Organic light emitting diode display device and method of fabricating the same
    2.
    发明授权
    Organic light emitting diode display device and method of fabricating the same 有权
    有机发光二极管显示装置及其制造方法

    公开(公告)号:US09035311B2

    公开(公告)日:2015-05-19

    申请号:US13841121

    申请日:2013-03-15

    CPC classification number: H01L51/52 H01L27/3265 H01L2227/323

    Abstract: An organic light emitting diode (OLED) display device and a method of fabricating the same are provided. The OLED display device includes a substrate having a thin film transistor region and a capacitor region, a buffer layer disposed on the substrate, a gate insulating layer disposed on the substrate, a lower capacitor electrode disposed on the gate insulating layer in the capacitor region, an interlayer insulating layer disposed on the substrate, and an upper capacitor electrode disposed on the interlayer insulating layer and facing the lower capacitor electrode, wherein regions of each of the buffer layer, the gate insulating layer, the interlayer insulating layer, the lower capacitor electrode, and the upper capacitor electrode have surfaces in which protrusions having the same shape as grain boundaries of the semiconductor layer are formed. The resultant capacitor has an increased surface area, and therefore, an increased capacitance.

    Abstract translation: 提供了一种有机发光二极管(OLED)显示装置及其制造方法。 OLED显示装置包括具有薄膜晶体管区域和电容器区域的基板,设置在基板上的缓冲层,设置在基板上的栅极绝缘层,设置在电容器区域的栅极绝缘层上的下部电容电极, 设置在所述基板上的层间绝缘层,以及设置在所述层间绝缘层上并面向所述下部电容电极的上部电容电极,其中,所述缓冲层,所述栅极绝缘层,所述层间绝缘层,所述下部电容电极 并且上部电容器电极具有形成具有与半导体层的晶界相同形状的突起的表面。 所得的电容器具有增加的表面积,因此增加电容。

    METHOD OF MANUFACTURING THIN FILM TRANSISTOR,THIN FILM TRANSISTOR MANUFACTURED BY USING THE METHOD, METHOD OF MANUFACTURING ORGANIC LIGHT-EMITTING DISPLAY APPARATUS, AND ORGANIC LIGHT-EMITTING DISPLAY APPARATUS MANUFACTURED BY USING THE METHOD
    5.
    发明申请
    METHOD OF MANUFACTURING THIN FILM TRANSISTOR,THIN FILM TRANSISTOR MANUFACTURED BY USING THE METHOD, METHOD OF MANUFACTURING ORGANIC LIGHT-EMITTING DISPLAY APPARATUS, AND ORGANIC LIGHT-EMITTING DISPLAY APPARATUS MANUFACTURED BY USING THE METHOD 审中-公开
    制造薄膜晶体管的方法,使用该方法制造的薄膜晶体管,制造有机发光显示装置的方法和使用该方法制造的有机发光显示装置

    公开(公告)号:US20140299860A1

    公开(公告)日:2014-10-09

    申请号:US14307980

    申请日:2014-06-18

    Abstract: A method of manufacturing a thin film transistor (TFT) comprises forming a buffer layer, an amorphous silicon layer, and an insulating layer on a substrate; crystallizing the amorphous silicon layer as a polycrystalline silicon layer; forming a semiconductor layer and a gate insulating layer which have a predetermined shape by simultaneously patterning the polycrystalline silicon layer and the insulating layer; forming a gate electrode including a first portion and a second portion by forming and patterning a metal layer on the gate insulating layer. The first portion is formed on the gate insulating layer and overlaps a channel region of a semiconductor layer, and the second portion contacts the semiconductor layer. A source region and a drain region are formed on the semiconductor layer by doping a region of the semiconductor layer. The region excludes the channel region overlapping the gate electrode and constitutes a region which does not overlap the gate electrode. An interlayer insulating layer is formed on the gate electrode so as to cover the gate insulating layer; contact holes are formed on the interlayer insulating layer and the gate insulating layer so as to expose the source region and the drain region, and simultaneously an opening for exposing the second portion is formed. A source electrode and a drain electrode are formed by patterning a conductive layer on the interlayer insulating layer. The source electrode and the drain electrode are electrically connected to the source region and the drain region via the contact holes, and simultaneously the second portion exposed via the opening is removed.

    Abstract translation: 制造薄膜晶体管(TFT)的方法包括在基板上形成缓冲层,非晶硅层和绝缘层; 使非晶硅层结晶为多晶硅层; 通过同时构图多晶硅层和绝缘层来形成具有预定形状的半导体层和栅极绝缘层; 通过在栅极绝缘层上形成和图案化金属层,形成包括第一部分和第二部分的栅电极。 第一部分形成在栅极绝缘层上并且与半导体层的沟道区重叠,并且第二部分接触半导体层。 通过掺杂半导体层的区域,在半导体层上形成源极区和漏极区。 该区域排除与栅电极重叠的沟道区域,并构成不与栅电极重叠的区域。 在栅电极上形成层间绝缘层,以覆盖栅极绝缘层; 在层间绝缘层和栅极绝缘层上形成接触孔,露出源极区域和漏极区域,同时形成露出第二部分的开口部。 源电极和漏电极通过在层间绝缘层上图案化导电层而形成。 源电极和漏电极经由接触孔电连接到源极区域和漏极区域,同时去除经由开口露出的第二部分。

    Method of manufacturing thin film transistor, thin film transistor manufactured by using the method, method of manufacturing organic light-emitting display apparatus, and organic light-emitting display apparatus manufactured by using the method

    公开(公告)号:US10147774B2

    公开(公告)日:2018-12-04

    申请号:US14307980

    申请日:2014-06-18

    Abstract: A method of manufacturing a thin film transistor (TFT) comprises forming a buffer layer, an amorphous silicon layer, and an insulating layer on a substrate; crystallizing the amorphous silicon layer as a polycrystalline silicon layer; forming a semiconductor layer and a gate insulating layer which have a predetermined shape by simultaneously patterning the polycrystalline silicon layer and the insulating layer; forming a gate electrode including a first portion and a second portion by forming and patterning a metal layer on the gate insulating layer. The first portion is formed on the gate insulating layer and overlaps a channel region of a semiconductor layer, and the second portion contacts the semiconductor layer. A source region and a drain region are formed on the semiconductor layer by doping a region of the semiconductor layer. The region excludes the channel region overlapping the gate electrode and constitutes a region which does not overlap the gate electrode. An interlayer insulating layer is formed on the gate electrode so as to cover the gate insulating layer; contact holes are formed on the interlayer insulating layer and the gate insulating layer so as to expose the source region and the drain region, and simultaneously an opening for exposing the second portion is formed. A source electrode and a drain electrode are formed by patterning a conductive layer on the interlayer insulating layer. The source electrode and the drain electrode are electrically connected to the source region and the drain region via the contact holes, and simultaneously the second portion exposed via the opening is removed.

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