Heat treating method and heat treating apparatus
    2.
    发明授权
    Heat treating method and heat treating apparatus 失效
    热处理方法和热处理装置

    公开(公告)号:US06680462B2

    公开(公告)日:2004-01-20

    申请号:US10282114

    申请日:2002-10-29

    CPC classification number: H01L21/67115 F26B3/28 H05B3/0047

    Abstract: Disclosed is an apparatus for heating a target substrate by means of light irradiation. The heating apparatus includes a substrate support section for supporting the target substrate, an irradiating light generating section for irradiating the light irradiating regions of the target substrate supported by the substrate support section, and a light irradiating region changing section for changing the light irradiating regions of the target substrate irradiated with the light generated from the irradiating light generation section.

    Abstract translation: 公开了一种通过光照射加热目标基板的装置。 加热装置包括用于支撑目标基板的基板支撑部分,用于照射由基板支撑部分支撑的目标基板的光照射区域的照射光产生部分和用于改变基板支撑部分的光照射区域的光照射区域改变部分 所述目标基板用从所述照射光产生部产生的光照射。

    Alignment mark, manufacturing method thereof, exposing method using the
alignment mark, semiconductor device manufactured using the exposing
method

    公开(公告)号:US5969428A

    公开(公告)日:1999-10-19

    申请号:US86609

    申请日:1998-05-29

    Abstract: An alignment mark formed on a surface of substrate for aligning with a mask through an irradiation of alignment light, which comprises a step formed with a concave portion and a convex portion and a metallic film deposited along the concave portion and the convex portion. A light absorption layer is formed over at least one of the concave portion and the convex portion reflecting the step, the light absorption layer lying over the concave portion having a different thickness from that of the light absorption layer lying over the convex portion when the light absorption layer is formed over both the concave portion and the convex portion, the light absorption layer comprising a material capable of absorbing at least a portion of wavelength region of the alignment light. The light absorption layer is desirably formed in a larger thickness on the convex portion of the step as compared with that on the concave portion. Desirably, the light absorption layer is a resist capable of absorbing a portion of wavelength region of the alignment light, or a resist containing a material capable of absorbing a portion of wavelength region of the alignment light.

    Abstract translation: 在基板的表面上形成的对准标记,其通过对准光的照射与掩模对准,其包括形成有凹部和凸部的台阶和沿着凹部和凸部沉积的金属膜。 在反射该台阶的凹部和凸部中的至少一个上形成有光吸收层,该光吸收层位于凹部上方,该光吸收层的厚度与位于凸部上的光吸收层的厚度不同, 吸收层形成在凹部和凸部两者之上,光吸收层包括能够吸收对准光的波长区域的至少一部分的材料。 与步骤中的凹部相比,希望在台阶的凸部形成较大的厚度的光吸收层。 理想地,光吸收层是能够吸收对准光的波长区域的一部分的抗蚀剂,或含有能够吸收取向光的一部分波长区域的材料的抗蚀剂。

    Heat treating method and heat treating apparatus
    5.
    发明授权
    Heat treating method and heat treating apparatus 失效
    热处理方法和热处理装置

    公开(公告)号:US06333493B1

    公开(公告)日:2001-12-25

    申请号:US09666108

    申请日:2000-09-20

    CPC classification number: H01L21/67115 F26B3/28 H05B3/0047

    Abstract: Disclosed is a heat treating method for heating a target substrate by means of light irradiation, in which a light irradiation treatment is applied to the target substrate a plurality of times such that adjacent light irradiated regions on the target substrate partially overlap with each other and that the adjacent light irradiated regions do not overlap with each other in the light irradiating periods.

    Abstract translation: 公开了一种用于通过光照射加热目标基板的热处理方法,其中对目标基板进行多次光照射处理,使得目标基板上的相邻光照射区域彼此部分重叠,并且这些相互之间的相邻光照射区域彼此部分重叠, 相邻的光照射区域在光照射期间不重叠。

    Heat treatment method and a heat treatment apparatus for controlling the temperature of a substrate surface
    6.
    发明授权
    Heat treatment method and a heat treatment apparatus for controlling the temperature of a substrate surface 失效
    热处理方法和用于控制基板表面的温度的热处理装置

    公开(公告)号:US06265696B1

    公开(公告)日:2001-07-24

    申请号:US09371845

    申请日:1999-08-11

    CPC classification number: G01J5/06 G01J5/0003 G05D23/27

    Abstract: A substrate to be processed on which a thin film is formed is supported by a support member. The substrate to be processed is heated by a heating section. The surface temperature is measured by a radiation thermometer, and the heating temperature of the heating section is controlled by a control section, in response to the temperature measured by the radiation thermometer. Further, a blackbody is provided at a position optically symmetrical to the radiation thermometer with respect to the surface of the thin film. The blackbody is set at a constant temperature. The blackbody cuts stray light (noise light) which enters into the radiation thermometer.

    Abstract translation: 其上形成有薄膜的待处理基板由支撑部件支撑。 待加工的基板被加热部加热。 通过辐射温度计测量表面温度,并且响应于由辐射温度计测量的温度,加热部分的加热温度由控制部分控制。 此外,相对于薄膜的表面,在与辐射温度计光学对称的位置处设置黑体。 黑体被设定在恒温。 黑体切割进入辐射温度计的杂散光(噪声光)。

    Alignment mark for use in making semiconductor devices

    公开(公告)号:US5847468A

    公开(公告)日:1998-12-08

    申请号:US873563

    申请日:1997-06-12

    Abstract: An alignment mark formed on a surface of substrate for aligning with a mask through an irradiation of alignment light, which comprises a step formed with a concave portion and a convex portion and a metallic film deposited along the concave portion and the convex portion. A light absorption layer is formed over at least one of the concave portion and the convex portion reflecting the step, the light absorption layer lying over the concave portion having a different thickness from that of the light absorption layer lying over the convex portion when the light absorption layer is formed over both the concave portion and the convex portion, the light absorption layer comprising a material capable of absorbing at least a portion of wavelength region of the alignment light. The light absorption layer is desirably formed in a larger thickness on the convex portion of the step as compared with that on the concave portion. Desirably, the light absorption layer is a resist capable of absorbing a portion of wavelength region of the alignment light, or a resist containing a material capable of absorbing a portion of wavelength region of the alignment light.

    Heat treating method and heat treating apparatus
    9.
    发明授权
    Heat treating method and heat treating apparatus 失效
    热处理方法和热处理装置

    公开(公告)号:US06495807B2

    公开(公告)日:2002-12-17

    申请号:US09983667

    申请日:2001-10-25

    CPC classification number: H01L21/67115 F26B3/28 H05B3/0047

    Abstract: Disclosed is a heat treating method for heating a target substrate by means of light irradiation, in which light irradiation treatment is applied to the target substrate such that the light irradiation regions of the target substrate do not overlap with each other, the light irradiation treatment being performed by using an irradiating light adjusted such that the distribution of the light intensity within the light irradiation region of the target substrate is rendered uniform.

    Abstract translation: 公开了一种通过光照射对目标基板进行加热的热处理方法,其中对目标基板施加光照射处理,使得目标基板的光照射区域彼此不重叠,光照射处理为 通过使用被调整为使得目标基板的光照射区域内的光强度分布变得均匀的照射光进行。

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