Abstract:
An electronic device test apparatus used for bringing the ICs into electrical contact with contact parts of the test head in the state where the ICs are held on a test tray and running tests on the electrical characteristics of ICs, the electronic device test apparatus including an inversion system for rotating the test tray which holds a plurality of ICs in a direction dropping ICs which are insufficiently held at least once before testing.
Abstract:
An electric device testing apparatus comprises a connection terminal to which an IC chip to be tested is removably connected, a pusher for pushing the IC chip in the direction of the connection terminal in order to connect the IC chip to the connection terminal, and temperature adjusted air supply for blowing a temperature adjusted air to around the IC chip during a test on the IC chip via a through hole formed on the pushed.
Abstract:
An automatic handler for an IC test system is disclosed which is capable of reducing a time for transferring IC devices to be tested from a supply area to a test head area and from the test head area to a discharge area. The automatic handler includes a test tray for loading the IC devices to be tested in which the IC devices to be tested are aligned in the test tray with a shorter distance with one another than a distance between test contactors in the test head area, a pair of positioning stoppers provided in the test head area along a moving direction of the test tray in which the positioning stoppers are spaced by the distance equal to the distance of the IC devices to be tested in the test tray. In the automatic handler, the distance of the contactors is adjusted to an integer multiple of the distance of the IC devices to be tested in the test tray. One of the positioning stoppers contacts the test tray to determine a first position for testing the IC devices in a first line in the test tray, and then the test tray is transferred until other positioning stoppers contacts the test tray in a second position for testing the IC devices in a second line in the test tray. The test tray is then transferred to the discharge area. Another aspect of the automatic handler is provided with a groove on the test tray to increase a number of test position for the test tray. The groove includes an end surface which engages with the positioning stoppers.
Abstract:
A radiation-sensitive layer comprising as a main component a radiation-sensitive composition containing a compound capable of generating an acid when exposed to a chemical radiation and a compound having at least one linkage decomposable by an acid is formed on a substrate. An acidic coating layer is formed on the radiation-sensitive layer. The radiation-sensitive layer and the acidic coating layer are pattern-exposed to a chemical radiation. The radiation-sensitive layer and the acidic coating layer are baked and developed by using an aqueous alkaline solution to obtain a pattern comprising lines and spaces, each having a predetermined width. A fine pattern of a rectangular sectional shape can be formed without producing eaves caused by a surface inhibition layer layer, which is produced on the film surface.
Abstract:
A photosensitive composition contains an alkali-soluble polymer having a phenol skeleton in its structure and a heterocyclic compound represented by formula (I-1) or (I-2), formula (II-1) or (II-2), any of formulas (III-1) to (III-8), any of formulas (IV-1) to (IV-12), or any of formulas (V-1) to (V-4) described in the claims and specification. A photosensitive composition containing a heterocyclic compound represented by formula (I-1) or (I-2), any of formulas (III-1) to (III-8), any of formulas (IV-1) to (IV-12), or any of formulas (V-1) to (V-4) can be suitably used as a negative resist. A photosensitive composition containing a heterocyclic compound represented by formula (II-1) or (II-2) can be suitably used as a positive resist. A photosensitive composition containing an alkali-soluble polymer having a phenol skeleton in its structure and a polymer having a nitrogen-containing heterocyclic compound as a polymeric unit is also included in this invention. The latter photosensitive composition can further contain a heterocyclic compound represented by any of formulas (VI-1) to (VI-15) described in the claims and specification.
Abstract:
An IC tester which is capable of reducing the time required before completion of testing on all of ICs to be tested is provided. The depth (length in the Y-axis direction) of the constant temperature chamber 4 and the exit chamber 5 is expanded by a dimension corresponding approximately to one transverse width (length of the minor edge) of the rectangular test tray 3, and two generally parallel test tray transport paths or alternatively a widened test tray transport path broad enough to transport two test trays simultaneously with the two test trays juxtaposed in a direction transverse to the widened test tray transport path are provided in the section of test tray transport path extending from the soak chamber 41 in the constant temperature chamber 4 through the testing section 42 in the constant temperature chamber 4 to the exit chamber 5 so that two test trays may be simultaneously transported along the two test tray transport paths or the widened test tray transport path.
Abstract:
A pad 1051, air cylinder 1052, cylinder control valve 1053, vacuum generator 1054, feed valve 1055, break valve 1056, and pressure sensor 1057 are assembled together to form an IC pickup 105d.
Abstract:
A mechanism for positioning IC devices to be tested aligned in a test tray of an automatic handler for an IC test system capable of reducing a time for transferring the test tray from a supply area to a test head area which has a plurality of test contactors and from a test head area to a discharge area is disclosed. The mechanism includes a stopper which determines the first stop position of the test tray when said test tray contacts with the outer surface of the test tray and the second stop position of the test tray when said stopper contacts with the end surface of a groove being provided with on its side portion of the test tray to receive and engage with the projection of the stopper. The distance between the adjacent test contactors is adjusted to be equal to two times or integer multiple of the distance between the adjacent IC devices to be tested aligned in the test tray and the distance between the first position and the second position is adjusted to be equal to the distance between the adjacent IC devices to be tested so that minimizing the index time for transferring the test tray becomes possible.
Abstract:
An IC transfer system can be used in conjunction with either a tray type magazine or a rod-shaped magazine. A device reinspection method in the IC test handler reinspects the DUT stored in the magazine without human intervention, sorts in accordance with the test results, and stores in the magazine and the customer tray. For this purpose, a tray supply section transfers a user tray (170) to a test tray (180), whereas a magazine supply section (152) and a pick carrier section (112) transfer a rod-shaped magazine (150) to the test tray (180). An inspection setting sets the number of reinspections, the classification of inspection results, and the storage tray/magazine. The DUT (215) is loaded (203) from the magazine to the test tray (180) and is tested (204). After testing (204), a judgement is made whether or not the reinspection mode is effective. If the reinspection mode is effective, the DUT (215) to be reinspected are all stored (206) in the unloader section (223) , and transferred (207) to the loader section (222) using the tray transfer system (227). When the reinspection mode is completed, the DUT (215) is sorted by the category and stored (212) , and the testing is completed (213).
Abstract:
Disclosed herein is a resist for forming patterns, which is greatly sensitive to ultraviolet rays an ionizing radiation, and which can therefore form a high-resolution resist pattern if exposed to ultra violet rays or an unionizing radiation. Hence, the resist is useful in a method of manufacturing semicon ductor devices having high integration densities. The resist comprises tert-butoxycarbonyl methoxypolyhydroxy styrene and an o-quinonediazide compound.