Abstract:
A wafer handling system and a method of retrofitting the system to an existing wafer handling apparatus are provided that make possible a method of handling wafers by contacting only a narrow area of not more than two millimeters wide adjacent the edge of the wafer, which is particularly useful for backside deposition where device side contact defines an area of exclusion that renders the wafer unusable in that area. The system provides a chuck on a wafer transfer arm that holds a wafer by gravity on a segmented, upwardly facing annular surface. A compatible annular surface is provided on an aligning station chuck so that wafers can be transferred by contact only with the exclusion area of the wafer surface. A load arm has two similarly compatible chucks further provided with pneumatically actuated grippers to allow the wafer to be loaded into a vertical processing apparatus. The wafer chucks are retrofitted into a processing apparatus in place of vacuum chucks and the vacuum lines that were provided to activate them are used for wafer detection. The electrical signals that were provided for vacuum chuck commands are utilized to actuate the grippers on the transfer arm so that no control software and little hardware need be altered for the retrofit.
Abstract:
An improved tool mount structure allows the infinite placement of a tool along a generally elongate cylindrical member at an infinite number of locations. The elongate cylindrical member is fixed at each axial end to a generally rigid moving member such as a robotic arm boom or transfer bar. The cylindrical member is fixed in a bracket at one axial end, and into a quick-release mount at an opposed axial end. The cylindrical member may be quickly released from the moving member such that the tool may be easily changed. At the same time, by fixing the cylindrical member at each axial end, a secure rigid connection is provided.
Abstract:
The present invention provides a method for the quiet, contactless handling of objects using pickup devices of the Bernoulli type. The method is particularly suitable for the contactless handling of items much larger than an individual pickup, for example the handling of lithographic printing plates. According to the method of the present invention, a flow of fluid is established between the pickup face of the Bernoulli pickup and the surface of the object to be supported. The fluid is made to flow over a laminar flow surface at a velocity sufficient to produce a pressure differential between the flowing fluid and a surrounding fluid medium. Bernoulli lift is maximized by making the laminar flow surface as smooth and protrusionúfree as possible, and by ensuring that the location and extent of the laminar flow surface substantially coincides with the maximal lateral limits of the low-pressure zone between the pickup face and the opposing object surface. As the pickup fluid flows beyond the periphery of the laminar flow surface, it flows over a vibrationúattenuating surface, reducing unwanted vibrations in the object.
Abstract:
A pick and place system is provided with an actuator is responsive to the connection to an air power source to move to a pick-up position. The actuator moves a fork-type link which in turn moves a probe to compliantly move to pick up a micro device upon connection to the air power source. A replaceable precisor precisely aligns the micro device relative to the probe and a floating seal disposed around the probe and resting on the replaceable precisor seals the probe to the replaceable precisor. A system control, connectable to the electrical power source, is connected to the pneumatic and supply valves for selectively, electrically actuating the pneumatic and supply valves.
Abstract:
A flexible vacuum gripper device and method of gripping. The device includes a housing, an inflatable gripper element defining an internal chamber and being radially or circumferentially expandable, the inflatable gripper element having a front end which is adapted to grip an object and a rear end coupled to the housing, a vacuum source communicating with the internal chamber of the inflatable gripper element, and a pressure source communicating with the inflatable gripper, wherein the vacuum gripper device is adapted to grip the object using vacuum formed in the internal chamber and wherein the inflatable gripper element is adapted to be inflated using the pressure source. The method includes adjusting a position of the flexible gripper element with respect to the housing by moving the flexible gripper element towards or away from the housing, positioning the inflatable gripper against the object, inflating the inflatable gripper using the pressure source, and forming a vacuum in the internal chamber using the vacuum source, wherein the vacuum gripper device is adapted to vacuum grip the object while the inflatable gripper element is inflated.
Abstract:
Disclosed is a flexible sheet handling apparatus including a frame having a vacuum passage located around the periphery of the frame. There is also a porous, polymeric plug which covers the vacuum passage. When a vacuum is applied to the vacuum passage and the porous, polymeric plug, a flexible sheet in contact with the porous, polymeric plug is uniformly held only around the periphery of the flexible sheet by the applied vacuum.
Abstract:
An electric-component mounting head, including a support member, a suction nozzle which applies a suction to an electric component and thereby holds the component, and a nozzle holder which is supported by the support member, which holds the nozzle such that the nozzle is movable relative to the support member in a direction parallel to an axis line of the nozzle, and which comprises a housing and a piston fitted in the housing such that one of the housing and the piston that is connected to the nozzle is movable relative to the other of the housing and the piston that is connected to the support member, the nozzle holder having at least one pressure chamber which is defined by at least one of axially opposite end surfaces of the piston and the housing, at least one communication opening which communicates with the one pressure chamber, two guide surfaces which are supported by the housing and the piston, respectively, and cooperate with each other to guide the relative movement of the housing and the piston, and a gas-supply passage which opens in a space provided between the two guide surfaces, at at least two positions axis-symmetric with each other with respect to an axis line of the piston, and supplies a pressurized gas to the space.
Abstract:
A suction mechanism for an IC, in which a hollow shaft incorporating a suction pad at its lower end part is supported by a holder so as to be vertically slidable, and the suction pad is made into resilient contact with an IC accommodated in a recess on a tray when the holder is lowered. A stopper formed therein with a step part projected downward so as to laterally cover the suction pad is attached to the lower end part of the hollow shaft; the lower end of the step part is located above an IC contact surface of the suction pad, the lower surface of the stopper has at least a width with which the stopper is prevented from sinking into the recess on the tray, and a distance between the lower surface of the stopper to the IC contact surface of the suction pad is shorter than the depth of the recess on the tray.
Abstract:
Under pressure handling device comprising an under pressure generator, a device for controlling the under pressure and several grippers which engage on a work piece to be handled, wherein each gripper is provided with a device for controlling the under pressure, a sensor for detecting state variables on the gripper and an evaluation electronics to which the device for controlling the under pressure and the sensor are connected.
Abstract:
An end-effector includes multiple vortex chucks for supporting a wafer. Vortex chucks are located along the periphery of the end-effector to help prevent a flexible wafer from curling. The end-effector has limiters to restrict the lateral movement of a supported wafer. In one example, the end-effector has a detector for detecting the presence of a wafer. The detector is mounted at a shallow angle to allow the end-effector to be positioned close to a wafer to be picked-up, thereby allowing detection of deformed wafers contained in a wafer cassette. The shallow angle of the detector also minimizes the thickness of the end-effector. Also disclosed is a wafer station with features similar to that of the end-effector.