Abstract:
A method includes processing a first silicon wafer using a first focus condition, the first silicon wafer comprising: a first test pattern and a second test pattern, the first test pattern and the second test pattern being different. The method further includes determining a first critical dimension for the first test pattern, determining a second critical dimension for the second test pattern, determining a delta focus value based on the first critical dimension and the second critical dimension, and processing a second silicon wafer with a second focus condition, the second focus condition based on the delta focus value.
Abstract:
A lithography method based on the projection of cells, notably direct-write electron-beam lithography. One of the main limitations of the methods of this type in the prior art is the writing time. To overcome this limitation, according to the method of the invention, the size of the cells is increased to the maximum aperture of the lithography device. Advantageously, this size increase is obtained by modifying the size of the apertures of the projection stencil level closest to the substrate to be etched. Advantageously, a strip is added to the outside of the block to be etched onto which is radiated a dose calculated to optimize the process energy latitude. Advantageously, this strip is spaced apart from the edge of the block to be etched. Advantageously, the projected cells are not adjoining.
Abstract:
A substrate is loaded onto a substrate support of a lithographic apparatus, after which the apparatus measures locations of substrate alignment marks. These measurements define first correction information allowing the apparatus to apply a pattern at one or more desired locations on the substrate. Additional second correction information is used to enhance accuracy of pattern positioning, in particular to correct higher order distortions of a nominal alignment grid. The second correction information may be based on measurements of locations of alignment marks made when applying a previous pattern to the same substrate. The second correction information may alternatively or in addition be based on measurements made on similar substrates that have been patterned prior to the current substrate.
Abstract:
One illustrative method disclosed herein includes the steps of performing a directed self-assembly process to form a DSA masking layer, performing at least one process operation to remove at least one of the features of the DSA masking layer so as to thereby define a patterned DSA masking layer with a DSA masking pattern, performing at least one process operation to form a patterned transfer masking layer having a transfer masking pattern comprised of a plurality of features that define a plurality of openings in the transfer masking layer, wherein the transfer masking pattern is the inverse of the DSA masking pattern, and performing at least one etching process through the patterned transfer masking layer on a layer of material to form a plurality of trench/via features in the layer of material.
Abstract:
The present invention pertains to a method for preparing a printing form from a photosensitive element by thermal treatment, wherein a gas jet emitting from a nozzle assembly impinges the exterior surface of the element to smooth or polish and mitigate marks and deformations that can be generated during development. Impingement with a heated gas jet provides surface polishing from rapid and specific convective heat flux to the exterior surface of the printing plate.
Abstract:
A radiation curing composition suitable for building a three-dimensional object by a solid freeform method is disclosed. The composition includes one or more mono-functional monomers where a respective polymer has a Glass Transition Temperature higher than about 60° C., one or more di-functional oligomers where a respective polymer has a Glass Transition Temperature lower than about 40° C. and a phase separation inducing component. The phase separation may be induced during curing, resulting in a non-clear cured material having an improved impact strength and higher elongation, when compared to similar compositions without a phase separation inducing component.
Abstract:
A document reading device for reading a page of a passport includes a mounting surface, a camera, an illumination light source for radiating illumination light that is, and an ultraviolet light source for radiating ultraviolet light to activate a fluorescent material on the page. The illumination light source is at a first edge perpendicular to a binding edge on the page and radiates illumination light in the direction intersecting with the first edge. The ultraviolet light source is at a second edge parallel to the binding edge and radiates ultraviolet light in the direction intersecting with the second edge. The illumination light source includes an infrared light source and a white light source. The document reading device has both an illumination light source and an ultraviolet light source, and can avoid image capturing in the specular reflection condition when the document is deformed.
Abstract:
After a cassette is mounted on a cassette mounting part, a control unit instructs a substrate treatment apparatus to start treatment on substrates in the cassette. Thereafter, the control unit indicates, to the substrate treatment apparatus, a cassette on the cassette mounting part to which a substrate is transferred at completion of the treatment. If the transfer destination cassette for the substrate at the completion of treatment has not been indicated when a number of remaining treatment steps for the substrate reaches a predetermined set number, an alarm is given from the substrate treatment apparatus. This alarm is sent from the substrate treatment apparatus to the control unit, and the control unit indicates a transfer destination cassette for the substrate.
Abstract:
According to one embodiment, a method for manufacturing a template for imprinting includes preparing a first template having a device pattern and a plurality of identification patterns, and forming a second template by transferring the device pattern and at lest desired one of the identification patterns to a template substrate.