Invention Grant
- Patent Title: Method of fabricating polysilicon layer, thin film transistor, organic light emitting diode display device including the same, and method of fabricating the same
- Patent Title (中): 制造多晶硅层的方法,薄膜晶体管,包括其的有机发光二极管显示装置及其制造方法
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Application No.: US14721621Application Date: 2015-05-26
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Publication No.: US09576797B2Publication Date: 2017-02-21
- Inventor: Dong-Hyun Lee , Ki-Yong Lee , Jin-Wook Seo , Tae-Hoon Yang , Yun-Mo Chung , Byoung-Keon Park , Kil-Won Lee , Jong-Ryuk Park , Bo-Kyung Choi , Byung-Soo So
- Applicant: Samsung Display Co., Ltd.
- Applicant Address: KR Yongin-si
- Assignee: Samsung Display Co., Ltd.
- Current Assignee: Samsung Display Co., Ltd.
- Current Assignee Address: KR Yongin-si
- Agency: H.C. Park & Associates, PLC
- Priority: KR10-2009-0112770 20091120
- Main IPC: H01L21/02
- IPC: H01L21/02 ; H01L29/786 ; H01L29/66 ; H01L27/12 ; H01L21/477 ; H01L27/32

Abstract:
A method of fabricating a polysilicon layer includes forming a buffer layer on a substrate, forming a metal catalyst layer on the buffer layer, diffusing a metal catalyst into the metal catalyst layer to the buffer layer, removing the metal catalyst layer, forming an amorphous silicon layer on the buffer layer, and annealing the substrate to crystallize the amorphous silicon layer into a polysilicon layer. The thin film transistor includes a substrate, a buffer layer disposed on the substrate, a semiconductor layer disposed on the buffer layer, a gate insulating layer disposed above the substrate and on the semiconductor layer, a gate electrode disposed on the gate insulating layer, a source electrode and a drain electrode both electrically connected to the semiconductor layer, and a metal silicide disposed between the buffer layer and the semiconductor layer.
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