公开(公告)号：US20190196208A1

公开(公告)日：2019-06-27

申请号：US16216918

申请日：2018-12-11

申请人： North Inc.

发明人： Jörg Pierer ,  Rony Jose James ,  Stefan Mohrdiek ,  Douglas R. Dykaar

IPC分类号： G02B27/14 ,  G02B27/01 ,  G02B27/10 ,  G03B33/12 ,  H04N9/31

CPC分类号： G02B27/0172 ,  G02B6/12004 ,  G02B6/124 ,  G02B6/13 ,  G02B6/42 ,  G02B6/4214 ,  G02B27/0101 ,  G02B27/0176 ,  G02B27/1086 ,  G02B27/141 ,  G02B27/18 ,  G02B27/4205 ,  G02B2006/12107 ,  G02B2006/12147 ,  G02B2006/12164 ,  G02B2027/011 ,  G02B2027/0114 ,  G02B2027/0116 ,  G02B2027/0134 ,  G02B2027/014 ,  G02B2027/015 ,  G02B2027/0178 ,  G03B21/008 ,  G03B21/2033 ,  G03B21/2066 ,  G03B33/12 ,  H01S5/02208 ,  H01S5/02224 ,  H01S5/02248 ,  H01S5/0226 ,  H01S5/02272 ,  H01S5/02288 ,  H01S5/02292 ,  H01S5/02296 ,  H01S5/4012 ,  H01S5/4093 ,  H04N9/3129 ,  H04N9/3161

摘要： Systems, devices, and methods of manufacturing optical engines and laser projectors that are well-suited for use in wearable heads-up displays (WHUDs) are described. Generally, the optical engines of the present disclosure integrate a plurality of laser diodes (e.g., 3 laser diodes, 4 laser diodes) within a single, hermetically or partially hermetically sealed, encapsulated package. Photonic integrated circuits having grating couplers thereon may be used to wavelength multiplex beams of light emitted by the plurality of laser diodes into a coaxially superimposed aggregate beam. Such optical engines may have various advantages over existing designs including, for example, smaller volumes, better manufacturability, faster modulation speed, etc. WHUDs that employ such optical engines and laser projectors are also described.

公开(公告)号：US09899798B2

公开(公告)日：2018-02-20

申请号：US14816166

申请日：2015-08-03

申请人： University of Central Florida Research Foundation, Inc.

发明人： Zenghu Chang ,  Yi Wu ,  Eric Cunningham

IPC分类号： H01S3/16 ,  H01S3/04 ,  H01S5/10 ,  H01S3/02 ,  H01S5/022 ,  H01S3/042 ,  H01S3/06

CPC分类号： H01S5/1078 ,  H01S3/025 ,  H01S3/0405 ,  H01S3/042 ,  H01S3/0604 ,  H01S3/061 ,  H01S3/1625 ,  H01S3/1636 ,  H01S5/0226 ,  H01S2301/02

摘要： Apparatus and methods that enable the suppression of amplified spontaneous emission (ASE) and prevention against parasitic lasing in cryogenically-cooled laser amplifier systems, thus allowing sustainable extraction efficiency when increasing the pump power and suitable for large-scale, high average-power laser systems employing large-aperture gain media. A gain medium having a known index of refraction for operation in an evacuated, cryogenic environment includes an ASE-absorbing epoxy composition on the perimetrical edge of the gain medium, wherein the epoxy composition has an index of refraction that substantially matches the index of refraction of the gain medium.

公开(公告)号：US20180019568A1

公开(公告)日：2018-01-18

申请号：US15716085

申请日：2017-09-26

申请人： Sumitomo Electric Industries, Ltd.

发明人： Takashi Kyono ,  Hideyuki Ijiri ,  Takao Nakamura ,  Hiromi Nakanishi ,  Takatoshi Ikegami ,  Kuniaki Ishihara ,  Yohei Enya ,  Tetsuya Kumano

IPC分类号： H01S5/022 ,  H01S5/024 ,  G02B6/42 ,  H01S5/40

CPC分类号： H01S5/022 ,  G02B6/00 ,  G02B6/4239 ,  G02B6/4251 ,  G02B6/4265 ,  H01S5/005 ,  H01S5/0071 ,  H01S5/02216 ,  H01S5/0222 ,  H01S5/02252 ,  H01S5/0226 ,  H01S5/02292 ,  H01S5/02415 ,  H01S5/02438 ,  H01S5/02476 ,  H01S5/4012 ,  H01S5/4093

摘要： An optical module 1 according to an embodiment includes a plurality of laser diodes (LDs) 21 to 23, a multiplexing optical system 30 combining a plurality of laser beams from the respective plurality of LDs, and a package 10 accommodating the plurality of LDs and the multiplexing optical system. The package includes a support mounted with the multiplexing optical system, and a cap having a transmissive window that allows a resultant light beam to pass through. At least one of the LDs has an oscillation wavelength of nor more than 550 nm. The package has an internal moisture content of not more than 3000 ppm. The multiplexing optical system is fixed to the support by a resin curing adhesive.

公开(公告)号：US09806494B2

公开(公告)日：2017-10-31

申请号：US15354699

申请日：2016-11-17

申请人： Sumitomo Electric Industries, Ltd.

发明人： Takashi Kyono ,  Hideyuki Ijiri ,  Takao Nakamura ,  Hiromi Nakanishi ,  Takatoshi Ikegami ,  Kuniaki Ishihara ,  Yohei Enya ,  Tetsuya Kumano

IPC分类号： H01S5/00 ,  H01S5/022 ,  G02B6/42

CPC分类号： H01S5/022 ,  G02B6/00 ,  G02B6/4239 ,  G02B6/4251 ,  G02B6/4265 ,  H01S5/005 ,  H01S5/02212 ,  H01S5/02216 ,  H01S5/0222 ,  H01S5/02252 ,  H01S5/0226 ,  H01S5/0228 ,  H01S5/02288 ,  H01S5/02292 ,  H01S5/02415 ,  H01S5/4012 ,  H01S5/4093

摘要： An optical module 1 according to an embodiment includes a plurality of laser diodes (LDs) 21 to 23, a multiplexing optical system 30 combining a plurality of laser beams from the respective plurality of LDs, and a package 10 accommodating the plurality of LDs and the multiplexing optical system. The package includes a support mounted with the plurality of LDs and the multiplexing optical system, and a cap having a transmissive window that allows a resultant light beam to pass through. At least one of the LDs has an oscillation wavelength of nor more than 550 nm. The package has an internal moisture content of not more than 3000 ppm. The multiplexing optical system is fixed to the support by a resin curing adhesive.

公开(公告)号：US09477145B2

公开(公告)日：2016-10-25

申请号：US13623339

申请日：2012-09-20

申请人： CASIO COMPUTER CO., LTD.

发明人： Tomio Higo

IPC分类号： H01S5/022 ,  G03B21/20 ,  H01S5/02

CPC分类号： G03B21/204 ,  G03B21/2066 ,  G03B21/2093 ,  H01S5/02 ,  H01S5/02212 ,  H01S5/02256 ,  H01S5/0226 ,  H01S5/02276 ,  H01S5/02288 ,  Y10T29/4978

摘要： A light source device has a laser light emitting element including a cylinder portion, a flange portion and lead wire terminals, a collimator lens, a collimator lens holder including a collimator lens mounting depressed portion and a hole portion communicating with the depressed portion and accommodating the cylinder portion, and a light source element holder holding the laser light emitting element and including a lead wire outlet hole portion accommodating the lead wire terminals and penetrating from a front surface to a rear surface, and a front surface of the flange portion is fastened by the perimeter of a rear end of the hole portion to press the laser light emitting element against the front surface of the light source element holder to thereby fix the laser light emitting element to the light source element holder, an adhesion fixing member being filled in the lead wire outlet hole portion.

摘要翻译： 光源装置具有包括圆筒部，凸缘部和引线端子的激光发光元件，准直透镜，包括准直透镜安装凹部的准直透镜保持部和与凹部连通的孔部， 保持激光发光元件的光源元件保持器，并且包括容纳引线端子并从前表面延伸到后表面的引线出口孔部分，并且凸缘部分的前表面通过 所述孔部的后端的周边将所述激光发光元件按压在所述光源元件保持体的前表面，从而将所述激光发光元件固定在所述光源元件保持部上， 导线孔出口部。

公开(公告)号：US20160300592A1

公开(公告)日：2016-10-13

申请号：US14778538

申请日：2014-09-02

申请人： SHARP KABUSHIKI KAISHA

发明人： Toshiyuki KAWAKAMI ,  Akira ARIYOSHI

IPC分类号： G11B7/125 ,  H01S5/32 ,  H01S5/22 ,  H01S5/343 ,  G11B7/22 ,  H01S5/223

CPC分类号： G11B7/125 ,  G11B5/314 ,  G11B5/6088 ,  G11B7/22 ,  G11B2005/0021 ,  H01S5/0226 ,  H01S5/02284 ,  H01S5/0425 ,  H01S5/16 ,  H01S5/2004 ,  H01S5/209 ,  H01S5/2202 ,  H01S5/223 ,  H01S5/2231 ,  H01S5/3211 ,  H01S5/34313 ,  H01S2304/02 ,  H01S2304/04

摘要： In a semiconductor laser device including a semiconductor laser element that emits laser light from an emission region thereof, a cap having a peripheral wall and a ceiling wall that cover the semiconductor laser element and having a window portion formed in the ceiling wall to face the emission region, and a transparent optical member that fills the window portion, the optical member is formed by curing a liquid resin and holds the ceiling wall, and a light incidence surface of the optical member faces the emission region and is formed by natural flow of the liquid resin.

摘要翻译： 在包括从其发射区域发射激光的半导体激光元件的半导体激光器件中，具有覆盖半导体激光元件并且具有形成在顶壁中的窗口部分以面对发光的周壁和顶壁的盖 以及填充窗口部分的透明光学构件，光学构件通过固化液体树脂并保持顶壁而形成，并且光学构件的光入射表面面向发射区域并且由自然流动形成 液体树脂。

公开(公告)号：US20140112363A1

公开(公告)日：2014-04-24

申请号：US13659019

申请日：2012-10-24

申请人： Alfred Feitisch ,  Gabi Neubauer ,  Mathias Schrempel

发明人： Alfred Feitisch ,  Gabi Neubauer ,  Mathias Schrempel

IPC分类号： H01L33/62

CPC分类号： H01L24/83 ,  B23K20/023 ,  B23K20/24 ,  B23K2101/42 ,  H01L33/62 ,  H01L2224/73265 ,  H01L2224/83201 ,  H01L2224/8385 ,  H01L2924/12042 ,  H01S5/02212 ,  H01S5/02256 ,  H01S5/0226 ,  H01S5/02264 ,  H01S5/02476 ,  H01S5/0425

摘要： A first contact surface of a semiconductor laser chip can be formed to a first target surface roughness and a second contact surface of a carrier mounting can be formed to a second target surface roughness. A first bond preparation layer comprising a first metal can optionally be applied to the formed first contact surface, and a second bond preparation layer comprising a second metal can optionally be applied to the formed second contact surface. The first contact surface can be contacted with the second contact surface, and a solderless securing process can secure the semiconductor laser chip to the carrier mounting. Related systems, methods, articles of manufacture, and the like are also described.

摘要翻译： 可以将半导体激光器芯片的第一接触表面形成为第一目标表面粗糙度，并且可以将载体安装的第二接触表面形成为第二目标表面粗糙度。 包含第一金属的第一粘合制备层可以任选地施加到所形成的第一接触表面，并且包括第二金属的第二接合制备层可任选地施加到形成的第二接触表面。 第一接触表面可以与第二接触表面接触，并且无焊接固定工艺可以将半导体激光器芯片固定到载体安装。 还描述了相关系统，方法，制品等。

公开(公告)号：US07723829B2

公开(公告)日：2010-05-25

申请号：US12136519

申请日：2008-06-10

申请人： Yan-Kuin Su ,  Kuan-Chun Chen ,  Chun-Liang Lin ,  Jin-Quan Huang ,  Shu-Kai Hu

发明人： Yan-Kuin Su ,  Kuan-Chun Chen ,  Chun-Liang Lin ,  Jin-Quan Huang ,  Shu-Kai Hu

IPC分类号： H01L23/495

CPC分类号： H01L33/641 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/49107 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01S5/0226 ,  H01S5/02276 ,  H01S5/02469 ,  H01L2924/00014

摘要： An embedded metal heat sink for a semiconductor device is described. The embedded metal heat sink for a semiconductor device comprises a metal thin layer, a metal heat sink and two bonding pads. The metal thin layer including a first surface and a second surface on opposite sides, wherein at least one semiconductor device is embedded in the first surface of the metal thin layer, and the semiconductor device has two electrodes with different conductivity types. The metal heat sink is deposited on the second surface of the metal thin layer. The bonding pads are deposed on the first surface of the metal thin layer around the semiconductor device and are respectively corresponding to the electrodes, wherein the electrodes are electrically and respectively connected to the corresponding bonding pads by at least two wires, and the bonding pads are electrically connected to an outer circuit.

摘要翻译： 描述了一种用于半导体器件的嵌入式金属散热器。 用于半导体器件的嵌入式金属散热器包括金属薄层，金属散热器和两个接合焊盘。 所述金属薄层包括相对侧的第一表面和第二表面，其中至少一个半导体器件嵌入在所述金属薄层的第一表面中，并且所述半导体器件具有两个具有不同导电类型的电极。 金属散热器沉积在金属薄层的第二表面上。 接合焊盘被放置在半导体器件周围的金属薄层的第一表面上，并且分别对应于电极，其中电极通过至少两根电线电连接并分别连接到相应的焊盘，并且焊盘是 电连接到外部电路。

公开(公告)号：US07522648B2

公开(公告)日：2009-04-21

申请号：US11139763

申请日：2005-05-26

申请人： Mahn Yong Park ,  Byoung Whi Kim

发明人： Mahn Yong Park ,  Byoung Whi Kim

IPC分类号： H01S5/00

CPC分类号： G02B6/4232 ,  G02B6/4207 ,  G02B2006/12121 ,  H01S5/0224 ,  H01S5/02252 ,  H01S5/0226 ,  H01S5/1014 ,  H01S5/227 ,  H01S2301/176

摘要： A hybrid type integrated optical device has a semiconductor laser mounted on a planar waveguide platform by flip-chip bonding. The optical device comprises a semiconductor laser and a planar waveguide platform. The semiconductor laser includes a first structure, which has an active region and a light emission surface formed on at least one side surface of the first structure, and a second structure, which is formed below the first structure and has upper surfaces exposed at the light emission surface of the first structure and/or to a surface opposite to the light emitting surface. The planar waveguide platform includes a substrate, a lower clad layer, a core layer, and an upper clad layer, being sequentially stacked on the substrate. The semiconductor laser is flip-chip bonded on the substrate, such that the exposed upper surfaces of the second structure contact the upper surface of the upper clad layer.

摘要翻译： 混合型集成光学器件通过倒装芯片接合将半导体激光器安装在平面波导平台上。 光学装置包括半导体激光器和平面波导平台。 半导体激光器包括第一结构，其具有形成在第一结构的至少一个侧表面上的有源区和发光表面;以及第二结构，其形成在第一结构下方并且具有在光下暴露的上表面 第一结构的发射表面和/或与发光表面相对的表面。 平面波导平台包括顺序地堆叠在基板上的基板，下包层，芯层和上包覆层。 将半导体激光器倒装芯片接合在基板上，使得第二结构的暴露的上表面接触上覆盖层的上表面。

公开(公告)号：US20080310172A1

公开(公告)日：2008-12-18

申请号：US12155909

申请日：2008-06-11

申请人： Aiichiro Ikeda

发明人： Aiichiro Ikeda

IPC分类号： F21V19/00 ,  A44B19/42

CPC分类号： H01S5/0226 ,  G11B7/22 ,  H01S5/02268

摘要： A step portion is disposed at the periphery of a position where the adhesive is applied so that a front end of a needle for ejecting the adhesive comes in contact with the step portion. A passage is formed in the step portion so as to introduce the adhesive ejected from the front end of the needle to the position.

摘要翻译： 台阶部设置在施加粘合剂的位置的周边，使得用于喷射粘合剂的针的前端与台阶部接触。 在台阶部分形成通道，以将从针头前端喷出的粘合剂引入该位置。