公开(公告)号：US08677929B2

公开(公告)日：2014-03-25

申请号：US13338173

申请日：2011-12-27

Applicant: Alexander J. Berger ,  Terry Bluck ,  Vinay Shah ,  Judy Huang ,  Karthik Janakiraman ,  Chau T. Nguyen ,  Greg Stumbo

Inventor： Alexander J. Berger ,  Terry Bluck ,  Vinay Shah ,  Judy Huang ,  Karthik Janakiraman ,  Chau T. Nguyen ,  Greg Stumbo

IPC: B05C3/00 ,  B05C19/02 ,  B65G37/00 ,  B65G47/12 ,  H01L21/00 ,  H01L25/00 ,  B05D1/18

CPC classification number: H01L31/1876 ,  B05D1/322 ,  B05D1/327 ,  C23C14/042 ,  C23C16/042 ,  Y02E10/50 ,  Y02P70/521

Abstract: Disclosed are methods and apparatus for masking of substrates for deposition, and subsequent lifting of the mask with deposited material. Masking materials are utilized that can be used in high temperatures and vacuum environment. The masking material has minimal outgassing once inside a vacuum chamber and withstand the temperatures during deposition process. The mask is inkjeted over the wafers and, after deposition, removed using agitation, such as ultrasonic agitation, or using laser burn off.

Abstract translation: 公开了用于掩蔽用于沉积的基底的方法和装置，以及随后用沉积材料提起掩模。 使用可在高温和真空环境中使用的遮蔽材料。 掩模材料一旦在真空室内就具有最小的除气，并能承受沉积过程中的温度。 将掩模喷涂在晶片上，并且在沉积之后，使用搅拌（例如超声波搅拌）或使用激光烧掉来除去掩模。

公开(公告)号：US20120171807A1

公开(公告)日：2012-07-05

申请号：US13338173

申请日：2011-12-27

Applicant: Alexander J. BERGER ,  Terry BLUCK ,  Vinay SHAH ,  Judy HUANG ,  Karthik JANAKIRAMAN ,  Chau T. NGUYEN ,  Greg STUMBO

Inventor： Alexander J. BERGER ,  Terry BLUCK ,  Vinay SHAH ,  Judy HUANG ,  Karthik JANAKIRAMAN ,  Chau T. NGUYEN ,  Greg STUMBO

IPC: H01L31/18 ,  B05B15/00 ,  B05B1/00

CPC classification number: H01L31/1876 ,  B05D1/322 ,  B05D1/327 ,  C23C14/042 ,  C23C16/042 ,  Y02E10/50 ,  Y02P70/521

Abstract: Disclosed are methods and apparatus for masking of substrates for deposition, and subsequent lifting of the mask with deposited material. Masking materials are utilized that can be used in high temperatures and vacuum environment. The masking material has minimal outgassing once inside a vacuum chamber and withstand the temperatures during deposition process. The mask is inkjeted over the wafers and, after deposition, removed using agitation, such as ultrasonic agitation, or using laser burn off.

Abstract translation: 公开了用于掩蔽用于沉积的基底的方法和装置，以及随后用沉积材料提起掩模。 使用可在高温和真空环境中使用的遮蔽材料。 掩模材料一旦在真空室内就具有最小的除气，并能承受沉积过程中的温度。 将掩模喷涂在晶片上，并且在沉积之后，使用搅拌（例如超声波搅拌）或使用激光烧掉来除去掩模。

公开(公告)号：US20080305580A1

公开(公告)日：2008-12-11

申请号：US11759652

申请日：2007-06-07

Applicant: Alexander J. Berger ,  Sergey Savastiouk

Inventor： Alexander J. Berger ,  Sergey Savastiouk

IPC: H01L21/00 ,  B23K37/00

CPC classification number: H01L21/67092

Abstract: An expandable membrane (280), e.g. a membrane that is elastic and/or has a corrugated edge, is expanded to exert more uniform pressure over a semiconductor wafer (110) or a carrier (254) to bond the wafer to the carrier.

Abstract translation: 可膨胀膜（280），例如。 弹性和/或具有波纹边缘的膜被膨胀以在半导体晶片（110）或载体（254）上施加更均匀的压力，以将晶片粘合到载体上。

公开(公告)号：US20080271995A1

公开(公告)日：2008-11-06

申请号：US11744046

申请日：2007-05-03

Applicant: Sergey Savastiouk ,  Valentin Kosenko ,  Alexander J. Berger

Inventor： Sergey Savastiouk ,  Valentin Kosenko ,  Alexander J. Berger

IPC: C25D21/10 ,  C25D17/00 ,  C25D21/12

CPC classification number: C25D5/08 ,  C25D5/18 ,  C25D5/20 ,  C25D21/10 ,  C25D21/12 ,  H01L21/2885 ,  H01L21/76877 ,  H01L21/76898 ,  H05K3/421 ,  H05K3/423 ,  H05K2201/09563 ,  H05K2203/0285 ,  H05K2203/0292 ,  H05K2203/1492

Abstract: In a reverse pulse plating of a substrate (110), the electrolytic solution is agitated with a greater power on forward pulses (210) than on reverse pulses (220). An ultrasound agitation source (170) can be positioned at the bottom of the substrate (110) if the anode (134) is at the top. The ultrasound source may contact the substrate's bottom. Other features are also provided.

Abstract translation: 在基板（110）的反向脉冲电镀中，电解液以比反向脉冲（220）上的正向脉冲（210）更大的功率被搅动。 如果阳极（134）在顶部，超声搅拌源（170）可以位于基底（110）的底部。 超声波源可以接触基底的底部。 还提供其他功能。

公开(公告)号：US07144056B2

公开(公告)日：2006-12-05

申请号：US10397906

申请日：2003-03-25

Applicant: Sean A. Casarotti ,  Alexander J. Berger ,  Frank E. Kretz

Inventor： Sean A. Casarotti ,  Alexander J. Berger ,  Frank E. Kretz

IPC: B25J15/06 ,  B25J19/02

CPC classification number: H01L21/67259 ,  H01L21/6838 ,  Y10S294/907 ,  Y10S414/141

Abstract: An end-effector includes multiple vortex chucks for supporting a wafer. Vortex chucks are located along the periphery of the end-effector to help prevent a flexible wafer from curling. The end-effector has limiters to restrict the lateral movement of a supported wafer. In one example, the end-effector has a detector for detecting the presence of a wafer. The detector is mounted at a shallow angle to allow the end-effector to be positioned close to a wafer to be picked-up, thereby allowing detection of deformed wafers contained in a wafer cassette. The shallow angle of the detector also minimizes the thickness of the end-effector. Also disclosed is a wafer station with features similar to that of the end-effector.

Abstract translation: 末端执行器包括用于支撑晶片的多个涡流卡盘。 涡流卡盘位于末端执行器的周边，以帮助防止柔性晶片卷曲。 末端执行器具有限制器以限制支撑的晶片的横向移动。 在一个示例中，末端执行器具有用于检测晶片存在的检测器。 检测器以较小的角度安装，以使末端执行器靠近晶片定位以便被拾起，从而允许检测包含在晶片盒中的变形的晶片。 检测器的浅角度也使端部执行器的厚度最小化。 还公开了具有与末端执行器类似的特征的晶片台。

公开(公告)号：US07052229B2

公开(公告)日：2006-05-30

申请号：US10865328

申请日：2004-06-09

Applicant: Alexander J. Berger ,  Frank E. Kretz

Inventor： Alexander J. Berger ,  Frank E. Kretz

IPC: B65G49/07

CPC classification number: H01L21/68 ,  H01L21/681 ,  Y10S414/136 ,  Y10S414/141

Abstract: A wafer or some other article is aligned while being held by an end-effector.

Abstract translation: 晶片或一些其它制品在被末端执行器保持的同时对准。

公开(公告)号：US06665583B2

公开(公告)日：2003-12-16

申请号：US10265056

申请日：2002-10-04

Applicant: Frank E. Kretz ,  Alexander J. Berger ,  Sean A. Casarotti

Inventor： Frank E. Kretz ,  Alexander J. Berger ,  Sean A. Casarotti

IPC: G06F700

CPC classification number: H01L21/67271 ,  B25J13/087 ,  B25J19/02 ,  Y10S414/135 ,  Y10S414/141

Abstract: An article holder has sensors that detect whether an article held in the holder is a workpiece or a piece of packaging material. Examples are end effectors suitable for picking up semiconductor wafers and packaging material from a pod or some other carrier.

Abstract translation: 物品保持器具有检测保持在保持器中的物品是工件还是包装材料的传感器。 示例是适用于从荚或其他载体拾取半导体晶片和包装材料的端部执行器。

公开(公告)号：US20080302481A1

公开(公告)日：2008-12-11

申请号：US11759682

申请日：2007-06-07

Applicant: Alexander J. Berger ,  Michael A. Berger

Inventor： Alexander J. Berger ,  Michael A. Berger

IPC: B32B38/10

CPC classification number: B32B38/10 ,  B32B37/06 ,  B32B2309/72 ,  B32B2310/0806 ,  B32B2310/0831 ,  B32B2457/14 ,  C09J5/00 ,  C09J5/06 ,  C09J2203/326 ,  C09J2205/302 ,  C09J2205/31 ,  H01L21/67115 ,  H01L21/67132 ,  H01L21/6835 ,  H01L21/6836 ,  H01L21/68742 ,  H01L2221/68318 ,  H01L2221/68327 ,  Y10T156/1158 ,  Y10T156/19

Abstract: When heat or UV radiation is applied to an adhesive tape (130) which bonds a semiconductor wafer (110) to a carrier (120), the appropriate lift-off time for separating the wafer from the carrier is determined by monitoring the thickness (T or ΔT) of the wafer/tape/carrier sandwich. When the thickness or the thickness change has reached a predefined value or range of values, independently moveable driving members (510R) drive the wafer or the carrier with small forces at a plurality of spaced-apart locations along the periphery. As a result, the lift-off is initiated at the location of the weakest adhesion.

Abstract translation: 当将热或UV辐射施加到将半导体晶片（110）结合到载体（120）的粘合带（130）时，通过监测厚度（T）来确定用于从载体分离晶片的适当剥离时间 或DeltaT）的晶片/带/载体三明治。 当厚度或厚度变化已经达到预定值或值的范围时，可独立移动的驱动构件（510R）沿着周边沿着多个间隔开的位置以小的力驱动晶片或载体。 结果，剥离是在最弱粘附的位置开始的。

公开(公告)号：US06631935B1

公开(公告)日：2003-10-14

申请号：US09632236

申请日：2000-08-04

Applicant: Sean A. Casarotti ,  Alexander J. Berger ,  Frank E. Kretz

Inventor： Sean A. Casarotti ,  Alexander J. Berger ,  Frank E. Kretz

IPC: B25J1506

CPC classification number: H01L21/67259 ,  H01L21/6838 ,  Y10S294/907 ,  Y10S414/141

Abstract: An end-effector includes multiple vortex chucks for supporting a wafer. Vortex chucks are located along the periphery of the end-effector to help prevent a flexible wafer from curling. The end-effector has limiters to restrict the lateral movement of a supported wafer. In one example, the end-effector has a detector for detecting the presence of a wafer. The detector is mounted at a shallow angle to allow the end-effector to be positioned close to a wafer to be picked-up, thereby allowing detection of deformed wafers contained in a wafer cassette. The shallow angle of the detector also minimizes the thickness of the end-effector. Also disclosed is a wafer station with features similar to that of the end-effector.

Abstract translation: 末端执行器包括用于支撑晶片的多个涡流卡盘。 涡流卡盘位于末端执行器的周边，以帮助防止柔性晶片卷曲。 末端执行器具有限制器以限制支撑的晶片的横向移动。 在一个示例中，末端执行器具有用于检测晶片存在的检测器。 检测器以较小的角度安装，以使末端执行器靠近晶片定位以便被拾起，从而允许检测包含在晶片盒中的变形的晶片。 检测器的浅角度也使端部执行器的厚度最小化。 还公开了具有与末端执行器相似的特征的晶片站

公开(公告)号：US06948898B2

公开(公告)日：2005-09-27

申请号：US10272257

申请日：2002-10-15

Applicant: Alexander J. Berger ,  Frank E. Kretz

Inventor： Alexander J. Berger ,  Frank E. Kretz

IPC: H01L21/68 ,  B65G49/07

CPC classification number: H01L21/68 ,  H01L21/681 ,  Y10S414/136 ,  Y10S414/141

Abstract: A wafer or some other article is aligned while being held by an end-effector.

Abstract translation: 晶片或一些其它制品在被末端执行器保持的同时对准。