,  G02B6/3855 ,  G02B6/3869 ,  G02B6/387 ,  G02B6/4478 ,  G02B6/3821 ,  G02B6/3825 ,  G02B6/3877 ,  G02B6/3879 ,  G02B6/4281 ,  Y10T29/49954 ,  G02B6/40

摘要： A fiber optic cassette includes a body defining a front and an opposite rear. A cable entry location is defined on the body for a cable to enter the cassette, wherein a plurality of optical fibers from the cable extend into the cassette and form terminations at non-conventional connectors adjacent the front of the body. A flexible substrate is positioned between the cable entry location and the non-conventional connectors adjacent the front of the body, the flexible substrate rigidly supporting the plurality of optical fibers. Each of the non-conventional connectors adjacent the front of the body includes a ferrule, a ferrule hub supporting the ferrule, and a split sleeve surrounding the ferrule.

公开(公告)号：US20230245489A1

公开(公告)日：2023-08-03

申请号：US17884160

申请日：2022-08-09

申请人： MIYABI TECHNOLOGY CO., LTD.

发明人： HSIEN-MING LEE ,  TSUNG-YI LU

IPC分类号： G06V40/12 ,  G02B6/42

CPC分类号： G06V40/12 ,  G02B6/4281 ,  G02B6/42

摘要： A fingerprint identification module includes a light guiding member, a flexible circuit board, two light emitting members, and a fingerprint identification chip. The light guiding member includes a bottom and a protruding edge. The protruding edge surrounds to form a first space. A first through-hole is formed on the bottom. The flexible circuit board is disposed in the first space and has a first portion, a second portion, a third portion, and a fourth portion connected in sequence. The first portion goes out of the light guiding member through the first through-hole. The third portion faces a direction opposite to the bottom. The second portion and the fourth portion face the bottom of the light guiding member. The light emitting members are disposed on the flexible circuit board and face the light guiding member. The fingerprint identification chip is disposed on the third portion of the flexible circuit board.

公开(公告)号：US20190237934A1

公开(公告)日：2019-08-01

申请号：US16243107

申请日：2019-01-09

申请人： Oclaro Japan, Inc.

发明人： Koichiro ADACHI ,  Yasunobu MATSUOKA

IPC分类号： H01S5/042 ,  H01S5/12 ,  H01S5/026 ,  H04B10/50

CPC分类号： H01S5/042 ,  G02B6/4246 ,  G02B6/4281 ,  H01S5/02236 ,  H01S5/026 ,  H01S5/12 ,  H04B10/505 ,  H04B10/61

摘要： A modulator integrated laser has a laser portion for emitting light and a modulation portion for modulating the light by an electric field absorption effect. The modulator integrated laser has a semiconductor substrate of a conductivity type in which the laser portion and the modulation portion are integrated. An impedance element with inductance and capacitance connected in parallel. The impedance element has a self-resonant characteristic exhibiting the highest impedance at a self-resonant frequency. The laser portion has first and second electrodes for a direct current voltage to be applied therebetween. The modulation portion has third and fourth electrodes for an alternate current voltage to be applied therebetween. The second electrode and the fourth electrode are electrically connected to each other through the semiconductor substrate. The impedance element is connected in series to the first electrode to minimize a flow of an alternate current.

公开(公告)号：US20180287705A1

公开(公告)日：2018-10-04

申请号：US15475082

申请日：2017-03-30

申请人： Applied Optoelectronics, Inc.

发明人： Kai-Sheng LIN ,  Yi WANG ,  Kevin LIU

IPC分类号： H04B10/40 ,  H05K1/02 ,  H05K5/00 ,  H05K1/11 ,  G02B6/42

CPC分类号： H04B10/40 ,  G02B6/12004 ,  G02B6/12009 ,  G02B6/421 ,  G02B6/4246 ,  G02B6/4256 ,  G02B6/4262 ,  G02B6/4281 ,  H05K1/0218 ,  H05K1/028 ,  H05K1/118 ,  H05K1/189 ,  H05K2201/052 ,  H05K2201/09672 ,  H05K2201/10189

摘要： In accordance with an embodiment, a multi-layered flexible printed circuit (FPC) is disclosed that includes two or more insulating layers to route conductive traces carrying radio frequency (RF) signals, e.g., data signals, and conductive traces carrying direct current (DC) signals, e.g., power signals and low-frequency control signals, while sufficiently isolating the RF signals from electrical interference by the DC transmission lines. This advantageously eliminates having two or more separate FPCs to electrically couple each optical subassembly, e.g., receiver optical subassemblies (ROSAs) and transmitter optical subassemblies (TOSAs), to associated circuitry in a transceiver housing, which saves space and reduces manufacturing complexity, for example.

公开(公告)号：US20180284370A1

公开(公告)日：2018-10-04

申请号：US15473563

申请日：2017-03-29

申请人： Applied Optoelectronics, Inc.

发明人： I-Lung HO ,  Hsiu-Che WANG ,  Hao-Hsiang LIAO

IPC分类号： G02B6/42 ,  H04B10/40

CPC分类号： G02B6/4237 ,  G02B6/12009 ,  G02B6/4215 ,  G02B6/4225 ,  G02B6/423 ,  G02B6/4234 ,  G02B6/4245 ,  G02B6/4246 ,  G02B6/4256 ,  G02B6/4266 ,  G02B6/4281 ,  G02B6/4292

摘要： In accordance with an embodiment, a welding assembly is disclosed that allows for a laser assembly to be coupled into a socket of the same and held at a fixed position, e.g., by a mechanical grabber of a welding system. The mechanical grabber may then travel along one or more axis to bring the TOSA module into mechanical alignment with an opening of an associated optical subassembly housing. The welding assembly may further include an alignment member that provides one or more alignment contact surfaces configured to be brought directly into contact with a surface of the associated subassembly housing. When the one or more alignment contact surfaces are “flush” with the surface of the subassembly housing the emission face of the TOSA module is substantially parallel, and by extension, optically aligned with the opening of the associated subassembly housing.

公开(公告)号：US09995892B2

公开(公告)日：2018-06-12

申请号：US15611713

申请日：2017-06-01

申请人： Finisar Corporation

发明人： Xiaojie Xu

IPC分类号： G02B6/42 ,  G02B6/34 ,  G02B6/30 ,  G02B6/44 ,  G02B6/122 ,  G02B6/12 ,  G02B6/38 ,  H04B10/50 ,  H04B10/60 ,  H04B10/80

CPC分类号： G02B6/4246 ,  G02B6/12004 ,  G02B6/122 ,  G02B6/30 ,  G02B6/34 ,  G02B6/3893 ,  G02B6/4209 ,  G02B6/421 ,  G02B6/4214 ,  G02B6/423 ,  G02B6/4256 ,  G02B6/428 ,  G02B6/4281 ,  G02B6/4292 ,  G02B6/4403 ,  G02B2006/12061 ,  G02B2006/12102 ,  G02B2006/12114 ,  G02B2006/12121 ,  H04B10/50 ,  H04B10/60 ,  H04B10/801

摘要： An optical assembly may include a platform disposed within a housing that has a limited space. The platform may be tilted by a first angle to fit a fiber array into the limited space of the housing. The optical assembly may also include a silicon photonics device mounted on the tilted platform. The silicon photonics device may include a grating coupler. The optical assembly may also include the fiber array directly coupled to the grating coupler on the silicon photonics device at a coupling position that deviates from a vertical coupling position by a second angle.

公开(公告)号：US09923636B2

公开(公告)日：2018-03-20

申请号：US15403157

申请日：2017-01-10

申请人： Finisar Corporation

发明人： Andrei Kaikkonen ,  Lennart Lundquist ,  Lars-Goete Svensson ,  Robert Smith

IPC分类号： H04B10/40 ,  H05K1/02 ,  G02B6/42

CPC分类号： H04B10/40 ,  G02B6/4274 ,  G02B6/4279 ,  G02B6/4281 ,  H04B10/801 ,  H05K1/0213 ,  H05K1/0225 ,  H05K1/0245 ,  H05K1/0253 ,  H05K1/11 ,  H05K2201/10121

摘要： Disclosed embodiments relate to an interconnect structure for coupling at least one electronic unit for outputting and/or receiving electric signals, and at least one optical unit for converting said electric signals into optical signals and/or vice versa, to a further electronic component. The interconnect structure comprises an electrically insulating substrate and a plurality of signal lead pairs to be coupled between said electronic unit and a front end contact region for electrically contacting said interconnect structure by said further electronic component. A ground plane layer is electrically insulated from said pairs of signal leads, wherein each pair of signal leads has a circuit connecting region for electrically contacting respective terminals of said at least one electronic unit, and wherein in a region adjacent to said terminals of said at least one electronic unit said ground plane layer has a plurality of clearances that are each allocated to one pair of signal leads and separated from a respective neighboring clearance.