公开(公告)号：US20160315080A1

公开(公告)日：2016-10-27

申请号：US15001283

申请日：2016-01-20

Applicant: Samsung Electronics Co .. Ltd.

Inventor： Jae-yeol SONG ,  Wan-don KIM ,  Oh-seong KWON ,  Hyeok-jun SON ,  Sang-jin HYUN ,  Hoon-joo NA

IPC: H01L27/088 ,  H01L29/06

CPC classification number: H01L27/0886 ,  H01L21/28088 ,  H01L21/28176 ,  H01L21/823431 ,  H01L21/82345 ,  H01L21/823462 ,  H01L29/0653 ,  H01L29/4966 ,  H01L29/513 ,  H01L29/517 ,  H01L29/66545

Abstract: Integrated circuit devices include a substrate including first and second fin-type active regions and first and second gate structures. The first gate structure includes first gate insulating layer on the first fin-type active region to cover upper surface and both side surfaces of the first fin-type active region, first gate electrode on the first gate insulating layer and has first thickness in first direction perpendicular to upper surface of the substrate, and second gate electrode on the first gate electrode. The second gate structure includes second gate insulating layer on the second fin-type active region to cover upper surface and both side surfaces of the second fin-type active region, third gate insulating layer on the second gate insulating layer, third gate electrode on the third gate insulating layer and has second thickness different from the first thickness in the first direction, and fourth gate electrode on the third gate electrode.

Abstract translation: 集成电路器件包括包括第一和第二鳍式有源区以及第一和第二栅极结构的衬底。 第一栅极结构包括第一鳍状有源区上的第一栅极绝缘层，以覆盖第一鳍状有源区的上表面和两个侧表面，第一栅极绝缘层上的第一栅电极和第一栅极绝缘层的第一方向上具有第一厚度 垂直于衬底的上表面，以及第一栅电极上的第二栅电极。 第二栅极结构包括在第二鳍状有源区上的第二栅极绝缘层，以覆盖第二鳍状有源区的上表面和两个侧表面，第二栅极绝缘层上的第三栅极绝缘层，第二栅极绝缘层上的第三栅极电极 第三栅极绝缘层，并且具有与第一方向上的第一厚度不同的第二厚度，以及第三栅电极上的第四栅电极。

公开(公告)号：US20210384321A1

公开(公告)日：2021-12-09

申请号：US17393217

申请日：2021-08-03

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Dae-young KWAK ,  Ji -ye KIM ,  Jung-hwan CHUN ,  Min-chan GWAK ,  Dong-hyun ROH ,  Jin-wook LEE ,  Sang-jin HYUN

IPC: H01L29/66 ,  H01L27/11 ,  H01L27/092 ,  H01L21/8238 ,  H01L29/78 ,  H01L29/45

Abstract: An integrated circuit device includes a fin-type active region protruding from a top surface of a substrate and extending in a first direction parallel to the top surface of the substrate, a gate structure intersecting with the fin-type active region and extending on the substrate in a second direction perpendicular to the first direction, a source/drain region on a first side of the gate structure, a first contact structure on the source/drain region, and a contact capping layer on the first contact structure. A top surface of the first contact structure has a first width in the first direction, a bottom surface of the contact capping layer has a second width greater than the first width stated above in the first direction, and the contact capping layer includes a protruding portion extending outward from a sidewall of the first contact structure.

公开(公告)号：US20170103948A1

公开(公告)日：2017-04-13

申请号：US15186825

申请日：2016-06-20

Applicant: Samsung Electronics Co., Ltd.

Inventor： Do-sun LEE ,  Do-hyun LEE ,  Chul-sung KIM ,  Sang-jin HYUN ,  Joon-gon LEE

IPC: H01L23/535 ,  H01L27/088 ,  H01L29/06 ,  H01L29/78 ,  H01L29/417

CPC classification number: H01L23/535 ,  H01L21/28518 ,  H01L21/76843 ,  H01L21/76855 ,  H01L21/76856 ,  H01L21/76862 ,  H01L21/76864 ,  H01L21/76868 ,  H01L21/76876 ,  H01L23/485 ,  H01L23/53209 ,  H01L27/0886 ,  H01L29/0649 ,  H01L29/41791 ,  H01L29/785

Abstract: An integrated circuit device including a substrate having at least one fin-shaped active region, the at least one fin-shaped active region extending in a first direction, a gate line extending on the at least one fin-shaped active region in a second direction, the second direction intersecting with the first direction, a conductive region on a portion of the at least one fin-shaped active region at one side of the gate line, and a contact plug extending from the conductive region in a third direction, the third direction being perpendicular to a main plane of the substrate, may be provided. The contact plug may include a metal plug, a conductive barrier film on the conductive region, the conductive barrier film surrounding a sidewall and a bottom surface of the metal plug, the conductive barrier film including an N-rich metal nitride film, and a metal silicide film between the conductive region and the conductive barrier film.

公开(公告)号：US20190081151A1

公开(公告)日：2019-03-14

申请号：US15915508

申请日：2018-03-08

Applicant: Samsung Electronics Co., Ltd.

Inventor： Chan-hyeong LEE ,  Hoon-joo NA ,  Sung-in SUH ,  Min-woo SONG ,  Byoung-hoon LEE ,  Hu-yong LEE ,  Sang-jin HYUN

IPC: H01L29/49 ,  H01L29/06 ,  H01L29/423 ,  H01L29/786 ,  H01L21/28 ,  H01L29/66

Abstract: A semiconductor device includes an active region in a substrate, at least one nano-sheet on the substrate and spaced apart from a top surface of the active region, a gate above or below the nano-sheet, a gate insulating layer between the at least one nano-sheet and the gate, and source/drain regions on the active region at both sides of the at least one nano-sheet. The at least one nano-sheet includes a channel region; a gate disposed above or below the nano-sheet and including a single metal layer having different compositions of metal atoms of a surface and an inside thereof; a gate insulating layer between the nano-sheet and the gate; and source/drain regions disposed in the active region of both sides of the at least one nano-sheet.

公开(公告)号：US20160351569A1

公开(公告)日：2016-12-01

申请号：US15164396

申请日：2016-05-25

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jae-yeol SONG ,  Moon-kyu PARK ,  Sang-jin HYUN ,  Hu-yong LEE ,  Hoon-joo NA ,  Hye-lan LEE

IPC: H01L27/092 ,  H01L29/161 ,  H01L29/16 ,  H01L21/8238 ,  H01L29/78 ,  H01L29/49 ,  H01L27/11 ,  H01L29/08 ,  H01L29/165

CPC classification number: H01L21/823821 ,  H01L21/823462 ,  H01L21/823842 ,  H01L21/823857 ,  H01L21/845 ,  H01L27/092 ,  H01L27/0924 ,  H01L27/1104 ,  H01L27/1211 ,  H01L29/165 ,  H01L29/4966 ,  H01L29/66545 ,  H01L29/7833 ,  H01L29/7848

Abstract: Provided are a semiconductor device in which a multi-threshold voltage is embodied by controlling a work function, and a method of manufacturing the same. The device includes a semiconductor substrate including a first region and a second region, a first active region formed in an upper portion of the first region of the semiconductor substrate, a second active region formed in an upper portion of the second region of the semiconductor substrate, a first gate structure formed on the semiconductor substrate across the first active region, the first gate structure including an interfacial layer, a high-k dielectric layer, a capping metal layer, and a work function metal layer that are stacked sequentially, and a second gate structure formed on the semiconductor substrate across the second active region, the second gate structure including the interfacial layer, the high-k dielectric layer, the capping metal layer, a dielectric layer, and the work function metal layer that are stacked sequentially.

Abstract translation: 提供一种其中通过控制功函数来实现多阈值电压的半导体器件及其制造方法。 该器件包括：半导体衬底，包括第一区域和第二区域;形成在半导体衬底的第一区域的上部的第一有源区;形成在半导体衬底的第二区域的上部的第二有源区; 形成在跨过第一有源区的半导体衬底上的第一栅极结构，第一栅极结构包括依次层叠的界面层，高k电介质层，封盖金属层和功函数金属层，以及 第二栅极结构，形成在半导体衬底上跨越第二有源区，第二栅极结构包括依次层叠的界面层，高k电介质层，封盖金属层，电介质层和功函数金属层。

公开(公告)号：US20160314963A1

公开(公告)日：2016-10-27

申请号：US15133548

申请日：2016-04-20

Applicant: Samsung Electronics Co., Ltd.

Inventor： SUN-GYU CHOI ,  Sang-jin HYUN ,  Taek-soo JEON ,  Hoon-joo NA ,  Young-suk CHAI

IPC: H01L21/02 ,  H01L29/66 ,  H01L21/324

CPC classification number: H01L29/66795 ,  C23C16/0218 ,  C23C16/405 ,  H01L21/02236 ,  H01L21/02249 ,  H01L21/02255 ,  H01L21/02312 ,  H01L21/28185 ,  H01L21/28202 ,  H01L21/28255 ,  H01L21/324 ,  H01L29/161 ,  H01L29/42392 ,  H01L29/513 ,  H01L29/518 ,  H01L29/66545 ,  H01L29/6659 ,  H01L29/7833 ,  H01L29/78642

Abstract: A method of forming a thin film includes forming an interface layer stack on a semiconductor substrate. Forming the interface layer stack may include performing a first surface treatment on the semiconductor substrate under a reducing atmosphere. Forming the interface layer stack may include performing a second surface treatment on the semiconductor substrate. The first surface treatment may be performed under a reducing atmosphere and the second surface treatment may be performed under a nitridation atmosphere. The first surface treatment may include forming a lower interface layer on a surface of the semiconductor substrate and the second surface treatment may include forming an upper interface layer. The first surface treatment may include selectively removing at least one oxide material from a native oxide film on the semiconductor substrate.

Abstract translation: 形成薄膜的方法包括在半导体衬底上形成界面层叠层。 形成界面层堆叠可以包括在还原气氛下对半导体衬底进行第一表面处理。 形成界面层堆叠可以包括在半导体衬底上进行第二表面处理。 第一表面处理可以在还原气氛下进行，第二表面处理可以在氮气氛下进行。 第一表面处理可以包括在半导体衬底的表面上形成下界面层，并且第二表面处理可以包括形成上界面层。 第一表面处理可以包括从半导体衬底上的自然氧化物膜选择性地去除至少一种氧化物材料。

公开(公告)号：US20230207662A1

公开(公告)日：2023-06-29

申请号：US18174902

申请日：2023-02-27

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Dae-young KWAK ,  Ji -ye KIM ,  Jung-hwan CHUN ,  Min-chan GWAK ,  Dong-hyun ROH ,  Jin-wook LEE ,  Sang-jin HYUN

IPC: H01L29/66 ,  H01L27/092 ,  H01L21/8238 ,  H01L29/78 ,  H01L29/45 ,  H10B10/00

CPC classification number: H01L29/66515 ,  H01L21/823821 ,  H01L21/823871 ,  H01L27/0924 ,  H01L29/45 ,  H01L29/7851 ,  H01L29/66795 ,  H10B10/12

Abstract: An integrated circuit device includes a fin-type active region protruding from a top surface of a substrate and extending in a first direction parallel to the top surface of the substrate, a gate structure intersecting with the fin-type active region and extending on the substrate in a second direction perpendicular to the first direction, a source/drain region on a first side of the gate structure, a first contact structure on the source/drain region, and a contact capping layer on the first contact structure. A top surface of the first contact structure has a first width in the first direction, a bottom surface of the contact capping layer has a second width greater than the first width stated above in the first direction, and the contact capping layer includes a protruding portion extending outward from a sidewall of the first contact structure.

公开(公告)号：US20190148226A1

公开(公告)日：2019-05-16

申请号：US16154896

申请日：2018-10-09

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jeong-hyuk YIM ,  Kuo Tai HUANG ,  Wan-don KIM ,  Sang-jin HYUN

IPC: H01L21/768 ,  H01L23/522 ,  H01L29/66 ,  H01L29/417 ,  H01L23/532

Abstract: An integrated circuit (IC) device includes a substrate having a fin-type active region extending in a first direction, a gate structure intersecting the fin-type active region on the substrate, the gate structure extending in a second direction perpendicular to the first direction and parallel to a top surface of the substrate, source and drain regions on both sides of the gate structure, and a first contact structure electrically connected to one of the source and drain regions, the first contact structure including a first contact plug including a first material and a first wetting layer surrounding the first contact plug, the first wetting layer including a second material having a lattice constant that differs from a lattice constant of the first material by about 10% or less.